The Best Paper award went to Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model, Authors: Pavan Kumar Vaitheeswaran and Ganesh Subbarayan, Purdue University.

The #2 award for Outstanding Paper went to Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips, Authors: David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua, Purdue University.

Organized by the American Society of Mechanical Engineers (ASME), InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. The 2017 InterPACK was held in San Francisco.