Center for Heterogeneous Integration Research in Packaging

Semiconductor Research Corporation
NXP Semiconductors
Samsung Electronics
Texas Instruments
Purdue University
Binghamton University


As transistor integration on a chip (Moore's law) slows down, integrating separately fabricated chips to build complex systems in a package will be increasingly essential to technologies ranging from cell phones to mainframe computers to automobiles in the coming decades. As device scaling continues into the sub-10-nm range, it is becoming increasingly difficult as we approach various fundamental limits. The ability to achieve "more than Moore" functionality by heterogeneously packaging advanced microchips to achieve higher performance and lower cost, provides attractive differentiation for electronic products. The Center for Heterogenous Integration Research in Packaging (CHIRP) has been created to address critical roadblocks to realize these potentials. It began on January 1, 2019 and combines the strengths of Purdue University and SUNY Binghamton, both of which have had significant contributions in this field and a history of collaboration that stretches back nearly two decades.

Intel Ponte Vecchio

Intel Foveros




Ganesh Subbarayan
Professor of Mechanical Engineering

Computational solid mechanics
Computational geometry
Microelectronics reliability
Bahgat Sammakia
Distinguished Professor of Mechanical Engineering

Heat Transfer and Electronics Packaging
Thermal Management of Data Centers
Heterogeneous Integration Research

Principal Investigators

Muhammad Alam
Jai N. Gupta Professor of Electrical and Computer Engineering

Physics of electronic, optoelectronic, and bioelectronic devices
Transport in inhomogeneous systems
Reliability limits of CMOS devices
Peter Borgesen
Professor of Systems Science and Industrial Engineering

Manufacturing processes and reliability
Electronics packaging and flexible hybrid electronics reliability
Cross-disciplinary experimental research (materials science, mechanics, industrial engineering)
Paul Chiarot
Associate Professor of Mechanical Engineering

Multiphase Flows
Leila Choobineh
Assistant Professor of Mechanical Engineering

Additively manufactured heat sinks for liquid cooling of high power electronics
Phase Change Material composite for transient thermal mitigation of electronics
Optimal thermal management through vertically stacked three-dimensional integrated circuits by using machine learning (ML) and genetic algorithms
Pritam Das
Assistant Professor of Electrical and Computer Engineering

Reliable and high efficiency high-power LED drives for smart commercial lighting
Wide-band gap devices-based power converters for E-actuation in more electric aircraft
Energy storage in smart grid
Chelsea Davis
Assistant Professor of Materials Engineering

Molecular visualization of interfacial mechanics
Nikolay Dimitrov
Professor of Chemistry

Materials Science
Kanad Ghose
Distinguished Professor of Computer Science

Computer architecture and parallel processing
Power-aware systems
High-performance computing and communication systems
Carol Handwerker
Reinhardt Schuhmann Jr. Professor of Materials Engineering

Design of microstructures in polycrystalline materials and thin films by control of interface properties
Single crystal nanowires nucleating using the VLS (vapor-liquid-solid) method
Lead-free solder interconnects on printed circuit boards
Marisol Koslowski
Professor of Mechanical Engineering

Computational solid mechanics
Multiscale modeling of materials
Reliability of electronic interconnects
Amy Marconnet
Associate Professor of Mechanical Engineering

Transport Phenomena in Multi-Scale, Heterogeneous Materials & Systems
Fundamentals of Nanoscale Thermal Transport
Electronics Cooling and Thermal Management
Liang Pan
Associate Professor of Mechanical Engineering

Scalable nanomanufacturing: lithography and imaging
Optical and magnetic data storage
Nanoscale energy conversion, transfer and storage for alternative energy
Scott Schiffres
Assistant Professor of Mechanical Engineering

Nanoscale and microscale energy transport
Thermal properties of nanomaterials
Sustainability engineering
Shreyas Sen
Elmore Associate Professor of Electrical and Computer Engineering

Sensing and Communication Circuits/Systems
Energy-harvested Sensor nodes for Internet of Things
Human body-coupled Communication
Justin Weibel
Associate Professor of Mechanical Engineering

Electronics cooling and packaging
Phase-change transport phenomena
Microscale and nanoscale surface engineering for enhanced thermal transport
Xinghang Zhang
Professor of Materials Engineering

Synthesis of nanomaterials
Radiation Damage in nanostructured materials
Mechanical behavior of nanostructured metals



The MAPT Roadmap - A Plan to Revitalize the Semiconductor Industry for Decades to Come

November 1, 2023
Materials Engineering and Environmental and Ecological Engineering's Carol Handwerker was vice chair of the Workforce Development chapter and Mechanical Engineering's Ganesh Subbarayan was vice chair of the Advanced Packaging and Heterogeneous Integration chapter for the first industry-wide 3D semiconductor roadmap to guide the microelectronics revolution.

Purdue signs a series of landmark agreements for semiconductors

June 6, 2023
Purdue University continues to be the world leader in creating vital partnerships in semiconductors. Appearing at the recent G7 Summit, President Mung Chiang has announced a string of international agreements with Japan, Greece, India, Belgium, and Taiwan.

Purdue excels at ITherm conference

June 5, 2023
Purdue was well-represented at ITherm 2023, winning three paper awards and four poster awards. The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems was held in Orlando, FL in June 2023.

Creating the computer chips of the future

April 3, 2023
Ganesh Subbarayan is the James G. Dwyer professor of mechanical engineering at Purdue University. In this video, he explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost effective. Subbarayan says that chip packaging provides functionality of a system when you connect multiple chips together. Advanced packaging is when multiple smaller chips, or “chiplets” come together and function as a single chip. In the past, chips were able to be produced every two years with double the amount of transistors while still maintaining their size and cost. Subbarayan says that this concept, known as Moore’s Law, no longer holds true. Advanced packaging is a solution to this problem, allowing multiple chips to act as a single chip to achieve the desired performance, power, and cost. Purdue is working with some of the largest semiconductor companies in the world to advance the chip packaging field.

Contact Us

Contact Ganesh Subbarayan for information about the Center for Heterogenous Integration Research in Packaging (CHIRP).