2023 Research Projects
Projects are posted below; new projects will continue to be posted. To learn more about the type of research conducted by undergraduates, view the archived symposium booklets and search the past SURF projects.
This is a list of research projects that may have opportunities for undergraduate students. Please note that it is not a complete list of every SURF project. Undergraduates will discover other projects when talking directly to Purdue faculty.
You can browse all the projects on the list or view only projects in the following categories:
Material Processing and Characterization (40)
3D Printing Multi-material Ceramics
Description:
This project is funded by NASA Marshall Space Flight Center and we will be directly working with experts from there. The goal is to use 3D printing to create multi-material structures that can be applied to solid rocket nozzles and thermal protection systems. The researcher will apply material science and manufacturing science principles to the project. The work will be done at Zucrow Laboratories.
Research categories:
Material Processing and Characterization
Preferred major(s):
- No Major Restriction
Desired experience:
Basic 3D printing experience
Exposure to material science
School/Dept.:
Mechanical Engineering
Professor:
Monique
McClain
More information: https://mcclain.team/
AAMP-UP Project 1: Dynamic mechanical properties of mock polymer bonded explosives systems
Description:
Polymer bonded explosives contain a high percentage of explosive particulates bound in a polymer binder, which allows for increased formability and machinability. Understanding how these systems fail during mechanical shock is paramount for continued safe use. This research area explores the behavior of cast and additively manufactured polymer bonded explosives systems through the use of 3 point bend testing. During this project, the student will complete a literature review researching particle based composites, 3D printing of them, and three-point bending tests. The student will work with graduate student advisors to design samples and the testing series, with potential augmentation including preliminary micro X-ray computed tomography for 3-D sample internal visualization, in situ high speed imaging of fracture, and post experimentation failure analysis.
This project is from the AAMP-UP summer program, which is a different program than SURF. AAMP-UP is a 10-week summer program that provides STEM undergraduates the chance to participate in national defense and military research. The program is sponsored by the U.S. Army Research Laboratory in Aberdeen, MD.
This project is from the AAMP-UP summer program, which is a different program than SURF. AAMP-UP is a 10-week summer program that provides STEM undergraduates the chance to participate in national defense and military research. The program is sponsored by the U.S. Army Research Laboratory in Aberdeen, MD.
Research categories:
Material Processing and Characterization, Other
Preferred major(s):
- No Major Restriction
Desired experience:
AAMP-UP asks that each student applicant have finished 1 semester of higher education, be currently enrolled in a college or university, and graduate after August 2023. In addition, students must be U.S. Citizens or U.S. Persons. No prior experience with the U.S. military is required.
No summer classes are allowed.
School/Dept.:
Materials Engineering
Professor:
Weinong
Chen
More information: https://engineering.purdue.edu/Energetics/AAMP-UP/index_html
AAMP-UP Project 2: In-situ nanoindentation of 3D printed vs cast particulate composites
Description:
Polymer bonded explosives contain a high percentage of explosive particulates bound in a polymer binder, which allows for increased formability and machinability. Understanding how these systems fail during mechanical shock is paramount for continued safe use. This research area explores the behavior of cast and additively manufactured polymer bonded explosives systems through the use of nanoindentation and bulk hardness. During this project, the student will complete a literature review researching particle based composites, 3D printing of them, and hardness testing. The student will work with graduate student advisors to design samples and the testing series, with potential augmentation including pre and post experiment micro X-ray computed tomography for 3-D sample internal visualization, Characterization of surface quality of samples, and post experimentation failure analysis.
This project is from the AAMP-UP summer program, which is a different program than SURF. AAMP-UP is a 10-week summer program that provides STEM undergraduates the chance to participate in national defense and military research. The program is sponsored by the U.S. Army Research Laboratory in Aberdeen, MD.
This project is from the AAMP-UP summer program, which is a different program than SURF. AAMP-UP is a 10-week summer program that provides STEM undergraduates the chance to participate in national defense and military research. The program is sponsored by the U.S. Army Research Laboratory in Aberdeen, MD.
Research categories:
Material Processing and Characterization, Other
Preferred major(s):
- No Major Restriction
Desired experience:
AAMP-UP asks that each student applicant have finished 1 semester of higher education, be currently enrolled in a college or university, and graduate after August 2023. In addition, students must be U.S. Citizens or U.S. Persons. No prior experience with the U.S. military is required.
No summer classes are allowed.
School/Dept.:
Materials Engineering
Professor:
Weinong
Chen
More information: https://engineering.purdue.edu/Energetics/AAMP-UP/index_html
AAMP-UP Project 8: Characterization of Material for 3D Printing
Description:
The objective of this project would be to determine the similarity of mass flow rate for a variety of inert and reactive materials, including Ammonium Perchlorate (AP) based propellants. The undergraduate would help 3D print and test these inert mixtures. The undergraduate student would gain experience researching relevant literature, mixing samples, designing experiments, and analyzing the data for the mock materials as well as assisting with the same tests using energetic materials.
This project is from the AAMP-UP summer program, which is a different program than SURF. AAMP-UP is a 10-week summer program that provides STEM undergraduates the chance to participate in national defense and military research. The program is sponsored by the U.S. Army Research Laboratory in Aberdeen, MD.
This project is from the AAMP-UP summer program, which is a different program than SURF. AAMP-UP is a 10-week summer program that provides STEM undergraduates the chance to participate in national defense and military research. The program is sponsored by the U.S. Army Research Laboratory in Aberdeen, MD.
Research categories:
Material Processing and Characterization, Other
Preferred major(s):
- No Major Restriction
Desired experience:
AAMP-UP asks that each student applicant have finished 1 semester of higher education, be currently enrolled in a college or university, and graduate after August 2023. In addition, students must be U.S. Citizens or U.S. Persons. No prior experience with the U.S. military is required.
No summer classes are allowed.
School/Dept.:
Mechanical Engineering
Professor:
Steven
Son
More information: https://engineering.purdue.edu/Energetics/AAMP-UP/index_html
Adhesives at the Beach
Description:
The oceans are home to a diverse collection of animals producing intriguing materials. Mussels, barnacles, oysters, starfish, and kelp are examples of the organisms generating adhesive matrices for affixing themselves to the sea floor. Our laboratory is characterizing these biological materials, designing synthetic polymer mimics, and developing applications. Synthetic mimics of these bioadhesives begin with the chemistry learned from characterization studies and incorporate the findings into bulk polymers. For example, we are mimicking the cross-linking of DOPA-containing adhesive proteins by placing monomers with pendant catechols into various polymer backbones. Adhesion strengths of these new polymers can rival that of the cyanoacrylate “super glues.” Underwater bonding is also appreciable. Future efforts are planned in two different areas: A) Using biobased and biomimetic adhesives as the basis for making new plastic materials, such as systems like carbon fiber reinforced polymers, but with all components sourced sustainably. B) Developing new adhesive systems that function completely underwater.
Research categories:
Biological Characterization and Imaging, Composite Materials and Alloys, Material Processing and Characterization, Medical Science and Technology
Preferred major(s):
- No Major Restriction
School/Dept.:
Chemistry
Professor:
Jonathan
Wilker
Air Purification with Photocatalysis and Acoustic Filtering
Description:
There are two related projects, both focused on making air safe, including from bioaersols like COVID.
1) Photocatalysis for Air Purification: Photocatalysis is one method for helping degrade harmful airborne particles, like COVID-19, which our lab is investigating in a partnership with a start-up company. Undergraduates interested in designing experimental setups and microbiological experiments are well-suited for this project. Candidates with experience in culturing microorganism/relevant wet lab experience is preferred.
2) Acoustic removal of aerosols: Sound waves can interact with small particles like aerosols, and be used to manipulate their motion. In this project, we aim to invent the first system that can make air safe with sound waves.
1) Photocatalysis for Air Purification: Photocatalysis is one method for helping degrade harmful airborne particles, like COVID-19, which our lab is investigating in a partnership with a start-up company. Undergraduates interested in designing experimental setups and microbiological experiments are well-suited for this project. Candidates with experience in culturing microorganism/relevant wet lab experience is preferred.
2) Acoustic removal of aerosols: Sound waves can interact with small particles like aerosols, and be used to manipulate their motion. In this project, we aim to invent the first system that can make air safe with sound waves.
Research categories:
Biological Characterization and Imaging, Biological Simulation and Technology, Energy and Environment, Engineering the Built Environment, Fluid Modelling and Simulation, Material Modeling and Simulation, Material Processing and Characterization, Nanotechnology
Preferred major(s):
- No Major Restriction
Desired experience:
All applicants should have an interest in photochemistry, microbiology, aerosol sciences, and experimental research. In addition to the required skills mentioned in the points above, applicants with additional experience with some of the following programs are preferred: Python and Adobe Illustrator.
What experience will you gain?
• Hands on research experience and potential co-authorship in high impact journals
• Application of engineering fundamentals to important societal problems
• Research credit hours (and potential opportunities for financial compensation in the summer)
• Networking opportunities with academic and industry leaders
School/Dept.:
Mechanical Engineering
Professor:
David
Warsinger
More information: www.warsinger.com
Bionic Interfaces Prototyping: Soft Actuator Arrays
Description:
Soft materials (rubber) enable large deformations, creating new opportunities for devices that transform their shape on demand. We are developing methods to control arrays of actuators in a scalable way. These actuator arrays could have future applications in virtual reality devices, miniaturized tunable optics, and devices that control sound waves on demand.
