Heat & Mass Transfer
Heat & Mass Transfer impacts nearly every area of industry, which is why Purdue hosts numerous laboratories dedicated to studying, enhancing, and pioneering new methods of heat transfer and energy conversion. With this research, Purdue is answering the challenging questions:
- How will we cool the avionics of future spacecraft?
- What can make solar-powered energy more feasible?
- Where does heat transfer improve on engine or battery performance?
- How can nanomanufacturing create better electronics?
- Can thermal therapy create new treatments for disease?
"Gas stations" in zero gravity: Purdue experiment establishes foundational science for cryogenic fuel depots in space
Faculty in Heat & Mass Transfer
- Modeling, Experiments and Simulations of turbulent boundary layers: role of initial conditions and bio-inspired micro-surfaces on evolution of velocity/thermal fields.
- Importance of turbulence and complex topography on wind energy.
- Integration of renewable with water and thermal storage.
- Translational research focus on renewable energy & society
- Wall interaction (e.g., bio-inspired micro surfaces) in respiratory flows
- Big data in turbulence, renewable energy and biomedical engineering.
- Energy and social equality
- Computational and experimental solid mechanics focused on fatigue, fracture, and multi-physics phase evolution problems
- Computational techniques including Finite Element Analysis (FEA), Isogeometric Analysis (IGA), geometric modeling, CAD and optimal design
- Heterogeneous Integration and Advanced Electronics Packaging with a focus on thermomechanical behavior, reliability, and electrical-thermal-mechanical co-design
- Heat Transfer in Advanced Semiconductor Interconnects & Packaging
- Electronic Cooling & Efficient Thermal Packaging Materials
- Thermal/Mechanical Simulation & Characterization
- Materials, Processing & Architecture Development for Semiconductor Packaging
- MEMS Fabrication for Extreme Heat Flux Microfluidic Cooling
- Advanced Semiconductor Nanoscale 3D Interconnections
- Novel Photonics & Quantum Packaging Technologies
- Reliability Modeling & Characterization