Justin A. Weibel
Professor of Mechanical Engineering
Location: West Lafayette
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088
Office: ME 3174
Research Interests
- Advanced electronics cooling and packaging technologies
- Phase-change transport phenomena
- Additive manufacturing of thermal management components
- Topological optimization and machine-learning-based design
- Thermal systems analysis for electrification and energy efficiency
- Microscale and nanoscale surface engineering for enhanced thermal transport
Fundamental Research Area(s)
Biography
Awards and Recognitions
- University Faculty Scholar, Purdue University, 2025.
- ASME K-16 Clock Award, 2024
- Purdue University Seed for Success Award, Confined Direct Two-Phase Jet Impingement Cooling with Topology Optimized Surface Engineering and Phase Separation using Additive Manufacturing, 2024
- Outstanding Engineering Teacher (ME511: Spring 2019; Fall 2020; Fall 2022, Fall 2024)
- Fellow of the American Society of Mechanical Engineers (ASME), 2023.
- Outstanding Engineering Teacher (ME315: Fall 2021; Spring 2022; Fall 2023)
- Outstanding Faculty Mentor Award, 2022.
- ITherm Executive Committee Member, 2022
- ASME K-16 Outstanding Early Faculty Career in Thermal Management Award, 2021
- Purdue University Seed for Success Award, SCALE for Microelectronics Workforce Development, 2020
- ASME EPPD Young Engineer Award, 2020
- Outstanding Engineering Teacher (ME511: Spring 2019, Fall 2020)
- Purdue University Seed for Success Award, NEPTUNE Center for Power and Energy Research, 2016, 2018
- Purdue University Seed for Success Award, MicroICE: An Interchip Approach, 2013
- ASME Electronic & Photonic Packaging Division (EPPD) Student Member of the Year Award, 2011
- Ingersoll-Rand Fellow for Graduate Studies, 2010
- Helen and John Lozar Fellow for Graduate Studies, 2007-2009
- Best Paper Award, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021
- Best Paper of the Year Award, ASME JEP, 2020
- Best Paper Award, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
- Featured on Cover of Physical Review Letters, Vol. 120, 174501, 2018
- ASME MNHMT Best Presentation Award, 2024.
- ASME InterPACK/ICNMM Outstanding Paper Awards, 2013, 2015.
- ASME InterPACK Nasser Grayeli Best Poster Awards, 2019, 2020, 2023.
- ASME InterPACK/ICNMM Best Poster Award, 2015.
- ICES Best Poster Award, 2017.
- IEEE ITherm Avram Bar Cohen Best Paper Awards, 2016, 2023.
- IEEE ITherm Best Paper Runner Up Awards, 2019, 2024.
- IEEE ITherm Best Poster Awards, 2017, 2018, 2019, 2020, 2022, 2024.
- IEEE ITherm Best Poster Runner Up Awards, 2017, 2021, 2022, 2023, 2024.
- SEMI-THERM Best Paper Runner-Up and Best Student Paper, 2017.
- SEMI-THERM Best Student Abstract, 2021.