This is a collaborative project that can include work on several topics including machine learning algorithms, programming microcontrollers, designing control electronics, and fabricating robotic devices.
This is a collaborative project that can include work on several topics including machine learning algorithms, programming microcontrollers, designing control electronics, and fabricating robotic devices.
Research categories:
Fabrication and Robotics, Material Processing and Characterization, Microelectronics
Preferred major(s):
- No Major Restriction
Desired experience:
No previous training is necessary, but experience with CAD, polymer processing, and simple control electronics (Arduino, NI DAQ) is an asset.
School/Dept.:
Mechanical Engineering
Professor:
Alex
Chortos
More information: http://chortoslab.com/
Bone Fracture and Microscale Deformation Processes
Description:
We seek to modify the deformation characteristics of bone through a pharmacological treatment. This project would demonstrate such a concept using animal bone. Treated and untreated bone will be made available for the interrogation of bone by x-rays. Students will be engaged in the data interpretation of x-ray scattering experiments on bone, not subjected to mechanical loads or subjected to mechanical loads.
Research categories:
Biological Characterization and Imaging, Biological Simulation and Technology, Material Modeling and Simulation, Material Processing and Characterization, Other
Desired experience:
Materials Characterization, X-ray techniques; Experience in lab work
School/Dept.:
School of Mechanical Engineering
Professor:
Thomas
Siegmund
More information: https://engineering.purdue.edu/MYMECH
Conducting Polymers for Bioelectronic Applications
Description:
This project involves the synthesis, characterization, and device application of conducting plastics for bioelectronic applications. In conjunction with a graduate student mentor, the SURF student will focus on synthesizing new polymers and characterizing the molecular, thermal, structural, electronic, and magnetic properties of the materials. As many carbon-based polymers are electronically and magnetically inactive, this line of research examines previously unexamined materials for next-generation applications, including their inclusion as the active layer materials in biomedical sensors. Thus, the SURF student will fabricate and test electronic and magnetic devices along these lines.
Research categories:
Material Processing and Characterization, Nanotechnology
Preferred major(s):
- No Major Restriction
Desired experience:
Students who are earlier in their careers (i.e., just completing their first year or sophomore year of study) are preferred. An interest in polymer chemistry and electronic devices is desired.
School/Dept.:
Davidson School of Chemical Engineering
Professor:
Bryan
Boudouris
More information: https://engineering.purdue.edu/ChE/people/ptProfile?resource_id=71151
Energy Efficient Dryer Design and Analysis for Advanced Manufacturing
Description:
In the coming years, countries around the world will make concerted efforts to decarbonize various industries and technologies to help prevent and reverse climate change. Currently, thermal dehydration accounts for 10-20% of all industrial energy consumption and relies heavily on the combustion of fossil fuels. Vapor compression heat pumps, like those used in building air conditioners, offer a high-efficiency, electrically driven heat source for industrial drying applications, however there are many barriers preventing broad implementation. Our team at Purdue has proposed a new thermal drying system concept that employs unique materials and exploits clever thermodynamic design to provide up to 40% energy and emissions savings. As part of this work, we are developing system models/simulations, designing and building prototype systems, and performing advanced materials research, thus providing a breadth of exciting opportunities for aspiring scientists and engineers. This research is also heavily tied to our work on energy efficient thermal systems for buildings and water/energy sustainability, and the student who joins the project will be exposed to many research topics within the Water-Energy Nexus.
Research categories:
Composite Materials and Alloys, Energy and Environment, Engineering the Built Environment, Fluid Modelling and Simulation, Material Modeling and Simulation, Material Processing and Characterization, Microelectronics, Nanotechnology, Thermal Technology
Preferred major(s):
- No Major Restriction
Desired experience:
Applicants should have a general interest in energy and sustainability. Should also have a strong background/interest in thermodynamics, heat transfer, and/or materials science. Applicants with experience in some (not all) of the following are preferred: LabVIEW, Python (Jupyter, Google Colab, etc.) Engineering Equation Solver, MATLAB, 3D-CAD Software, prototype design/manufacturing, and Adobe Illustrator. 2nd semester Sophomores, Juniors, and 1st semester Seniors are preferred.
School/Dept.:
Mechanical Engineering
Professor:
Jim
Braun
More information: www.warsinger.com
Fabrication and simulation of the efficient joining of dissimilar materials
Description:
The student will start with the metallographic preparation training and make many samples for the experiments. The student will then fabricate the samples using the patented equipment in the lab. The student will work with graduate students on material characterization. The student will also develop the finite element model to simulate the thermal and stress fields. Except the experiments and simulations, the student is expected to read literatures, make a presentation in the weekly meeting, write progress reports.
Research categories:
Composite Materials and Alloys, Material Modeling and Simulation, Material Processing and Characterization, Thermal Technology, Other
Preferred major(s):
- No Major Restriction
School/Dept.:
Nuclear Engineering
Professor:
Yi
Xie
More information: https://engineering.purdue.edu/MINE
Fabrication and testing of advanced materials in harsh environments
Description:
The environmental degradation of structrual and functional materials is a key problem for the sustainability and longevity of advanced energy systems. The project is to investigate the properties and behaviors of innovative materials in the application environments. The student will start with the powder processing and metallographic preparation training and fabricate many samples for the corrosion experiments and thermal measurements. The student will work with graduate students on material characterization and data analysis. The student is expected to read literatures, make presentations in the weekly meeting, and write progress reports.
Research categories:
Composite Materials and Alloys, Material Processing and Characterization
Preferred major(s):
- No Major Restriction
School/Dept.:
Nuclear Engineering
Professor:
Yi
Xie
More information: https://engineering.purdue.edu/MINE
Heat Treatment for Normalization of EB Welds in Low-Alloy Steel
Description:
Electron Beam Welding is a promising new technology currently being investigated for use in rapid manufacturing for nuclear power applications. This project seeks to investigate new heat treatment procedures in order to remove weld-induced microstructural effects in SA508 steel, with a specific focus on attaining complete austenitization within the weld region. The experiments will be guided by a finite element model, and will be used to validate the accuracy of existing models for the thermal behavior of SA508 steel manufactured both by traditional forging and by powder metallurgy. Students will be involved with the fabrication of samples and carrying out heat treatments, as well as investigation of the resulting microstructures via optical microscopy, scanning electron microscopy (SEM), and nanoindentation.
Research categories:
Material Processing and Characterization
Preferred major(s):
- Materials Engineering
- Mechanical Engineering
- Nuclear Engineering
Desired experience:
MSE 230 or equivalent; eager to learn; able to work in a collaborative group setting
School/Dept.:
Materials Engineering
Professor:
Janelle
Wharry
More information: https://wharryresearchgroup.wordpress.com/
High Performance Concrete from Hydrogel-Based Superabsorbent Materials
Description:
Concrete that is internally cured by water-swollen superabsorbent polymer (SAP) particles has improved strength and durability. This project will investigate new SAP formulations that have increased absorption capacity in a wider variety of low-carbon concrete materials. The student will conduct swelling tests and optical microscopy of the SAP particles and then perform optical microscopy and mechanical measurements of the SAP-cured concrete. Improvements in concrete strength and durability is a step towards reducing the carbon footprint of our civil infrastructure materials, as production of new cement results in 7-9% of the global CO2 emissions each year.
Research categories:
Composite Materials and Alloys, Material Processing and Characterization
Preferred major(s):
- No Major Restriction
Desired experience:
Enthusiasm for chemistry and an interest in materials research. Prior experiences with cement and concrete would be a benefit to the project but are not required.
School/Dept.:
Materials Engineering
Professor:
Kendra
Erk
More information: https://soft-material-mechanics.squarespace.com/home/
High Performance Perovskite Solar Cells
Description:
Sunlight is the most abundant renewable energy resource available to human beings, and yet it remains one of the most poorly utilized sources of clean energy. Solar cell modules incorporating single crystalline silicon and gallium arsenide currently provide the highest efficiencies for solar energy conversion to electricity but remain limited due to their high costs.
In the past few years, perovskite solar cell technology has made significant progress, improving in efficiency to ~25%, while maintaining attractive economics due to the use of inexpensive soluble materials coupled with ultra low-cost deposition technologies. However, the real applications of these devices requires new breakthroughs in device performance, large-scale manufacturing, and improved stability. Among these, stability and degradation are among the most significant challenges for perovskite technologies. Perovskite absorber layer and organic charge transport materials can be sensitive to water, oxygen, high temperatures, ultraviolet light, and even electric field, all of which will be encountered during operation. To address these issues, significant efforts have been made, including mixed dimensionality and surface passivation; alternative absorber materials and formulations, new charge transport layers, and advanced encapsulation techniques, etc. Now, T80 lifetimes (i.e., the length of time in operation until measured output power is 80% of original output power) of over 1,000 hours have been demonstrated. However, it is still far below the industry required 20 years lifetime, indicating the ineffectiveness of current approaches. To make this advance, non-incremental and fundamentally new strategies are required to improve the intrinsic stability of perovskite active materials.
