The paper, “Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array,” is the result of work from a DARPA project in collaboration with Dimitri Peroulis and David Janes, and their staff and students in ECE, and was presented at the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

At that same conference, one of his collaborators -- Suresh Garimella -- was honored with ITherm's Achievement Award for 2016.

“Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array,” by K. P. Drummond, J. A. Weibel, S. V. Garimella, D. Back, D. B. Janes, M. D. Sinanis, and D. Peroulis, at the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas, NV, USA, May 31- Jun 3, 2016.