Justin A. Weibel

Justin Weibel

Professor of Mechanical Engineering

School of Mechanical Engineering
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088

Office: ME 2193

Phone: 7654944762


  • Ph.D. Purdue University, '12
  • B.S. Purdue University, '07

Research Interests

  • Electronics cooling and packaging
  • Phase-change transport phenomena
  • Microscale and nanoscale surface engineering for enhanced thermal transport
  • Energy efficiency in thermal systems
  • Transport in porous materials
  • Microscale diagnostics and sensing


Director of the Cooling Technologies Research Center (CTRC), a graduated National Science Foundation Industry/University Cooperative Research Center that addresses pre-competitive, longer-term research and development issues in the area of high-performance heat removal from compact spaces.

Awards and Recognitions

  • ITherm Executive Committee Member, 2021
  • ASME K-16 Outstanding Early Faculty Career in Thermal Management Award, 2021
  • Outstanding Engineering Teacher (ME511: Spring 2019, Fall 2020)
  • Purdue University Seed for Success Award, SCALE for Microelectronics Workforce Development, 2020
  • ASME EPPD Young Engineer Award, 2020
  • Best Paper Award, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
  • Featured on Cover of Physical Review Letters, Vol. 120, 174501, 2018
  • Purdue University Seed for Success Award, NEPTUNE Center for Power and Energy Research, 2016, 2018
  • Purdue University Seed for Success Award, MicroICE: An Interchip Approach, 2013
  • ASME Electronic & Photonic Packaging Division (EPPD) Student Member of the Year Award, 2011
  • Ingersoll-Rand Fellow for Graduate Studies, 2010
  • Helen and John Lozar Fellow for Graduate Studies, 2007-2009
  • ASME InterPACK/ICNMM Outstanding Paper Awards, 2013, 2015.
  • ASME InterPACK Nasser Grayeli Best Poster Awards, 2019, 2020.
  • ASME InterPACK/ICNMM Best Poster Award, 2015.
  • ICES Best Poster Award, 2017.
  • IEEE ITherm Best Paper Award, 2016
  • IEEE ITherm Outstanding Paper Award, 2019.
  • IEEE ITherm Best Poster Awards, 2017, 2018, 2019, 2020.
  • IEEE ITherm Outstanding Poster Awards, 2017, 2021.
  • SEMI-THERM Best Paper Runner-Up and Best Student Paper, 2017.

Selected Publications

S. Ozguc, L. Pan, and J.A. Weibel, Topology optimization of microchannel heat sinks using a homogenization approach, International Journal of Heat and Mass Transfer 169, 120896, 2021. https://doi.org/10.1016/j.ijheatmasstransfer.2020.120896

A. A. Candadai, J.A. Weibel, A.M. Marconnet, Thermal conductivity of ultrahigh molecular weight polyethylene: from fibers to fabrics, Applied Polymer Materials 2, pp. 437-447, 2020. https://doi.org/10.1021/acsapm.9b00900

D. Back, K. P. Drummond, M. D. Sinanis, J. A. Weibel, S. V. Garimella, D. Peroulis, and D. B. Janes, Design, fabrication, and characterization of a compact hierarchical manifold microchannel heat sink array for two-phase cooling, IEEE Transactions on Components Packaging and Manufacturing Technology 9, pp. 1291-1300, 2019. https://doi.org/10.1109/TCPMT.2019.2899648

S. Sudhakar, J. A. Weibel, F. Zhou, E.M. Dede, and S. V. Garimella, Area-scalable high-heat-flux dissipation at low thermal resistance using a capillary-fed two-layer evaporator wick, International Journal of Heat and Mass Transfer 135, pp. 1346-1356, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2019.02.075

I. L. Collins, J. A. Weibel, L. Pan, and S. V. Garimella, A permeable-membrane microchannel heat sink made by additive manufacturing, International Journal of Heat and Mass Transfer 131, pp. 1174-1183, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2018.11.126

J. Cui, J. Wang, J.A. Weibel, L. Pan, A compliant microstructured thermal interface material for dry and pluggable interfaces, International Journal of Heat and Mass Transfer 131, pp. 1075-1082, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2018.11.074

J. E. Castillo and J.A. Weibel, Predicting the growth of many droplets during vapor-diffusion-driven dropwise condensation experiments using the point sink superposition method, International Journal of Heat and Mass Transfer 133, pp. 641-651, 2019. https://doi.org/10.1016/j.ijheatmasstransfer.2018.12.068

T. P. Allred, J.A. Weibel, and S.V. Garimella, Enabling highly effective boiling from superhydrophobic surfaces, Physical Review Letters 120, 174501, 2018. (Featured on Cover; Volume 120, Issue 17) https://doi.org/10.1103/PhysRevLett.120.174501

T. Van Oevelen, J.A. Weibel, and S.V. Garimella, The effect of lateral thermal coupling between parallel microchannels on two-phase flow distribution, International Journal of Heat and Mass Transfer 124, pp. 769-781, 2018. https://doi.org/10.1016/j.ijheatmasstransfer.2018.03.073

G. Patankar, J.A. Weibel, and S.V. Garimella, A validated time-stepping analytical model for 3D transient vapor chamber transport, International Journal of Heat and Mass Transfer 119, pp. 867-879, 2018. https://doi.org/10.1016/j.ijheatmasstransfer.2017.11.135