In this project, we propose a new paradigm to develop intrinsically robust perovskite active layers through the incorporation of multi-functional semiconducting conjugated ligands. In preliminary work, we have demonstrated that semiconducting ligands can spontaneously organize within the active layer to passivate defects and restrict halide diffusion, resulting in dramatic improvements in moisture and oxygen tolerance, reduced phase segregation, and increased thermal stability. Combining a team with expertise spanning the gamut of materials synthesis, computational materials design, and device engineering, we will develop a suite of multi-functional semiconducting ligands capable of improving the intrinsic stability perovskite materials while preserving and even enhancing their electronic properties. Through this strategy, we aim to achieve over 25% cell efficiency with operational stability over 20 years for future commercial use.
More information: https://letiandougroup.com/
In the past few years, perovskite solar cell technology has made significant progress, improving in efficiency to ~25%, while maintaining attractive economics due to the use of inexpensive soluble materials coupled with ultra low-cost deposition technologies. However, the real applications of these devices requires new breakthroughs in device performance, large-scale manufacturing, and improved stability. Among these, stability and degradation are among the most significant challenges for perovskite technologies. Perovskite absorber layer and organic charge transport materials can be sensitive to water, oxygen, high temperatures, ultraviolet light, and even electric field, all of which will be encountered during operation. To address these issues, significant efforts have been made, including mixed dimensionality and surface passivation; alternative absorber materials and formulations, new charge transport layers, and advanced encapsulation techniques, etc. Now, T80 lifetimes (i.e., the length of time in operation until measured output power is 80% of original output power) of over 1,000 hours have been demonstrated. However, it is still far below the industry required 20 years lifetime, indicating the ineffectiveness of current approaches. To make this advance, non-incremental and fundamentally new strategies are required to improve the intrinsic stability of perovskite active materials.
In this project, we propose a new paradigm to develop intrinsically robust perovskite active layers through the incorporation of multi-functional semiconducting conjugated ligands. In preliminary work, we have demonstrated that semiconducting ligands can spontaneously organize within the active layer to passivate defects and restrict halide diffusion, resulting in dramatic improvements in moisture and oxygen tolerance, reduced phase segregation, and increased thermal stability. Combining a team with expertise spanning the gamut of materials synthesis, computational materials design, and device engineering, we will develop a suite of multi-functional semiconducting ligands capable of improving the intrinsic stability perovskite materials while preserving and even enhancing their electronic properties. Through this strategy, we aim to achieve over 25% cell efficiency with operational stability over 20 years for future commercial use.
More information: https://letiandougroup.com/
Research categories:
Energy and Environment, Material Processing and Characterization, Nanotechnology
School/Dept.:
Chemical Engineering
Professor:
Letian
Dou
More information: https://letiandougroup.com/
Investigation of Microstructure-Property-Processing Relationships in Concentrated Surfactant Solutions
Description:
Aqueous surfactant solutions are widely used to formulate detergent-based products for cleaning, laundry, and other personal care activities (e.g., shampoo, body wash). The goal of this SURF project is to determine how the microstructure and properties of surfactant-based solutions are affected by the removal of water and the addition of processing aids. The project's hypothesis is that certain chemical additives, including salt and perfumes, will change how the surfactants self-assemble in water which will in turn lead to changes in the surfactant solution's viscosity and flow behavior (its "rheology"). Through this project, the SURF student will: (1) learn about commercial surfactants like sodium laureth sulfate; (2) conduct advanced optical microscopy and image analysis on solutions with different amounts of water and additives; and (3) observe how the application of shear forces will change the self-assembled surfactant microstructures. The main outcome of this project will be a better understanding of the surfactant solution’s microstructure-property-processing relationships which will enable companies to more efficiently manufacture concentrated solutions to achieve desired properties and performance while also meeting sustainability goals such as reducing water from commercial products.
Research categories:
Material Processing and Characterization
Preferred major(s):
- No Major Restriction
Desired experience:
Enthusiasm for chemistry and an interest in materials research. Basic understanding of optics and digital photography and image processing would be awesome.
School/Dept.:
Materials Engineering
Professor:
Kendra
Erk
More information: https://soft-material-mechanics.squarespace.com/home/
Magnetometry and noise thermometry
Description:
Quantum computing in the present day requires large macroscopic circuits and optical lattices and controls which are very expensive. Solid-state techniques for quantum computing will allow the miniaturization and the components and cost-effective scale-up of quantum technologies. A problem of solid-state quantum technologies is noise, especially thermal noise, which scrambles the quantum information. On this theme, one lofty goal of quantum engineering is achieving topologically protected quantum states which are protected from thermal decoherence. These materials have tale-tale signatures of stable quantization, which start to appear in thermal transport and magnetometry measurements. In this project, we attempt to set up such measurements at Purdue University at low temperatures on candidate topological materials.
Common thermometry measurements cannot be performed on thin-film samples required for this project. However, thermometry based on Johnson-Nyquist noise on Pt electrodes allows measuring the same when placed proximate to a quantum material in the thin-film form. Overall the method allows the local temperature measurement, and hence quantum decoherence, on a solid-state sample. The temperature difference, if quantized, is an excellent measure for quantization. The understanding for the thermal signatures of the sample will be complemented by magnetometry, which is will be achieved by the installation of a SQUID magnetometer by the sample (made by Quantum Design). Overall, the project requires that the student become an expert in thermometry using noise as a guiding principle. The project requires the candidate to become proficient in LabView and Python coding to transduce the noise signatures from e-beam platinum deposits on silicon in milli-Kelvin temperatures, both in the absence and the presence of a solid-state sample.
Common thermometry measurements cannot be performed on thin-film samples required for this project. However, thermometry based on Johnson-Nyquist noise on Pt electrodes allows measuring the same when placed proximate to a quantum material in the thin-film form. Overall the method allows the local temperature measurement, and hence quantum decoherence, on a solid-state sample. The temperature difference, if quantized, is an excellent measure for quantization. The understanding for the thermal signatures of the sample will be complemented by magnetometry, which is will be achieved by the installation of a SQUID magnetometer by the sample (made by Quantum Design). Overall, the project requires that the student become an expert in thermometry using noise as a guiding principle. The project requires the candidate to become proficient in LabView and Python coding to transduce the noise signatures from e-beam platinum deposits on silicon in milli-Kelvin temperatures, both in the absence and the presence of a solid-state sample.
Research categories:
Material Processing and Characterization, Nanotechnology, Thermal Technology
Preferred major(s):
- No Major Restriction
- Electrical Engineering
- Physics
- Materials Engineering
Desired experience:
Knowledge of Fourier transformation is useful.
School/Dept.:
Physics and Astronomy
Professor:
Arnab
Banerjee
More information: https://www.physics.purdue.edu/people/faculty/arnabb.php
Microstructural control of energetic materials
Description:
The goal of this project is to understand how various material parameters affect the microstructure, and thus performance, of energetic materials (i.e. propellants, explosives, pyrotechnics). This project requires U.S. citizenship. The researcher will learn material science and manufacturing principles.
Research categories:
Material Processing and Characterization
Preferred major(s):
- No Major Restriction
Desired experience:
Exposure to material science
School/Dept.:
Mechanical Engineering
Professor:
Monique
McClain
More information: https://mcclain.team/
Modernization of Pharmaceutical Drug Product Manufacturing
Description:
The continuous mode of manufacturing for pharmaceutical products represents the future of the pharmaceutical industry; it ultimately leads to cheaper and safer drugs, as well as a more reliable drug supply chain. To realize these advantages, however, effective fault detection and diagnostic systems need to be in place, so intervention strategies can be implemented in case the system goes malfunctions.
In this project, we will investigate the ribbon splitting phenomenon in a roller compactor, which is a phenomenon can adversely affect that quality of the product granules coming out of the roller compactor. Little is known about its impact on the product quality as well as the predictability of the phenomenon. The ability to predict this phenomenon can be a boon to effective implementation of condition-based maintenance strategies that have been accepted to be a critical requirement for the successful shift to continuous pharmaceutical manufacturing. This study requires particle technology expertise, which will be provided by Prof. Marcial Gonzalez in Mechanical Engineering, as well as process systems engineering expertise provided by Prof. Rex Reklaitis and Prof. Zoltan Nagy in Chemical Engineering.
In this project, we will investigate the ribbon splitting phenomenon in a roller compactor, which is a phenomenon can adversely affect that quality of the product granules coming out of the roller compactor. Little is known about its impact on the product quality as well as the predictability of the phenomenon. The ability to predict this phenomenon can be a boon to effective implementation of condition-based maintenance strategies that have been accepted to be a critical requirement for the successful shift to continuous pharmaceutical manufacturing. This study requires particle technology expertise, which will be provided by Prof. Marcial Gonzalez in Mechanical Engineering, as well as process systems engineering expertise provided by Prof. Rex Reklaitis and Prof. Zoltan Nagy in Chemical Engineering.
Research categories:
Big Data/Machine Learning, Chemical Unit Operations, Material Processing and Characterization, Other
Preferred major(s):
- No Major Restriction
Desired experience:
Python programming/coding experience is a PLUS, but not required, although enthusiasm to learn is a must. Students interested in a career in powder processing and/or pharmaceutical manufacturing, are encouraged to apply.
