Justin A. Weibel
Research Associate Professor
585 Purdue Mall
West Lafayette, IN 47907-2088
Office: ME 1071
- Ph.D. Purdue University, '12
- B.S. Purdue University, '07
- Electronics cooling and packaging
- Phase-change transport phenomena
- Microscale and nanoscale surface engineering for enhanced thermal transport
- Multiphase and psychrometric thermal systems
- Transport in porous materials
- Microscale diagnostics and sensing
Awards and Recognitions
- Best Poster Award, International Conference on Environmental Systems, 2017.
- Best Poster Award (Thermal Management 1: Component Level Track), ITherm 2017.
- Best Poster Award (Thermal Management 2: System Level Track), ITherm 2017.
- Outstanding Poster Award (Emerging Technologies & Fundamentals Track), ITherm 2017.
- Best Paper Award Runner-Up, Best Student Paper (P.K. Mulay Memorial Scholarship), and Best Student Paper, SEMI-THERM 33rd Annual Symposium and Exhibit, 2017.
- Purdue University Seed for Success Award, NEPTUNE Center for Power and Energy Research, 2016.
- Best Paper Award (Emerging Technologies Track), ITherm 2016.
- Outstanding Paper Award, InterPACK/ICNMM 2015
- Best Poster Award (Fundamental Thermal and Fluid Transport Track), InterPACK/ICNMM 2015.
- Bravo Award, College of Engineering, Purdue University, 2014.
- Purdue University Seed for Success Award, Microcooling for Intensely Concentrated Electronics (MicroICE): An Interchip Approach, 2013.
- Outstanding Paper Award (Thermal Track), InterPACK, 2013
- ASME Electronic & Photonic Packaging Division (EPPD) Student Member of the Year Award, 2011.
- Ingersoll-Rand Fellow for Graduate Studies, 2010.
- Helen and John Lozar Fellow for Graduate Studies, 2007-2009.
Ten Select Publications
J. A. Weibel and S. V. Garimella, Recent advances in vapor chamber transport characterization for high heat flux applications, Adv Heat Transfer 45: 209-301, 2013.
G. Patankar, S. Mancin, J. A. Weibel, M. A. MacDonald, and S. V. Garimella, A method for thermal performance characterization of ultra-thin vapor chambers cooled by natural convection, ASME J Electron Packag, in press. (invited; ASME InterPACK/ICNMM Outstanding Paper Award recipient)
J.A. Weibel, S.V. Garimella, and M.T. North, Characterization of evaporation and boiling from sintered powder wicks fed by capillary action, Int J Heat Mass Transfer 53: 4204-4215, 2010. (highlighted as one of the most cited papers in IJHMT since 2010)
R.S. Patel, J.A. Weibel, and S.V. Garimella, Characterization of liquid film thickness in slug-regime microchannel flow, International Journal of Heat and Mass Transfer 115 Part A, pp. 1137-1143, 2017.
K. K. Bodla, J. A. Weibel and S. V. Garimella, Advances in fluid and thermal transport property analysis and design of sintered porous wick microstructures, J Heat Transfer 135:061202, 2013. (invited; special issue: 75th anniversary celebration of the heat transfer division)
Z. Pan, J.A. Weibel, and S.V. Garimella, A saturated-interface-volume phase change model for simulating flow boiling, Int J Heat Mass Transfer 93, pp. 945-956, 2016.
Z. Pan, J. A. Weibel, and S.V. Garimella, Influence of surface wettability on transport mechanisms governing water droplet evaporation, Langmuir 30:9726-9730, 2014.
X. Chen, J.A. Weibel, and S.V. Garimella, Exploiting microscale roughness on hierarchical superhydrophobic copper surfaces for enhanced dropwise condensation, Adv Mater Interfaces 2:1400480, 2015. (selected to appear as inside cover article)
S. Sarangi, J. A. Weibel, and S. V. Garimella, Quantitative evaluation of the dependence of pool boiling heat transfer enhancement on sintered-particle coating characteristics, Journal of Heat Transfer, 139, p. 021502, 2016.
S. V. Garimella, T. Persoons, J. A. Weibel, and L. T. Yeh, Technological drivers in telecom systems and data centers: multiscale thermal, electrical and energy management, Appl Energy 107:66-80, 2013.