Shubhra Bansal

Shubhra Bansal

Associate Professor of Mechanical Engineering and Materials Engineering

School of Mechanical Engineering
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088

Office: FLEX 3081D

Phone: 7654943298

Research Interests

  • Renewable Energy Materials (physics-based energy yield predictions, sustainable PV and energy storage materials, recycling)
  • Electro-Optical-Thermo-Mechanical Reliability (in-situ and in-operando accelerated stress tests)
  • Heterogeneous Integration & Advanced Packaging (sub-10 μm pitch interconnects, low-loss interposers)
  • Harsh Environment Electronics Integration (high temperature Pb-free solders and nano-thermal interfaces)

Awards and Recognitions

  • 2022 NASA Faculty Fellowship
  • 2021 NSF CAREER
  • 2020 UNLV Excellence in Teaching Award
  • 2014 DOE Technical Excellence Award
  • 2010 GE Patent Award, Six Sigma Black Belt
  • Multiple conference awards
  • PI and Co-PI on multiple DOE, NSF, DARPA, NASA winning proposals
  • 15+ patents awarded

Selected Publications

M. Jahandardoost, M. Nardone, T. M. Friedlmeier, C. Walkons, S. Bansal, "Heat- and Light-Soaking Behavior of RbF-Treated Cu(In,Ga)Se2 Solar Cells with Two Different Buffer Layers", J. Materials Research, 1-9, 2022.

J. V. Li, A. F. Halverson, O. V. Sulima, S. Bansal, J. M. Burst, T. M. Barnes, T. A. Gessert, D. H. Levi, "Effects of deep level, back contact, and absorber thickness on capacitance-voltage profiling of CdTe thin-film solar cells", Sol. Energy Mat. Sol. Cells, vol. 100, pp. 126, 2012.

H. Schoeller, S. Bansal, A Knobloch, D Shaddock, J Cho, "Effect of alloying elements on the creep behavior of high Pb-based solders", Materials Science and Engineering: A 528 (3), 1063-1070, 2011.

P. C. Millett, R. P. Selvam, S. Bansal, A. Saxena, "Atomistic simulation of grain boundary energetics - effects of dopants", Acta Mater., 2005, vol. 53, pp. 3671-3678.

R. Tummala, S. Bansal, P.M. Raj, "Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging", Journal of Electroceramics 13, 417-422, 2004.

S. Bansal, A. Saxena, R. R. Tummala, "Nanocrystalline copper and nickel as ultra high-density chip-to-package interconnections", 54th Electronic Components and Technology Conference Proceedings, pp. 1647-1651 Vol.2, 2004.