School/Dept.:
Davidson School of Chemical Engineering
Professor:
Gintaras
Reklaitis
Molecular microscopy to inform the design of medications
Description:
As illustrated with the COVID vaccines, storage and stability of medications can limit widespread availability. We are developing innovative chemical imaging tools with ultrafast pulsed lasers capable of mapping transformations within medical formulations to model and inform stability and bioavailability. Depending on the interests of the students, project scope can range from: i) bench-science in sample preparation and characterization, ii) instrument design and optical path alignment, iii) data acquisition and image analysis algorithm development, iv) partnership with collaborators in the pharmaceutical industry. We have a vibrant and diverse cohort of current researchers dedicated to fostering a supportive and collaborative research environment for all.
Research categories:
Big Data/Machine Learning, Biological Characterization and Imaging, Material Processing and Characterization
Preferred major(s):
- No Major Restriction
School/Dept.:
Chemistry
Professor:
Garth
Simpson
More information: http://www.chem.purdue.edu/simpson/
Nanoscale 3D printing
Description:
The ability to create 3D structures in the micro and nanoscale is important for many applications including electronics, microfluidics, and tissue engineering. This project deals with development and testing of a setup for building 3D structures using a femtosecond pulsed laser. A method known as two photon polymerization is used to fabricate such structures in which a polymer is exposed to laser and at the point of the exposure the polymer changes its structure. Moving the laser in a predefined path results in the desired shape and the structures. The setup incorporates the steps from designing a CAD model file to slicing the model in layers to generating the motion path of the laser needed for fabricating the structure. Possible improvements to the process by the undergraduate researcher include control algorithms, better CAD models, and better manufacturing strategies.
Research categories:
Deep Learning, Fabrication and Robotics, Material Processing and Characterization, Nanotechnology
Preferred major(s):
- Mechanical Engineering
Desired experience:
junior or senior standing, CAD, Matlab or Python, minimum GPA > 3.5
School/Dept.:
Mechanical Engineering
Professor:
Xianfan
Xu
More information: https://engineering.purdue.edu/NanoLab/
Optimization of magnetically responsive membranes for tissue testing. Collaborative project: Adrian Buganza Tepole (PI), Andres Arrieta (PI), Craig Goergen (PI)
Description:
There is a need for testing tissues in vivo to enable the development of better diagnostic tools and treatments. Actuating on tissues under homeostatic conditions (i.e., under biologically functional conditions) is challenging due to the complex boundary conditions introduced by any device interacting with the tissue. Therefore, biological tissue testing is mostly conducted ex-vivo, implying the loss of homeostasis and capturing of less relevant material properties. An alternative approach is to develop membranes responsive to remote stimulus such as magnetic fields.
This project aims to determine the microstructure design of polymer membranes with magnetically responsive particles to actuate on biological tissues under biologically relevant conditions. Specifically, this implies optimizing the material microstructure by orienting magnetically-responsive particles across the cross-section of the membrane.
Specific tasks & deliverables
1. To familiarize with the fabrication process of polymeric membranes embedding magnetically responsive particles.
2. To fabricate and conduct mechanical tests of magnetically responsive membranes.
3. To test the adhesion properties of the developed membranes to animal skin.
4. To conduct actuation tests of membrane+skin (bilayer) patches under magnetic fields as a function of particle orientation.
5. Documentation of the fabrication process, adhesion tests, and magnetic actuation results. Production of a final report, compatible with further presentation as a poster or student paper.
Special project outcomes
1. Familiarization with fabrication of magnetically-responsive materials.
2. Replicate material testing protocols for the adhesion and in-plane stretching response of polymeric membranes.
3. Familiarization with magnetic actuation of bilayer membranes.
4. Familiarization with testing of biological tissues.
This project aims to determine the microstructure design of polymer membranes with magnetically responsive particles to actuate on biological tissues under biologically relevant conditions. Specifically, this implies optimizing the material microstructure by orienting magnetically-responsive particles across the cross-section of the membrane.
Specific tasks & deliverables
1. To familiarize with the fabrication process of polymeric membranes embedding magnetically responsive particles.
2. To fabricate and conduct mechanical tests of magnetically responsive membranes.
3. To test the adhesion properties of the developed membranes to animal skin.
4. To conduct actuation tests of membrane+skin (bilayer) patches under magnetic fields as a function of particle orientation.
5. Documentation of the fabrication process, adhesion tests, and magnetic actuation results. Production of a final report, compatible with further presentation as a poster or student paper.
Special project outcomes
1. Familiarization with fabrication of magnetically-responsive materials.
2. Replicate material testing protocols for the adhesion and in-plane stretching response of polymeric membranes.
3. Familiarization with magnetic actuation of bilayer membranes.
4. Familiarization with testing of biological tissues.
Research categories:
Biological Characterization and Imaging, Fabrication and Robotics, Material Processing and Characterization, Medical Science and Technology
Preferred major(s):
- Biomedical Engineering
- Mechanical Engineering
- Materials Engineering
Desired experience:
Desirable experience:
Material characterization, prior experimental work on polymers
School/Dept.:
Mechanical Engineering
Professor:
Adrian
Buganza Tepole
More information: https://engineering.purdue.edu/ProgrammableStructures/
Physics and Analytics of Lithium Batteries
Description:
Lithium ion (Li-ion) batteries are ubiquitous. Thermal, electrochemical, and degradation characteristics of these systems are critical toward safer and high-performance batteries for electric vehicles. As part of this research, physics-based and data-driven analytics of experimental and simulated performance under normal and anomalous operating conditions of lithium-ion and lithium metal batteries will be performed.
The final deliverable will be one research report (based on weekly progress presentations and updates) and one final presentation.
The final deliverable will be one research report (based on weekly progress presentations and updates) and one final presentation.
Research categories:
Energy and Environment, Material Modeling and Simulation, Material Processing and Characterization, Thermal Technology
Desired experience:
Strong analytical skill and desire to learn new experimental and modeling & analysis tools.
School/Dept.:
Mechanical Engineering
Professor:
Partha
Mukherjee
More information: https://engineering.purdue.edu/ETSL/
Plastics, Water, and Air: Chemical Emissions and Leaching
Description:
Water infrastructure is critical to the safety and economic health of communities. The restoration and maintenance of water supply and wastewater infrastructure are ongoing challenges for the Nation. Cured-in-place pipe (CIPP) composites technology is a popular method for repairing buried sewer pipes. CIPP technology is also now growing in popularity for repairing drinking water pipes. This is due in large part to economic considerations, as it can be 60-80% less costly than other repair alternatives. Unfortunately, the process of curing (polymerizing) the new plastic inside the damaged pipe can release hazardous materials into the air. For drinking water applications, the CIPPs can allow chemicals to leach into drinking water. Chemical air releases have resulted in illness to members of the general public and workers, and contributed to one worker fatality. The overall goal of this research is to reduce chemical volatilization from CIPP by understanding mechanisms of chemical release. This research directly addresses multiple National Academy of Science, Engineering, and Medicine grand challenges focused on restoring infrastructure, sustainably supplying water, building healthy cities, and reducing pollution.
The student will work with a graduate student and help evaluate chemical emissions during plastic manufacture using heat and steam. Sewer and drinking water resins will be explored. The student will help conduct the laboratory experiments, sample analysis, data analysis, interpretation, and reporting. Results will be shared with health officials, municipalities, and regulators after study completion. Prior studies where undergraduates have contributed on this topic can be found on the website listed below.
The student will work with a graduate student and help evaluate chemical emissions during plastic manufacture using heat and steam. Sewer and drinking water resins will be explored. The student will help conduct the laboratory experiments, sample analysis, data analysis, interpretation, and reporting. Results will be shared with health officials, municipalities, and regulators after study completion. Prior studies where undergraduates have contributed on this topic can be found on the website listed below.
Research categories:
Composite Materials and Alloys, Energy and Environment, Engineering the Built Environment, Environmental Characterization, Material Processing and Characterization
Preferred major(s):
- No Major Restriction
Desired experience:
Strong work ethic and commitment to learn and apply knowledge.
School/Dept.:
Lyles School of Civil Engineering
Professor:
Andrew
Whelton
More information: www.CIPPSafety.org
Quantum Characterization Setup Software Development
Description:
Our research group is in the midst of constructing new quantum optics characterization setups. These setups are used to characterize the photoluminescence properties of different quantum emitters down to the single photon level! This single emitter level property characterization is critical in the development of quantum optical computing, sensing, and communications! We are looking for an undergraduate student that can help with the development of software to control the various parts of the setup and to write the drivers to interface the hardware to the upper-level analysis software required to control the setup.
Research categories:
Big Data/Machine Learning, Deep Learning, Fabrication and Robotics, Material Processing and Characterization, Nanotechnology, Other
Preferred major(s):
- No Major Restriction
Desired experience:
Experience with embedded systems programming, analog to digital conversion experience, driver experience, python software experience.
School/Dept.:
Electrical and Computer Engineering (ECE)
Professor:
Vladimir
Shalaev
Quantum Characterization Setup Software Development
Description:
This research project focuses on the development of software algorithms for automated analysis of single photon emitters in silicon nitride nanopillars. The students role will be to develop these algorithms to help produce large datasets to be used in machine learning studies and in basic process development studies of emitters generated though the annealling of SiN/SiO nanopillars.
Research categories:
Big Data/Machine Learning, Material Processing and Characterization, Nanotechnology, System-on-a-Chip
Preferred major(s):
- No Major Restriction
Desired experience:
Strong python programming skills and algorithm development skills. Additionally, image processing skills are a plus!
