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Purdue papers go 1-2 at InterPACK

Purdue papers have won two top awards at InterPACK, the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

The Best Paper award went to Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model, Authors: Pavan Kumar Vaitheeswaran and Ganesh Subbarayan, Purdue University.

The #2 award for Outstanding Paper went to Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips, Authors: David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua, Purdue University.

Organized by the American Society of Mechanical Engineers (ASME), InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. The 2017 InterPACK was held in San Francisco.