The agreement will provide a variety of collaborative educational opportunities for students in microelectronics and will explore ways to attract more talent to this area.

Purdue is part of the SRC led team that has been selected by NIST to define the future technology goals of the microelectronics and advanced packaging technology (MAPT) industry.

Purdue leads flagship national DoD microelectronics education & workforce development program for students interested in radiation-hardening, heterogeneous integration/advanced packaging, and system on a chip.

C-BRIC JUMP delivers key advances in cognitive computing to enable a new generation of autonomous intelligent systems such as self-flying drones and interactive personal robots.

Purdue's EVP Chiang makes a strong case in Forbes that the U.S. federal and state support to semiconductors is not about industrial policy, but national security, economic security, and job security.

Purdue tackles Microelectronics and Advanced Packaging Workforce Development.