School/Dept.:
Electrical and Computer Engineering (ECE)
Professor:
Alexander
Kildishev
Rapid characterization of high temperature alloys
Description:
Refractory alloys are used in extreme environments (high temperatures, corrosive environments, high stresses, high irradiation fluxes) and enable transportation, energy generation, and defense technologies to be realized. However, refractory alloys developed to date lack a balance of high temperature properties, namely oxidation resistance and strength, which, in some situations, prevents them from replacing other state of the art materials such as Ni-based superalloys. Over the past year, our group has developed machine learning and other predictive models that enable high-throughput discovery of novel refractory alloys exhibiting such balance of properties.
This SURF project aims to characterize the strength and oxidation resistance of tens to hundreds of refractory alloys using high-throughput characterization methods. Such methods for this project could include: Raman microscopy, surface profilometry, X-ray diffraction, automated scanning electron microscopy, and indentation. As part of this project, you will learn at least two of these methods and apply them to compositionally graded specimens comprising up to 85 unique alloys - potentially encompassing thousands of unique alloy compositions.
Significant data will be collected during this project, and the data must be collected and stored according to the FAIR principles (Findability, Accessibility, Interoperability, Reuse). Thus, some background in Python programming and Excel is desired for this project. It is expected that at the end of this project, you will publish a publicly accessible NanoHub.org tool that enables users from across the world to access and analyze the data.
This SURF project aims to characterize the strength and oxidation resistance of tens to hundreds of refractory alloys using high-throughput characterization methods. Such methods for this project could include: Raman microscopy, surface profilometry, X-ray diffraction, automated scanning electron microscopy, and indentation. As part of this project, you will learn at least two of these methods and apply them to compositionally graded specimens comprising up to 85 unique alloys - potentially encompassing thousands of unique alloy compositions.
Significant data will be collected during this project, and the data must be collected and stored according to the FAIR principles (Findability, Accessibility, Interoperability, Reuse). Thus, some background in Python programming and Excel is desired for this project. It is expected that at the end of this project, you will publish a publicly accessible NanoHub.org tool that enables users from across the world to access and analyze the data.
Research categories:
Big Data/Machine Learning, Material Processing and Characterization
Preferred major(s):
- Materials Engineering
- Chemical Engineering
- Mechanical Engineering
- Physics
Desired experience:
- Materials Characterization
- Computer Science / Programming (python preferred)
School/Dept.:
Materials Engineering
Professor:
Michael
Titus
SCALE Heterogeneous Integration/ Advanced Packaging: 3D Cryogenic Packaging for Superconducting Computing
Description:
This project is one of several SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023.
In 2017, a large-scale, 3D integrated quantum processor was demonstrated by MIT Lincoln Laboratory using heterogeneous 3D integration to create an architecture that enables the use of the third dimension without sacrificing qubit performance [D. Rosenberg, et al., Nature 2017]. In these quantum applications, conventional Sn-based solder bumps are not reliable while Indium and bismuth-based solders are promising for 3D integration at low temperatures. In this topic, new cryogenic compatible packaging materials and cryogenic superconducting multi-chip bonding techniques are needed to further explore and investigate the microelectronics devices and packages at low/cryogenic temperatures.
Reference: Rosenberg, D., et al. "3D integrated superconducting qubits." npj quantum information 3.1 (2017): 1-5.)
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
In 2017, a large-scale, 3D integrated quantum processor was demonstrated by MIT Lincoln Laboratory using heterogeneous 3D integration to create an architecture that enables the use of the third dimension without sacrificing qubit performance [D. Rosenberg, et al., Nature 2017]. In these quantum applications, conventional Sn-based solder bumps are not reliable while Indium and bismuth-based solders are promising for 3D integration at low temperatures. In this topic, new cryogenic compatible packaging materials and cryogenic superconducting multi-chip bonding techniques are needed to further explore and investigate the microelectronics devices and packages at low/cryogenic temperatures.
Reference: Rosenberg, D., et al. "3D integrated superconducting qubits." npj quantum information 3.1 (2017): 1-5.)
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Research categories:
Advanced Packaging, Heterogeneous Integration, Material Processing and Characterization, Microelectronics, Nanotechnology, System-on-a-Chip
Preferred major(s):
- Electrical Engineering
- Materials Engineering
- Mechanical Engineering
Desired experience:
1. Microelectronics, micro/nanotechnology courses
2. Clean room fabrication experience
3. Enthusiasm for material fabrication and characterizations
4. Familiar with SEM, TEM analysis
School/Dept.:
ME
Professor:
Tiwei
Wei
SCALE Heterogeneous Integration/ Advanced Packaging: Glass Interposer Development for 3D Heterogenous Integration
Description:
This project is one of several SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023.
Interposer is one of the most potential solutions for future 3D integration with ultrafine pitch. Silicon interposer has been developed in both industry and academia. However, silicon interposer has limitations, such as low productivity due to limited wafer size, extra expensive semiconductor fabrication processes, and poor electrical properties like insert loss and signal crosstalk. On the contrary, glass can be one kind of promising material as an interposer because of its excellent properties, such as good electrical resistivity, relatively low CTE compared to organic material, and possible high productivity with big panel sizes provided by glass suppliers.
Recent research studies have mainly focused on three challenges in glass interposer technology: (1) formation of the fine pitch via, which is more difficult than through silicon via (TSV) due to the unfavorable etching process ; (2) via metallization and via filling process, which become much more complicated because of the rough morphology of TGV surface, and difficulty to fill the tapered via through Damascus electroplating; (3) reliability concern, which is caused by brittleness and poor mechanical strength of glass.
Through glass via fabrications
Reference: Wei, T. W., Cai J.*, et al. Performance and reliability study of TGV interposer in 3D integration[C]//2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014: pp. 601-605.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Interposer is one of the most potential solutions for future 3D integration with ultrafine pitch. Silicon interposer has been developed in both industry and academia. However, silicon interposer has limitations, such as low productivity due to limited wafer size, extra expensive semiconductor fabrication processes, and poor electrical properties like insert loss and signal crosstalk. On the contrary, glass can be one kind of promising material as an interposer because of its excellent properties, such as good electrical resistivity, relatively low CTE compared to organic material, and possible high productivity with big panel sizes provided by glass suppliers.
Recent research studies have mainly focused on three challenges in glass interposer technology: (1) formation of the fine pitch via, which is more difficult than through silicon via (TSV) due to the unfavorable etching process ; (2) via metallization and via filling process, which become much more complicated because of the rough morphology of TGV surface, and difficulty to fill the tapered via through Damascus electroplating; (3) reliability concern, which is caused by brittleness and poor mechanical strength of glass.
Through glass via fabrications
Reference: Wei, T. W., Cai J.*, et al. Performance and reliability study of TGV interposer in 3D integration[C]//2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014: pp. 601-605.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Research categories:
Advanced Packaging, Heterogeneous Integration, Material Modeling and Simulation, Material Processing and Characterization, Microelectronics, Nanotechnology, System-on-a-Chip
Preferred major(s):
- Electrical Engineering
- Mechanical Engineering
- Materials Engineering
Desired experience:
1. Microelectronics, micro/nanotechnology courses
2. Clean room fabrication experience
3. Enthusiasm for material fabrication and characterizations
4. Familiar with SEM, and TEM analysis.
School/Dept.:
ME
Professor:
Tiwei
Wei
More information: https://alphalab-purdue.org/
SCALE Heterogeneous Integration/ Advanced Packaging: High-Temperature Solders for Aerospace and Defense
Description:
This project is one of several SCALE SURF research projects, and is restricted to US citizens. If you are interested in more than one SCALE SURF project, you can apply to all of them with one application. ** Be sure to address each project by name in your application. ** See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023.
Low-melting point metals based on tin are used to connect semiconductor packages to circuit boards. The specific solder composition that is chosen for a product depends on the product's use conditions, for example, consider the differences in use conditions for a cell phone, an implanted pace maker, strapped onto a car engine, and in a satellite.. This project explores the performance and manufacturing differences between solders for different use cases as a function of composition and application. We are collaborating with researchers from Auburn University, the University of Maryland, Raytheon, BAE Systems, the Department of Defense to develop a guide for solder selection for aerospace and defense applications. These researchers have backgrounds in materials engineering, mechanical engineering, industrial engineering, and electrical engineering, so many different skill sets are needed and you will see different perspectives. This project will require extensive review of the literature and performing materials characterization, processing, manufacturing, and reliability experiments. Student researchers will learn a wide range of materials and mechanical property, processing, and characterization techniques and will work closely with faculty and graduate students from Materials Engineering and Mechanical Engineering.
To apply to a SCALE SURF project, go to the SURF website: https://engineering.purdue.edu/Engr/Research/EURO/SURF/Research/Y2023
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Preferred majors:
• Materials Engineering
• Mechanical Engineering
Required Experience and Skills:
Desired experience:
• Experience with programming in Python, C/C++, and/or MATLAB.
• Enthusiasm for scientific research.
• Understanding of introductory materials science and engineering concepts.
Academic Years Eligible:
Rising juniors and seniors with the desired experience will be preferred, but rising sophomores are also eligible to apply.
