Advanced Materials
The advanced materials research area is a focused multidisciplinary area focused on material synthesis, characterization and theory. Topics in this research area range from the development of material systems used sensors, metamaterials, hierarchal materials, nanomaterials, nanocomposites, thermoelectric materials, polymers, to composite materials. It also encompasses various methods such as additive manufacturing needed to realize these new material concepts.
Faculty in Advanced Materials
- Renewable Energy Materials (physics-based energy yield predictions, sustainable PV and energy storage materials, recycling)
- Electro-Optical-Thermo-Mechanical Reliability (in-situ and in-operando accelerated stress tests)
- Heterogeneous Integration & Advanced Packaging (sub-10 μm pitch interconnects, low-loss interposers)
- Harsh Environment Electronics Integration (high temperature Pb-free solders and nano-thermal interfaces)
- Bio-inspired designs
- Surface engineering and multifunctional materials
- Convergent Manufacturing for Industry 5.0: hybrid manufacturing processes, heterogeneous materials, and bio-inspired designs
- Systems integration, productization, and production
- Heavy-duty machines: machining, lubrication, and corrosion
- Heterogeneous and hierarchical integration (mechanical-electrical-optical and nano-micro-meso-macro)
- Precision agricultural and food: cellular agriculture, vertical farming, micro-production, and resilience
- Frugal engineering, social innovations, and social equity
- Manufacturing in space
- Computational and experimental solid mechanics focused on fatigue, fracture, and multi-physics phase evolution problems
- Computational techniques including Finite Element Analysis (FEA), Isogeometric Analysis (IGA), geometric modeling, CAD and optimal design
- Heterogeneous Integration and Advanced Electronics Packaging with a focus on thermomechanical behavior, reliability, and electrical-thermal-mechanical co-design
- Heat Transfer in Advanced Semiconductor Interconnects & Packaging
- Electronic Cooling & Efficient Thermal Packaging Materials
- Thermal/Mechanical Simulation & Characterization
- Materials, Processing & Architecture Development for Semiconductor Packaging
- MEMS Fabrication for Extreme Heat Flux Microfluidic Cooling
- Advanced Semiconductor Nanoscale 3D Interconnections
- Novel Photonics & Quantum Packaging Technologies
- Reliability Modeling & Characterization
- Deformation, stress, plasticity, fracture
- Multiscale modeling, first-principles, molecular dynamics simulations, and finite element modeling
- In-situ experiments
- Mechanics of redox active materials - Li-ion batteries, Na-ion batteries, all-solid-state batteries
- Mechanics of polymeric materials - organic electrochromics, superelastic organic semiconductors