There’s a big future in small things. Nanotechnology is the new frontier of engineering, imagining new possibilities in manufacturing, fluid mechanics, robotics, combustion, biomedicine, measurements, heat transfer, and more. Purdue hosts the largest academic cleanroom in the world, the Birck Nanotechnology Center, where interdisciplinary teams have access to the absolute cutting-edge of nano-scale characterization (microscopy and measurements) and fabrication (deposition, etching, lithography, etc.) With these tools, mechanical engineers conduct world-class research in:
Predictive, multi-scale modeling and simulation of microstructure evolution in confined granular systems, with an emphasis in manufacturing processes and the relationship between product fabrication and performance.
Application areas of interest include:
(i) particulate products and processes (e.g., flow, mixing, segregation, consolidation, and compaction of powders),
(ii) continuous manufacturing (e.g., Quality by Design, model predictive control, and reduced order models), and
(iii) performance of pharmaceutical solid products (e.g., tensile strength, stiffness, swelling and disintegration), biomaterials (e.g., transport and feeding of corn stover) and energetic materials (e.g., deformation and heat generation under quasi-static, near-resonant and impact conditions, and formation and growth of hot spots) materials.
Computational and experimental solid mechanics focused on fatigue, fracture, and multi-physics phase evolution problems
Computational techniques including Finite Element Analysis (FEA), Isogeometric Analysis (IGA), geometric modeling, CAD and optimal design
Heterogeneous Integration and Advanced Electronics Packaging with a focus on thermomechanical behavior, reliability, and electrical-thermal-mechanical co-design
Addressing the process integration and reliability challenges for fine-pitch, high-density advanced semiconductor packaging techniques: Monolithic 3D Integration, Heterogeneous 2.5D interposer and 3D Integration, Microsystem integration, Fan-out packaging and Embedded packaging
Thermomechanical modeling and characterization of advanced devices and packages: chip package interactions, FEM modeling, and thermal stress metrology
"Smart-controlled cooling” with advanced manufacturing technologies using MEMS and 3D packaging: Active flow control for dynamic power profiles
Advanced heat sink design optimization and fabrication: Topology optimization and Additive manufacturing of the package level cooling system
Efficient thermal packaging materials: high thermal conductivity TIM (thermal interface materials), and underfill, efficient 3D bonding interface thermal materials