Low-melting point metals based on tin are used to connect semiconductor packages to circuit boards. The specific solder composition that is chosen for a product depends on the product's use conditions, for example, consider the differences in use conditions for a cell phone, an implanted pace maker, strapped onto a car engine, and in a satellite.. This project explores the performance and manufacturing differences between solders for different use cases as a function of composition and application. We are collaborating with researchers from Auburn University, the University of Maryland, Raytheon, BAE Systems, the Department of Defense to develop a guide for solder selection for aerospace and defense applications. These researchers have backgrounds in materials engineering, mechanical engineering, industrial engineering, and electrical engineering, so many different skill sets are needed and you will see different perspectives. This project will require extensive review of the literature and performing materials characterization, processing, manufacturing, and reliability experiments. Student researchers will learn a wide range of materials and mechanical property, processing, and characterization techniques and will work closely with faculty and graduate students from Materials Engineering and Mechanical Engineering.
To apply to a SCALE SURF project, go to the SURF website: https://engineering.purdue.edu/Engr/Research/EURO/SURF/Research/Y2023
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Preferred majors:
• Materials Engineering
• Mechanical Engineering
Required Experience and Skills:
Desired experience:
• Experience with programming in Python, C/C++, and/or MATLAB.
• Enthusiasm for scientific research.
• Understanding of introductory materials science and engineering concepts.
Academic Years Eligible:
Rising juniors and seniors with the desired experience will be preferred, but rising sophomores are also eligible to apply.
Research categories:
Advanced Packaging, Heterogeneous Integration, Material Processing and Characterization, Microelectronics
Preferred major(s):
- Materials Engineering
Desired experience:
• Experience with programming in Python, C/C++, and/or MATLAB.
• Enthusiasm for scientific research.
• Understanding of introductory materials science and engineering concepts.
School/Dept.:
Materials Engineering
Professor:
Carol
Handwerker
SCALE Heterogeneous Integration/ Advanced Packaging: Multi-Photon 3D-printed Nano Vertical Compliant Interconnects for sub-Micron Pitch
Description:
This project is one of several SCALE SURF research projects, and is restricted to US citizens. If you are interested in more than one SCALE SURF project, you can apply to all of them with one application. ** Be sure to address each project by name in your application. ** See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023.
Heterogeneous integration of different dielets (processor, memory, RF, etc.) has made rapid strides in the last decade driven by the development of three-dimensional (3D) integration, fan-out wafer-level packaging, and interposers. A key requirement of package scaling is the reduction of the I/O pitch, which requires elimination of solder and micro-solder bumps. Scaling of solder bumps below 40 µm pitch is challenging due to multiple issues, such as solder extrusion, bridging and intermetallic compound (IMC) formation. Therefore, micro and nano-Cu interconnects using Cu to Cu thermal compression bonding and hybrid bonding have been demonstrated for next generation heterogeneous integration. However, nano-Cu interconnects suffer from electromigration related failures at sub-micron pitch sizes. Here we propose Cu, Ag or cobalt composite with graphene or reduced graphene oxide for compliant and high conductivity interconnects. Graphene is a 2D array of sp2-bonded carbon atoms and is known to have extraordinary electrical and mechanical properties. The carrier mobility of graphene is 2.5 x 104 cm2V-1s-1 and the maximum current carrying capacity is up to 108 Acm-2, therefore, graphene-based materials show great potential for future interconnect technologies such as Cu-graphene or Co-graphene or Ag-graphene composites. SURF student will prepare Cu-graphene, Co-graphene, Ag-graphene composites and measure thermal conductivity using a TLM test structure. Multi-photon 3D printing will also be explored to define nanometer feature size. Future work will include effect of these composites on mechanical, thermal and electromigration properties.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Heterogeneous integration of different dielets (processor, memory, RF, etc.) has made rapid strides in the last decade driven by the development of three-dimensional (3D) integration, fan-out wafer-level packaging, and interposers. A key requirement of package scaling is the reduction of the I/O pitch, which requires elimination of solder and micro-solder bumps. Scaling of solder bumps below 40 µm pitch is challenging due to multiple issues, such as solder extrusion, bridging and intermetallic compound (IMC) formation. Therefore, micro and nano-Cu interconnects using Cu to Cu thermal compression bonding and hybrid bonding have been demonstrated for next generation heterogeneous integration. However, nano-Cu interconnects suffer from electromigration related failures at sub-micron pitch sizes. Here we propose Cu, Ag or cobalt composite with graphene or reduced graphene oxide for compliant and high conductivity interconnects. Graphene is a 2D array of sp2-bonded carbon atoms and is known to have extraordinary electrical and mechanical properties. The carrier mobility of graphene is 2.5 x 104 cm2V-1s-1 and the maximum current carrying capacity is up to 108 Acm-2, therefore, graphene-based materials show great potential for future interconnect technologies such as Cu-graphene or Co-graphene or Ag-graphene composites. SURF student will prepare Cu-graphene, Co-graphene, Ag-graphene composites and measure thermal conductivity using a TLM test structure. Multi-photon 3D printing will also be explored to define nanometer feature size. Future work will include effect of these composites on mechanical, thermal and electromigration properties.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Research categories:
Advanced Packaging, Heterogeneous Integration, Material Processing and Characterization, Microelectronics, Nanotechnology
Preferred major(s):
- Mechanical Engineering,
- Materials Engineering
- Chemical Engineering
Desired experience:
MSE230 or introductory materials course. Training will be provided on SEM and other tools needed.
School/Dept.:
School of Mechanical Engineering
Professor:
Shubhra
Bansal
SCALE Heterogeneous Integration/ Advanced Packaging: Next Generation Low Temperature Solders for Consumer and High Reliability Applications
Description:
This project is one of several SCALE SURF research projects, and is restricted to US citizens. If you are interested in more than one SCALE SURF project, you can apply to all of them with one application. ** Be sure to address each project by name in your application. ** See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023.
Low-melting point metals based on tin are used to connect semiconductor packages to circuit boards. The specific solder composition that is chosen for a product depends on the product's use conditions, for example, consider the differences in use conditions for a cell phone, an implanted pace maker, strapped onto a car engine, and in a satellite. While most solder alloys have melting points between 217 °C (high temperature Pb-free alloys) and 183 °C (Sn-Pb eutectic), a new generation of Sn-Bi solder alloys are being developed that have melting points around 139 °C to lower soldering processes in order to minimize warpage-induced asse mbly defects. This project explores the alloy design space for Sn-Bi alloys in terms of performance and manufacturing as a function of composition and application. We are collaborating in this research with a range of microelectronics companies, including Intel, Texas Instruments, Nvidia, AMD, and Macdermid Alpha. Student researchers will learn a wide range of materials and mechanical property, processing, and characterization techniques and will work closely with faculty and graduate students from Materials Engineering and Mechanical Engineering.
To apply to a SCALE SURF project, go to the SURF website: https://engineering.purdue.edu/Engr/Research/EURO/SURF/Research/Y2023
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Low-melting point metals based on tin are used to connect semiconductor packages to circuit boards. The specific solder composition that is chosen for a product depends on the product's use conditions, for example, consider the differences in use conditions for a cell phone, an implanted pace maker, strapped onto a car engine, and in a satellite. While most solder alloys have melting points between 217 °C (high temperature Pb-free alloys) and 183 °C (Sn-Pb eutectic), a new generation of Sn-Bi solder alloys are being developed that have melting points around 139 °C to lower soldering processes in order to minimize warpage-induced asse mbly defects. This project explores the alloy design space for Sn-Bi alloys in terms of performance and manufacturing as a function of composition and application. We are collaborating in this research with a range of microelectronics companies, including Intel, Texas Instruments, Nvidia, AMD, and Macdermid Alpha. Student researchers will learn a wide range of materials and mechanical property, processing, and characterization techniques and will work closely with faculty and graduate students from Materials Engineering and Mechanical Engineering.
To apply to a SCALE SURF project, go to the SURF website: https://engineering.purdue.edu/Engr/Research/EURO/SURF/Research/Y2023
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Research categories:
Advanced Packaging, Heterogeneous Integration, Material Processing and Characterization
Preferred major(s):
- Materials Engineering
- Mechanical Engineering
School/Dept.:
Materials Engineering
Professor:
Carol
Handwerker
SCALE Heterogeneous Integration/ Advanced Packaging: Reimagining Solder Joints Technology for Semiconductors by Using Dimensionality to Tailor Properties
Description:
This project is one of several SCALE SURF research projects, and is restricted to US citizens. If you are interested in more than one SCALE SURF project, you can apply to all of them with one application. ** Be sure to address each project by name in your application. ** See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023.
