Micro and Nanotechnology
There’s a big future in small things. Nanotechnology is the new frontier of engineering, imagining new possibilities in manufacturing, fluid mechanics, robotics, combustion, biomedicine, measurements, heat transfer, and more. Purdue hosts the largest academic cleanroom in the world, the Birck Nanotechnology Center, where interdisciplinary teams have access to the absolute cutting-edge of nano-scale characterization (microscopy and measurements) and fabrication (deposition, etching, lithography, etc.) With these tools, mechanical engineers conduct world-class research in:
- Nanoscale manufacturing
- Micro- and nano-fluidics
- Biomolecular detection
- Nanoscale thermal transport
- Computational modeling
- Nanomechanical materials
Faculty in Micro & Nanotechnology
- Renewable Energy Materials (physics-based energy yield predictions, sustainable PV and energy storage materials, recycling)
- Electro-Optical-Thermo-Mechanical Reliability (in-situ and in-operando accelerated stress tests)
- Heterogeneous Integration & Advanced Packaging (sub-10 μm pitch interconnects, low-loss interposers)
- Harsh Environment Electronics Integration (high temperature Pb-free solders and nano-thermal interfaces)
- Laser-absorption spectroscopy, laser-induced fluorescence, & IR imaging sensors for gas temperature, pressure, velocity, and chemical species
- Molecular spectroscopy, photophysics, & energy transfer in gases
- Energetic materials (e.g., explosives & propellants) detection & combustion
- Combustion and propulsion systems (small and large scale)
- Biomedical sensing
- Predictive, multi-scale modeling and simulation of microstructure evolution in confined granular systems, with an emphasis in manufacturing processes and the relationship between product fabrication and performance.
- Application areas of interest include:
- (i) particulate products and processes (e.g., flow, mixing, segregation, consolidation, and compaction of powders),
- (ii) continuous manufacturing (e.g., Quality by Design, model predictive control, and reduced order models), and
- (iii) performance of pharmaceutical solid products (e.g., tensile strength, stiffness, swelling and disintegration), biomaterials (e.g., transport and feeding of corn stover) and energetic materials (e.g., deformation and heat generation under quasi-static, near-resonant and impact conditions, and formation and growth of hot spots) materials.
- Bio-inspired designs
- Surface engineering and multifunctional materials
- Convergent Manufacturing for Industry 5.0: hybrid manufacturing processes, heterogeneous materials, and bio-inspired designs
- Systems integration, productization, and production
- Heavy-duty machines: machining, lubrication, and corrosion
- Heterogeneous and hierarchical integration (mechanical-electrical-optical and nano-micro-meso-macro)
- Precision agricultural and food: cellular agriculture, vertical farming, micro-production, and resilience
- Frugal engineering, social innovations, and social equity
- Manufacturing in space
- Contact mechanics
- Stresses, fatigue and friction of rolling/sliding
- Micro-mechanics of boundary and mixed lubrication regimes
- Spall initiation and propagation
- Surface science and damage
- Dynamics of ball and rolling element bearings and rotating systems
- Friction induced vibration and squeal in dry contacts
- Friction and wear of dry and lubricated contacts
- Virtual tribology
- Dry and lubricated fretting wear
- MEMS for in-situ monitoring of tribological contacts
- Discrete element modeling
- Design
- Computational and experimental solid mechanics focused on fatigue, fracture, and multi-physics phase evolution problems
- Computational techniques including Finite Element Analysis (FEA), Isogeometric Analysis (IGA), geometric modeling, CAD and optimal design
- Heterogeneous Integration and Advanced Electronics Packaging with a focus on thermomechanical behavior, reliability, and electrical-thermal-mechanical co-design
- Discrete element method (DEM) modeling for particulate systems
- -- model development, e.g., fibrous particles, particle breakage, particle shapes
- -- application to manufacturing, e.g., storage and flow, blending, segregation, drying, coating, wet granulation
- Finite element method (FEM) modeling of powder compaction
- -- e.g., roll compaction, tableting, picking and sticking
- Multi-scale modeling (FEM combined with DEM) of powder dynamics
- -- model development and application to hopper flow, blending, and segregation
- Heat Transfer in Advanced Semiconductor Interconnects & Packaging
- Electronic Cooling & Efficient Thermal Packaging Materials
- Thermal/Mechanical Simulation & Characterization
- Materials, Processing & Architecture Development for Semiconductor Packaging
- MEMS Fabrication for Extreme Heat Flux Microfluidic Cooling
- Advanced Semiconductor Nanoscale 3D Interconnections
- Novel Photonics & Quantum Packaging Technologies
- Reliability Modeling & Characterization
- Advanced electronics cooling and packaging technologies
- Phase-change transport phenomena
- Additive manufacturing of thermal management components
- Topological optimization and machine-learning-based design
- Thermal systems analysis for electrification and energy efficiency
- Microscale and nanoscale surface engineering for enhanced thermal transport
- Image-based computational and experimental fluid dynamics for porous-media and biomedical flows
- Translational research integrating high-performance CFD, image-based and physics-informed machine-learning, and uncertainty quantification to address unmet clinical needs
- GPU-parallelized lattice Boltzmann method for DNS and LES of turbulence
- Micro-bubble coalescence and detachment in microfluidics
- Deformation, stress, plasticity, fracture
- Multiscale modeling, first-principles, molecular dynamics simulations, and finite element modeling
- In-situ experiments
- Mechanics of redox active materials - Li-ion batteries, Na-ion batteries, all-solid-state batteries
- Mechanics of polymeric materials - organic electrochromics, superelastic organic semiconductors