Justin A. Weibel

Justin Weibel

Research Associate Professor

School of Mechanical Engineering
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088

Office: ME 1071

Degrees

  • Ph.D. Purdue University, '12
  • B.S. Purdue University, '07

Research Interests

  • Electronics cooling and packaging
  • Phase-change transport phenomena
  • Microscale and nanoscale surface engineering for enhanced thermal transport
  • Energy efficiency in thermal systems
  • Transport in porous materials
  • Microscale diagnostics and sensing

Biography

Director of the Cooling Technologies Research Center (CTRC), a graduated National Science Foundation Industry/University Cooperative Research Center that addresses pre-competitive, longer-term research and development issues in the area of high-performance heat removal from compact spaces.

Awards and Recognitions

  • Outstanding Paper Award (Emerging Technologies & Fundamentals Track), ITherm 2019.
  • Best Poster Award (Emerging Technologies & Fundamentals Track), ITherm 2019.
  • Editor's Pick in Applied Physics Letters, Vol. 113, 083703, 2018.
  • Best Poster Award (Component-Level Thermal Management Track), ITherm 2018.
  • Best Poster Award (Emerging Technologies Track), ITherm 2018.
  • Featured on Cover of Physical Review Letters, Vol. 120, 174501, 2018.
  • Purdue University Seed for Success Award, NEPTUNE Center for Power and Energy Research, 2018.
  • Best Poster Award, International Conference on Environmental Systems, 2017.
  • Best Poster Award (Thermal Management 1: Component Level Track), ITherm 2017.
  • Best Poster Award (Thermal Management 2: System Level Track), ITherm 2017.
  • Outstanding Poster Award (Emerging Technologies & Fundamentals Track), ITherm 2017.
  • Best Paper Award Runner-Up, Best Student Paper (P.K. Mulay Memorial Scholarship), and Best Student Paper, SEMI-THERM 33rd Annual Symposium and Exhibit, 2017.
  • Purdue University Seed for Success Award, NEPTUNE Center for Power and Energy Research, 2016.
  • Best Paper Award (Emerging Technologies Track), ITherm 2016.
  • Outstanding Paper Award, InterPACK/ICNMM 2015
  • Best Poster Award (Fundamental Thermal and Fluid Transport Track), InterPACK/ICNMM 2015.
  • Featured on Cover of Advanced Materials Interfaces, Vol. 2, 1400480, 2015.
  • Bravo Award, College of Engineering, Purdue University, 2014.
  • Purdue University Seed for Success Award, Microcooling for Intensely Concentrated Electronics (MicroICE): An Interchip Approach, 2013.
  • Outstanding Paper Award (Thermal Track), InterPACK, 2013
  • ASME Electronic & Photonic Packaging Division (EPPD) Student Member of the Year Award, 2011.
  • Ingersoll-Rand Fellow for Graduate Studies, 2010.
  • Helen and John Lozar Fellow for Graduate Studies, 2007-2009.

Ten Select Publications

S. Sudhakar, J. A. Weibel, F. Zhou, E.M. Dede, and S. V. Garimella, Area-scalable high-heat-flux dissipation at low thermal resistance using a capillary-fed two-layer evaporator wick, International Journal of Heat and Mass Transfer 135, pp. 1346-1356, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2019.02.075

I. L. Collins, J. A. Weibel, L. Pan, and S. V. Garimella, A permeable-membrane microchannel heat sink made by additive manufacturing, International Journal of Heat and Mass Transfer 131, pp. 1174-1183, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2018.11.126

J. Cui, J. Wang, J.A. Weibel, L. Pan, A compliant microstructured thermal interface material for dry and pluggable interfaces, International Journal of Heat and Mass Transfer 131, pp. 1075-1082, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2018.11.074

J.E. Castillo and J.A. Weibel, Predicting the growth of many droplets during vapor-diffusion-driven dropwise condensation experiments using the point sink superposition method, International Journal of Heat and Mass Transfer 133, pp. 641-651, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2018.12.068

T. P. Allred, J.A. Weibel, and S.V. Garimella, Enabling highly effective boiling from superhydrophobic surfaces, Physical Review Letters 120, 174501, 2018. (Featured on Cover; Volume 120, Issue 17) https://doi.org/10.1103/PhysRevLett.120.174501

K. P. Drummond, D. Back, M. D. Sinanis, D. B. Janes, and D. Peroulis, J. A. Weibel, and S. V. Garimella, Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions, International Journal of Heat and Mass Transfer 126A, pp. 1289-1301, 2018. https://doi.org/10.1016/j.ijheatmasstransfer.2018.05.127

T. Van Oevelen, J.A. Weibel, and S.V. Garimella, The effect of lateral thermal coupling between parallel microchannels on two-phase flow distribution, International Journal of Heat and Mass Transfer 124, pp. 769-781, 2018. https://doi.org/10.1016/j.ijheatmasstransfer.2018.03.073

G. Patankar, J.A. Weibel, and S.V. Garimella, A validated time-stepping analytical model for 3D transient vapor chamber transport, International Journal of Heat and Mass Transfer 119, pp. 867-879, 2018. https://doi.org/10.1016/j.ijheatmasstransfer.2017.11.135

H. Liu, J.A. Weibel, and E.A. Groll, Performance analysis of an updraft tower system for dry cooling in large-scale power plants, Energies 10 (1), p. 1802, 2017. https://doi.org/10.3390/en10111812

S. V. Garimella, T. Persoons, J. A. Weibel, V. Gektin, Electronics thermal management in information and communications technologies: challenges and future directions, IEEE Transactions on Components Packaging and Manufacturing Technology 7, pp. 1191-1205, 2017. (Special Topics: Data Center Cooling) https://doi.org/10.1109/TCPMT.2016.2603600