Semiconductor Research Corporation (SRC) identifies the need for solders with peak reflow temperature less than 140 ℃ for Si heterogeneous integration and high temperature solders for SiC heterogeneous integration. Sn-based solders have shown promise for low-temperature regime and Bi-based solders are promising for high temperature applications. Both these classes of solder materials have their own challenges. For fine pitch interconnects, conventional Sn-based solder materials suffer from drawbacks including die stress due to high reflow temperatures, intermetallic formation, Sn-whisker growth and electromigration. Bi-based solders suffer from wettability issues. Here we to propose to develop a disruptive approach to tailoring properties of solder materials by changing their structural dimensionality. For example, Melting point depression of 26.6 ℃ has been observed for SAC nanoparticles with an average diameter of 18 nm for extremely fine pitch 2-8 µm applications. However, the difficulty lies in the reflow process due to formation of oxide and thereby impeding the coalescence of molten core particles. Reducing fluxes and acidic treatments have proven to be promising for oxide removal, however, the acidity of solution can alter the particle size, morphology and package integrity. Our intent is to explore the effect of the number of atomic layers on solder properties, which can be translated into a commercial process, if successful. Precursor based solution processing can be used to process quantum dots, 1D, 2D structures of these solders that should conceptually result in suppression of melting temperature and reduction in Sn-whisker growth. In the proposed project we will study the effect of dimensionality on Sn-Ag-Cu, Sn-Bi, Sn-In low temperature and Bi-based high temperature solders. SURF student will develop proof-of-concept with commercially available Sn-Ag-Cu and Sn-Bi solder and use ion-milling to exfoliate monolayers of the material. The monolayers will be passivated with organic ligands and subsequently melting temperature will be measured using differential scanning calorimetry (DSC). We will collaborate with GE Global Research and University of Binghamton for development of Bi-based high temperature solders. Future work will include development of processing methods for dimensionally modified solders, integration, reliability studies, etc.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Semiconductor Research Corporation (SRC) identifies the need for solders with peak reflow temperature less than 140 ℃ for Si heterogeneous integration and high temperature solders for SiC heterogeneous integration. Sn-based solders have shown promise for low-temperature regime and Bi-based solders are promising for high temperature applications. Both these classes of solder materials have their own challenges. For fine pitch interconnects, conventional Sn-based solder materials suffer from drawbacks including die stress due to high reflow temperatures, intermetallic formation, Sn-whisker growth and electromigration. Bi-based solders suffer from wettability issues. Here we to propose to develop a disruptive approach to tailoring properties of solder materials by changing their structural dimensionality. For example, Melting point depression of 26.6 ℃ has been observed for SAC nanoparticles with an average diameter of 18 nm for extremely fine pitch 2-8 µm applications. However, the difficulty lies in the reflow process due to formation of oxide and thereby impeding the coalescence of molten core particles. Reducing fluxes and acidic treatments have proven to be promising for oxide removal, however, the acidity of solution can alter the particle size, morphology and package integrity. Our intent is to explore the effect of the number of atomic layers on solder properties, which can be translated into a commercial process, if successful. Precursor based solution processing can be used to process quantum dots, 1D, 2D structures of these solders that should conceptually result in suppression of melting temperature and reduction in Sn-whisker growth. In the proposed project we will study the effect of dimensionality on Sn-Ag-Cu, Sn-Bi, Sn-In low temperature and Bi-based high temperature solders. SURF student will develop proof-of-concept with commercially available Sn-Ag-Cu and Sn-Bi solder and use ion-milling to exfoliate monolayers of the material. The monolayers will be passivated with organic ligands and subsequently melting temperature will be measured using differential scanning calorimetry (DSC). We will collaborate with GE Global Research and University of Binghamton for development of Bi-based high temperature solders. Future work will include development of processing methods for dimensionally modified solders, integration, reliability studies, etc.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Research categories:
Advanced Packaging, Heterogeneous Integration, Material Processing and Characterization, Microelectronics
Preferred major(s):
- Mechanical Engineering
School/Dept.:
Mechanical Engineering
Professor:
Shubhra
Bansal
SCALE Heterogeneous Integration/ Advanced Packaging: Self-alignment Technology for 3D System Integration
Description:
This project is one of several SCALE SURF research projects. SCALE projects are restricted to students who are U.S. Citizens. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023.
For the typical 3D integration scheme, die-to-wafer bonding is a key technology that can enable the stacking of different chips, such as logic, memory, or power devices. Compared with wafer-to-wafer bonding, it is challenging for die-to-wafer bonding to achieve high throughput while maintaining a high alignment accuracy. Researchers have been investigating different self-alignment technologies to improve the high-precision chip alignment accuracy for die-to-wafer bonding, such as Surface tension-driven with hydrophilic chip surfaces. In this topic, we will explore innovative self-alignment methods for advanced die-to-wafer bonding, enabling high throughput heterogeneous integration.
Reference: Fukushima, Takafumi, et al. "Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration." 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). IEEE, 2011.)
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
For the typical 3D integration scheme, die-to-wafer bonding is a key technology that can enable the stacking of different chips, such as logic, memory, or power devices. Compared with wafer-to-wafer bonding, it is challenging for die-to-wafer bonding to achieve high throughput while maintaining a high alignment accuracy. Researchers have been investigating different self-alignment technologies to improve the high-precision chip alignment accuracy for die-to-wafer bonding, such as Surface tension-driven with hydrophilic chip surfaces. In this topic, we will explore innovative self-alignment methods for advanced die-to-wafer bonding, enabling high throughput heterogeneous integration.
Reference: Fukushima, Takafumi, et al. "Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration." 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). IEEE, 2011.)
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Research categories:
Advanced Packaging, Composite Materials and Alloys, Fluid Modelling and Simulation, Heterogeneous Integration, Material Modeling and Simulation, Material Processing and Characterization, Microelectronics, Nanotechnology, Thermal Technology
Preferred major(s):
- Electrical Engineering
- Mechanical Engineering
- Materials Engineering
Desired experience:
1. Microelectronics, micro/nanotechnology courses
2. Clean room fabrication experience
3. Enthusiasm for material fabrication and characterizations
4. Familiar with SEM, TEM analysis
5. Fluid mechanics
Academic Years Eligible:
Rising juniors and seniors with the desired experience will be preferred, but rising sophomores are also eligible to apply.
School/Dept.:
ME
Professor:
Tiwei
Wei
More information: https://alphalab-purdue.org/
SCALE Radiation Hardening: Radiation-effects testing
Description:
This project is one of several SCALE SURF research projects. By applying to this project, you can be considered for any of the SCALE projects with one application. See https://nanohub.org/groups/scale/research_su23 to view all of the SCALE SURF research projects for summer 2023. Please note that US citizenship is required to receive a SURF fellowship for this specific project.
Commercial off-the-shelf electronics are appealing for satellite applications because of their high capabilities (e.g., processing speed or memory). While they are generally tested for reliability for terrestrial applications, most manufacturers don’t have time to test or qualify them for space applications. In this project, we’ll select a novel commercial device to test, and develop a test procedure for testing. Last summer, our methodology was applied to a commercial magnetoresistive random access memory (MRAM) device, using a Gammacell chamber on campus. We will have the option to either extend that previous work or test a novel commercial device that has not been tested before.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Commercial off-the-shelf electronics are appealing for satellite applications because of their high capabilities (e.g., processing speed or memory). While they are generally tested for reliability for terrestrial applications, most manufacturers don’t have time to test or qualify them for space applications. In this project, we’ll select a novel commercial device to test, and develop a test procedure for testing. Last summer, our methodology was applied to a commercial magnetoresistive random access memory (MRAM) device, using a Gammacell chamber on campus. We will have the option to either extend that previous work or test a novel commercial device that has not been tested before.
In your application, please specify which of the SCALE technical areas you are most interested in. The technical areas are:
• Radiation Hardening
• System-on-Chip
• Heterogenous Integration/ Advanced Packaging
• Program Evaluation
Be sure to name any specific SCALE projects you are interested in, and include information about how you meet the required and desired experience and skills for each of these projects.
For US citizen students who are interested: you can become part of the Purdue microelectronics program called SCALE, sponsored by the Department of Defense. In SCALE, you will have opportunities for continuing research (paid or for credit) and industry and government internships throughout your time at Purdue. Please apply to SCALE here: https://research.purdue.edu/scale/.
Research categories:
Material Processing and Characterization, Microelectronics, Radiation Hardening
Preferred major(s):
- Electrical Engineering
- Computer Engineering
- Nuclear Engineering
- Materials Engineering
- Mechanical Engineering
Desired experience:
1. Experience with programming in Python, C/C++, and/or MATLAB
2. Enthusiasm for scientific programming. Understanding of radiation transport and electromagnetism.
School/Dept.:
Electrical & Computer Engineering
Professor:
Peter
Bermel
More information: https://research.purdue.edu/scale
Solution-phase chemistry to synthesize chalcogenide perovskites for photovoltaics applications
Description:
Chalcogenide Perovskites are an exciting class of semiconducting materials that may be useful in a variety of applications, including solar energy harvesting. These materials take an ABX3 composition where A is an alkaline earth metal (Ca, Sr, Ba), B is an early transition metal (Zr, Hf), and X is a chalcogen (S, Se). While preliminary work has shown that these materials have many interesting properties, the synthesis of these chalcogenide perovskites has proven to be very difficult, often requiring excessively high temperatures around 1000 C. Our group has recently made progress in developing lower-temperature methods (below 600 C) to make BaZrS3 and BaHfS3 using soluble molecules that contain bonds between the desired metal and chalcogen. However, this chemistry is relatively unexplored, and tuning the soluble molecules may enable other chalcogenide perovskites and related materials to be synthesized.
In this project, we will investigate the synthesis of new metal-chalcogen bonded molecules and investigate how changes in the structure of the molecules affect their solubility and decomposition. The student on this project will develop skills in chemical handling and synthesis, thin film fabrication, materials characterization, and laboratory safety. Specifically, they will get to work in gloveboxes and utilize techniques such as X-ray diffraction, Raman spectroscopy, and X-Ray fluorescence. Additionally, the student will learn how solution-based chemistry can be applied to the fabrication of solar cells and other semiconductor devices.
