2005 Purdue–Silicon Valley Symposia

Electromagnetics for High-Frequency Circuit Applications

Professor Chappell will discuss the field of applied electromagnetics, specifically for enabling high-frequency circuits and systems. Applications from 1 to 100 GHz will be presented, along with methods for simulating and fabricating packages, antennas, filters, and embedded passives.

The field of electromagnetics has undergone a revolution in the past 10 years, and complicated three-dimensional problems can be solved and analyzed with relatively short timelines, allowing for full-wave design and not just analysis. In addition, novel fabrication techniques, such as free-form fabrication, allow for the fabrication of microscopic three-dimensional structures with tolerances applicable for high-frequency applications. This talk will discuss the power of combining new simulation tools with novel fabrication techniques.

William Chappell

Assistant Professor of Electrical and Computer Engineering, Purdue University

William Chappell graduated from the Radiation Laboratory at the University of Michigan with an emphasis on high-frequency circuits and electromagnetics. An assistant professor at Purdue, he is a head of the Integrated Designs of Electromagnetically Applied Systems (IDEAS) Laboratory. Research in this lab focuses on the integration of high-frequency circuits in advanced substrates through electromagnetic analysis.

He is currently co-PI (principal investigator) of two DARPA-sponsored projects that utilize nonstandard techniques for embedded components within packaged systems. He is currently co-PI on a DARPA project involving integrated filters and antennas for 20 GHz satellite communication systems utilizing periodic composite ceramics and polymer materials. In a related project he is co-PI on novel vertical integration schemes for silicon mixed-signal systems.

Other packaging-related projects Chappell is leading involve an NSF Sensors and Sensors Network project on the embedding of directional antennas within small form factor packages to maximize wireless channel performance. He also is PI on a project involving the design of the next generation of Automotive Satellite Radio with Delphi Corp. Additionally, he is involved in the creation of electrotextiles for flexible electronics and wearable computing and sensing.