Selected Publications
R. Regan, K. Saviers, W. Zhao, A. Kuczek, J. Tangudu, and J.A. Weibel, Embedded two-phase cooling in an additively manufactured stator prototype for a novel high-power-density electric motor concept, Applied Thermal Engineering 276, 126918, 2025. https://doi.org/10.1016/j.applthermaleng.2025.126918
K. Baraya, J.A. Weibel, and S.V. Garimella, A transient heat pipe model considering wick saturation effects that predicts dynamic evaporator dryout and recovery, International Journal of Heat and Mass Transfer 242, 126837, 2025. https://doi.org/10.1016/j.ijheatmasstransfer.2025.126837
A. Banthiya, B. Navaresse, L. Pan, and J.A. Weibel, Simultaneous topology optimization of two hydraulically interconnected porous flow layers in cold plates, International Journal of Heat and Mass Transfer 241, 126671, 2025. https://doi.org/10.1016/j.ijheatmasstransfer.2025.126671
A.U. Gaitonde, J.A. Weibel, A.M. Marconnet, Thermal metrology for deeply buried low-thermal-resistance interfaces, International Journal of Heat and Mass Transfer 241, 126591, 2025. https://doi.org/10.1016/j.ijheatmasstransfer.2024.126591
Y. Huang, B. Sarma, and J.A. Weibel, A predictive model for fin array boiling heat transfer performance under two-phase immersion cooling, International Journal of Heat and Mass Transfer 239, 126513, 2025. https://doi.org/10.1016/j.ijheatmasstransfer.2024.126513
S.S. Pai, B. Navaresse, J.A. Weibel, Data generation and training of surrogate models for friction factor and Nusselt number in low Reynolds number flows through pin fin geometries, Journal of Heat Transfer 147(2), 021502, 2025. https://doi.org/10.1115/1.4066970
J. Yu, Z. Pan, J.A. Weibel, Transition of buoyancy-driven flow from an axisymmetric to non-axisymmetric vortex inside an evaporating sessile droplet, Journal of Fluid Mechanics 997, A47, 2024. https://doi.org/10.1017/jfm.2024.628
T.P. Stamps and J.A. Weibel, The shoulder effect in the stagnation zone for temperature-controlled jet impingement transition boiling of submerged dielectric fluid, International Journal of Heat and Mass Transfer 233, 126013, 2024. https://doi.org/10.1016/j.ijheatmasstransfer.2024.126013
Q. Qian, X. Zhang, S. Tian, B. Yao, J.A. Weibel, and L. Pan, Silicon-based microscale-oscillating heat pipes for high power and high flux operation, Applied Physics Letters 124, 024106, 2024. https://doi.org/10.1063/5.0216530
M.E. Rahman and J. A. Weibel, The mechanism by which thermal coupling leads to an asymptotic maldistribution stability boundary for flow boiling in parallel microchannels, International Journal of Heat and Mass Transfer 228, p. 125671, 2024. https://doi.org/10.1016/j.ijheatmasstransfer.2024.125671
S. Ozguc, L. Pan, J.A. Weibel, An approach for topology optimization of heat sinks for two-phase flow boiling: Part 1 - model formulation and numerical implementation, Applied Thermal Engineering 249, p. 123337, 2024. https://doi.org/10.1016/j.applthermaleng.2024.123337
D.J. Lohan, B. Sarma, S.N. Joshi, E.M. Dede, A. Soto, S. Sudhakar, and J.A. Weibel, Thermal performance of a pump-assisted capillary cooler, ASME Thermal Science and Engineering Applications, TSEA-23-1499, 2024. https://doi.org/10.1115/1.4065619
M. Bongarala, J.A. Weibel, and S.V. Garimella, A method to partition boiling heat transfer mechanisms using synchronous through-substrate high-speed visual and infrared measurements, International Journal of Heat and Mass Transfer 226, p. 125516, 2024. https://doi.org/10.1016/j.ijheatmasstransfer.2024.125516
A.K. Penning, J.A. Weibel, Assessing the influence of glass properties on cabin solar heating and range of an electric vehicle using a comprehensive system model, Applied Energy 339, p. 120973, 2023. https://doi.org/10.1016/j.apenergy.2023.120973
A. Bar-Cohen, M. Asheghi, T. Chainer, S. V. Garimella, K. Goodson, C. Gorle, R. Mandel, J. Maurer, M. Ohadi, J. W. Palko, P. Parida, Y. Peles, J. Plawsky, M. Schultz, J. A. Weibel, and Y. Joshi, The ICECool Fundamentals effort on evaporative cooling of microelectronics, IEEE Transactions on Components Packaging and Manufacturing Technology 11, pp. 1546-1564, 2021. https://doi.org/10.1109/TCPMT.2021.3118755