In this project, we will investigate the synthesis of new metal-chalcogen bonded molecules and investigate how changes in the structure of the molecules affect their solubility and decomposition. The student on this project will develop skills in chemical handling and synthesis, thin film fabrication, materials characterization, and laboratory safety. Specifically, they will get to work in gloveboxes and utilize techniques such as X-ray diffraction, Raman spectroscopy, and X-Ray fluorescence. Additionally, the student will learn how solution-based chemistry can be applied to the fabrication of solar cells and other semiconductor devices.
Research categories:
Energy and Environment, Material Processing and Characterization, Nanotechnology
Preferred major(s):
- Chemical Engineering
- Chemistry
- Materials Engineering
Desired experience:
General chemistry with lab
School/Dept.:
Chemical Engineering
Professor:
Rakesh
Agrawal
More information: https://engineering.purdue.edu/RARG/
Super-Resolution Optical Imaging with Single Photon Counting and Optomechanics with Nanostructured Membranes
Description:
Two projects are available. One involves the investigation of enhancing optical imaging resolution using single photon counting techniques. Conventional optical imaging has a hard limit on its spatial resolution, to about one half of the wavelength, and many situations can benefit from higher resolution. In addition, it is challenging to image through scattering media. By way of example, being able to sense with light deeper in the brain would be of enormous benefit in neuroscience. The statistics of photons emitted by or transmitted through an object contain valuable information about the object which could be used to enhance image resolution and possibly see through substantial background scatter. Experiments will be conducted using laser light and with a set of single photon avalanche detectors (SPADs) to measure photon correlations in time, over wavevector (direction), and between detectors in various imaging configurations. Results from these experiments will be used to assess the effectiveness of various techniques for enhancing spatial resolution in imaging applications. This work has a diverse set of potential applications including biological imaging, sensing defects in semiconductors, and imaging through fog. The other project relates to experimental work and the modeling of optical forces on structured membranes induced by a laser. The mechanical motion of a thin membrane deflected by laser light will be used to determine the membrane properties from experimental and simulated data. This will allow extraction of the mechanical material properties and more generally the validation of a theory for optomechanics that can then be used in design. The nascent field of optomechanics offers enormous impact scope, including remote actuation and propulsion, of importance in fields as diverse and molecular biology, communication, and transport. This project relates to attaining the underpinnings to move along such paths in engineering, as well as the basic physics of optical forces in material at small length scales.
Research categories:
Big Data/Machine Learning, Biological Characterization and Imaging, Biological Simulation and Technology, Composite Materials and Alloys, Deep Learning, Material Processing and Characterization, Medical Science and Technology, Nanotechnology
Preferred major(s):
- Electrical Engineering
- Mechanical Engineering
- Physics
- Biomedical Engineering
Desired experience:
Students with an interest in experimental or modeling work and some background in electromagnetics would be a good fit for this project. The undergraduate student will work with graduate students to perform experiments in an optics laboratory, modeling, data analysis using MATLAB or python, and review relevant literature.
School/Dept.:
Electrical Engineering
Professor:
Kevin
Webb
Sustainable Quench Oil Replacements for Austempering Salt Quenchants
Description:
Quench media are typically paraffinic oils, molten salts, or aqueous polymer-based fluids, depending on the quench speed and bath temperature needed. While beneficial, unfortunately, they have downsides that limit use. Paraffinic oils are petroleum derived which will become more problematic from a cost and regulatory perspective moving forward and generally do not have good high temperature stability. Salt baths work at high temperatures and are not petroleum-derived, but toxicity can be a concern. As always, corrosion can be problematic with any fluid. To solve these issues, others have researched natural oils as alternatives, such as vegetable oils from various sources. Unfortunately, oils are impure, heterogeneous, vary from source to source (and year to year), and most importantly, have residual double bonds and triglyceride esters that make them reactive. On the positive side, they are biobased, renewable, biodegradable, non-toxic and have relatively high flash points.
We propose to explore new quench oils specifically to replace salt baths in austempering applications. Salt baths pose sustainability and disposal issues, but austempering requires temperatures in excess of what most oils can bear. Ideally, we will identify quench oils with flash points up to 400 ºC, high heat capacities, high thermal conductivities, and that are non-corrosive. We will investigate natural oils and modern advanced oils (e.g. silicone, phosphate esters) as replacements using quench tests, thermal analysis and flash point measurement. This project is joint with Prof. Titus of MSE.
We propose to explore new quench oils specifically to replace salt baths in austempering applications. Salt baths pose sustainability and disposal issues, but austempering requires temperatures in excess of what most oils can bear. Ideally, we will identify quench oils with flash points up to 400 ºC, high heat capacities, high thermal conductivities, and that are non-corrosive. We will investigate natural oils and modern advanced oils (e.g. silicone, phosphate esters) as replacements using quench tests, thermal analysis and flash point measurement. This project is joint with Prof. Titus of MSE.
Research categories:
Ecology and Sustainability, Material Processing and Characterization
Preferred major(s):
- No Major Restriction
Desired experience:
none
School/Dept.:
MSE
Professor:
Jeffrey
Youngblood
Synthesis, processing, and characterization of next-generation sustainable polymers
Description:
Plastics are ubiquitous in many facets of our lives, and the plastics industry is the third-largest manufacturing sector in the United States. But as plastics production develops rapidly, the long-term environmental challenges are globally recognized. Chemically resistant plastic products have extremely long lifetimes before completely decomposing — a single-use coffee pod can last 500 years in a landfill. Plastic waste accumulation has led to pollution that affects land, waterways and oceans; organisms are being harmed by entanglement or ingestion.
Closed-loop circular utilization of plastics is of manifold significance, yet energy-intensive and poorly selective scission of the ubiquitous carbon-carbon (C-C) bonds in contemporary commercial polymers pose tremendous challenges to envisioned recycling and upcycling scenarios. Our group focuses on a unique topochemical approach for creating elongated C-C bonds with a bond length of 1.57~1.63 Å (in contrast to conventional bonds with a C-C bond length of ~1.54 Å) between repeating units in the solid state with decreased bond dissociation energies. These polymers with elongated and weakened C-C bonds exhibit rapid depolymerization within a desirable temperature range (e.g., 140~260 °C), while otherwise remaining remarkably stable under harsh conditions.
Students will get involved in the following research activities:
1. Synthesis of novel polymer single crystals via topochemical approach
2. Synthesis of polymers with elongated and weakened C-C bonds for circular utilization
3. Processing, characterization, and practical application of chemically recyclable (depolymerizable) polymer single crystals and polyolefin materials.
Closed-loop circular utilization of plastics is of manifold significance, yet energy-intensive and poorly selective scission of the ubiquitous carbon-carbon (C-C) bonds in contemporary commercial polymers pose tremendous challenges to envisioned recycling and upcycling scenarios. Our group focuses on a unique topochemical approach for creating elongated C-C bonds with a bond length of 1.57~1.63 Å (in contrast to conventional bonds with a C-C bond length of ~1.54 Å) between repeating units in the solid state with decreased bond dissociation energies. These polymers with elongated and weakened C-C bonds exhibit rapid depolymerization within a desirable temperature range (e.g., 140~260 °C), while otherwise remaining remarkably stable under harsh conditions.
Students will get involved in the following research activities:
1. Synthesis of novel polymer single crystals via topochemical approach
2. Synthesis of polymers with elongated and weakened C-C bonds for circular utilization
3. Processing, characterization, and practical application of chemically recyclable (depolymerizable) polymer single crystals and polyolefin materials.
Research categories:
Chemical Catalysis and Synthesis, Ecology and Sustainability, Energy and Environment, Material Processing and Characterization
Preferred major(s):
- No Major Restriction
School/Dept.:
Davidson School of Chemical Engineering
Professor:
Letian
Dou
More information: https://letiandougroup.com/
Thermally Responsive Smart Additives for PFAS-free Fire Fighting Foams.
Description:
The aim of this project is to develop FS-free FFF formulations that meet specifications by combining new siloxane-based surfactants with controlled release of additives. The objective here is to develop the chemistry and methodology to encapsulate foam formulation additives with “smart” temperature release capabilities with the goal of minimizing foam degradation. The lifespan of firefighting foams is typically increased via the addition of viscosifiers such as polysaccharides to reduce foam drainage, but the increase in viscosity can impede foam spreading. In this objective, we aim to solve these issues by encapsulating the viscosifiers into temperature releasing polymer matrices. We hypothesize that (hypothesis 1) viscosifiers can be successfully encapsulated in temperature-sensitive microcapsules and (hypothesis 2) the viscosifiers can be released during fire-fighting operations increasing foam viscosity and reducing foam degradation without impacting foam generation and spreading. This project is joint with Prof. Carlos Martinez and he will co-advise.
Research categories:
Ecology and Sustainability, Material Processing and Characterization
Preferred major(s):
- Materials Engineering
- Chemical Engineering
- Chemistry
Desired experience:
no experience necessary. Just thinking about about doing research as a career as a PhD.
School/Dept.:
School of Materials Engineering
Professor:
Jeffrey
Youngblood
More information: https://scholar.google.com/citations?user=qkkQBDsAAAAJ&hl=en