Justin A. Weibel

Justin Weibel

Professor of Mechanical Engineering

School of Mechanical Engineering
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088

Office: ME 2193

Phone: 7654944762

Research Interests

  • Advanced electronics cooling and packaging technologies
  • Phase-change transport phenomena
  • Additive manufacturing of thermal management components
  • Topological optimization and machine-learning-based design
  • Thermal systems analysis for electrification and energy efficiency
  • Microscale and nanoscale surface engineering for enhanced thermal transport


Director of the Cooling Technologies Research Center (CTRC), a graduated National Science Foundation Industry/University Cooperative Research Center that addresses pre-competitive, longer-term research and development issues in the area of high-performance heat removal from compact spaces. Dr. Weibel's research group explores methodologies for prediction and control of heat transport to enhance the performance and efficiency of thermal management technologies and energy transfer processes. He has been a key contributor to the development of transformative cooling technologies supported by the DARPA TGP (2008-2012), DARPA ICECool (2013-2017), NAVSEA NEEC (2016-2018), ONR NEPTUNE (2015-2021), SRC CHIRP (2019-), ARPA-E ASCEND (2021-), and ARPA-E COOLERCHIPS (2023-) programs, in addition to numerous sponsored research projects that transition these technologies to industry.

Awards and Recognitions

  • Fellow of the American Society of Mechanical Engineers (ASME), 2023.
  • Outstanding Faculty Mentor Award, 2022.
  • ITherm Executive Committee Member, 2022
  • ASME K-16 Outstanding Early Faculty Career in Thermal Management Award, 2021
  • Purdue University Seed for Success Award, SCALE for Microelectronics Workforce Development, 2020
  • ASME EPPD Young Engineer Award, 2020
  • Outstanding Engineering Teacher (ME511: Spring 2019, Fall 2020)
  • Purdue University Seed for Success Award, NEPTUNE Center for Power and Energy Research, 2016, 2018
  • Purdue University Seed for Success Award, MicroICE: An Interchip Approach, 2013
  • ASME Electronic & Photonic Packaging Division (EPPD) Student Member of the Year Award, 2011
  • Ingersoll-Rand Fellow for Graduate Studies, 2010
  • Helen and John Lozar Fellow for Graduate Studies, 2007-2009
  • Best Paper Award, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021
  • Best Paper of the Year Award, ASME JEP, 2020
  • Best Paper Award, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
  • Featured on Cover of Physical Review Letters, Vol. 120, 174501, 2018
  • ASME InterPACK/ICNMM Outstanding Paper Awards, 2013, 2015.
  • ASME InterPACK Nasser Grayeli Best Poster Awards, 2019, 2020, 2023.
  • ASME InterPACK/ICNMM Best Poster Award, 2015.
  • ICES Best Poster Award, 2017.
  • IEEE ITherm Avram Bar Cohen Best Paper Awards, 2016, 2023.
  • IEEE ITherm Best Paper Runner Up Awards, 2019, 2024.
  • IEEE ITherm Best Poster Awards, 2017, 2018, 2019, 2020, 2022, 2024.
  • IEEE ITherm Best Poster Runner Up Awards, 2017, 2021, 2022, 2023, 2024.
  • SEMI-THERM Best Paper Runner-Up and Best Student Paper, 2017.
  • SEMI-THERM Best Student Abstract, 2021.

Selected Publications

S. Ozguc, L. Pan, J.A. Weibel, An approach for topology optimization of heat sinks for two-phase flow boiling: Part 1 - model formulation and numerical implementation, Applied Thermal Engineering 249, p. 123337, 2024. https://doi.org/10.1016/j.applthermaleng.2024.123337

M. Bongarala, J.A. Weibel, and S.V. Garimella, A method to partition boiling heat transfer mechanisms using synchronous through-substrate high-speed visual and infrared measurements, International Journal of Heat and Mass Transfer 226, p. 125516, 2024. https://doi.org/10.1016/j.ijheatmasstransfer.2024.125516

N.T. Vu, Y. Huang, J.A. Weibel, High-speed visualization and infrared thermography of pool boiling on surfaces having differing dynamic wettability, International Journal of Heat and Mass Transfer 221, p. 125105, 2024. https://doi.org/10.1016/j.ijheatmasstransfer.2023.125105

H. Liu, J.A. Luta, S.D. Pekarek, and J.A. Weibel, Electromagnetic-thermal co-optimization to minimize case-to-winding temperature rise in permanent magnet machines, Applied Thermal Engineering 238, p. 122132, 2024. https://doi.org/10.1016/j.applthermaleng.2023.122132

S.S. Pai, J.A. Weibel, Neural net-based surrogate square pin fin correlations for thermal-fluid design optimization under developing flow conditions, Numerical Heat Transfer, Part B: Fundamentals, 1-18, 2023. https://doi.org/10.1080/10407790.2023.2267173

A. Gaitonde, A. Candadai, J.A. Weibel, A.M. Marconnet, A laser-based Angstrom method for in-plane thermal characterization of isotropic and anisotropic materials using infrared imaging, Review of Scientific Instruments 94, p. 074904, 2023. https://doi.org/10.1063/5.0149659

A.K. Penning, J.A. Weibel, Assessing the influence of glass properties on cabin solar heating and range of an electric vehicle using a comprehensive system model, Applied Energy 339, p. 120973, 2023. https://doi.org/10.1016/j.apenergy.2023.120973

K. Baraya, J.A. Weibel, S.V. Garimella, Wetting hysteresis as the mechanism of heat pipe post-dryout thermal hysteresis and recovery, International Journal of Heat and Mass Transfer 204, p. 123875, 2023. https://doi.org/10.1016/j.ijheatmasstransfer.2023.123875

M. Winter, J.A. Weibel, The capillary length scale determines the influence of bubble-fin interactions and prediction of pool boiling from heat sinks, International Journal of Heat and Mass Transfer 202, p. 123727, 2023. https://doi.org/10.1016/j.ijheatmasstransfer.2022.123727

M.E. Rahman and J. A. Weibel, Mapping the amplitude and frequency of pressure drop oscillations via a transient numerical model to assess their severity during microchannel flow boiling, International Journal of Heat and Mass Transfer 194, 123065, 2022. https://doi.org/10.1016/j.ijheatmasstransfer.2022.123065

A. Bar-Cohen, M. Asheghi, T. Chainer, S. V. Garimella, K. Goodson, C. Gorle, R. Mandel, J. Maurer, M. Ohadi, J. W. Palko, P. Parida, Y. Peles, J. Plawsky, M. Schultz, J. A. Weibel, and Y. Joshi, The ICECool Fundamentals effort on evaporative cooling of microelectronics, IEEE Transactions on Components Packaging and Manufacturing Technology 11, pp. 1546-1564, 2021. https://doi.org/10.1109/TCPMT.2021.3118755