Professor and Associate Head for Graduate Studies
585 Purdue Mall
West Lafayette, IN 47907-2088
- B.Tech. Indian Inst. of Tech., '85
- M.S. Cornell University, '89
- Ph.D. Cornell University, '91
- Computational solid mechanics
- Computational geometry
- Microelectronics reliability
Awards and Recognitions
Ten Select Publications
N. Bajaj, G. Subbarayan and S. Garimella, "Topological Design of Channels for Squeeze Flow Optimization of Thermal Interface Materials." International Journal of Heat and Mass Transfer, vol. 55, pp. 3360-3575, 2012.
D. Chan, G. Subbarayan, and L. Nguyen. "Maximum Entropy Principle for Modeling Damage and Fracture in Solder Joints: Enabling Life Predictions under Microstructural Uncertainty," Journal of Electronic Materials, vol. 41, no. 2, pp. 398-411, 2012.
S. Goyal, K. Srinivasan, G. Subbarayan and T. Siegmund "On Instability-Induced Debond Initiation in Thin Film Systems," Engineering Fracture Mechanics, vol. 77, pp. 1298-1313, 2010.
V. Srinivasan, S. Radhakrishnan and G. Subbarayan, "Coordinated Synthesis of Hierarchical Engineering Systems," Computer Methods in Applied Mechanics and Engineering, vol. 199, pp. 392-404, 2010.
K. Srinivasan, S. Goyal, T. Siegmund, G. Subbarayan and Q. Lin, "Thermally-Induced Wrinkling in Thin-Film Stacks on Patterned Substrates," IBM Journal of Research and Development, vol. 53, no. 3, pp. 12:1-12:10, 2009.
S. Kanuparthi, M. Rayasam, G. Subbarayan, B.G. Sammakia, A. Gowda, and S. Tonapi,. "Hierarchical Compositions for Simulations of Near-Percolation Thermal Transport in Particulate Materials." Computer Methods in Applied Mechanics and Engineering, vol. 198, pp. 657-668, 2009.
S. Mahajan, G. Subbarayan and B.G. Sammakia, "Estimating Thermal Conductivity of Amorphous Silica Nano-Particles and Nano-Wires using Molecular Dynamics Simulations," Physical Review E, 76, 056701, 2007.
M. Rayasam, V. Srinivasan, and G. Subbarayan. "CAD Inspired Hierarchical Partition of Unity Constructions for NURBS-based Meshless Design, Analysis and Optimization." International Journal for Numerical Methods in Engineering, vol. 72, pp. 1452-1489, 2007.
Y. Luo and G. Subbarayan. "A Study of Multiple Singularities in Multi-Material Wedges and their Use in Analysis of Microelectronic Interconnect Structures." Engineering Fracture Mechanics, vol. 74, no. 3, pp. 416-430, 2007.