A delegation from National Yang Ming Chiao Tung University (NYCU) visited Purdue in late April. The delegation included Chi-Hung Lin, president; Ta-Sung Lee, vice chancellor; Wensyang Hsu, vice president for international affairs; Hai-Dung (Haydn) Chen, chief strategy officer; Yi (Edward) Chang, dean of the International College of Semiconductor Technology; Yuan-Chen (Jack) Sun, dean of the Industry Academia Innovation School; Li-Chun Wang, dean of the College of Electrical and Computer Engineering; Yan-Cheng Kuan, associate professor in the International College of Semiconductor Technology; assistant professors Niall Tumilty and Yu Sjeng (Winston) Su, both in the International College of Semiconductor Technology; and Chiu-Yi (Cherrie) Chow, manager in the Office of International Affairs.

A delegation from Taiwan’s National Yang Ming Chiao Tung University (NYCU), led by President Chi-Hung Lin, visited Purdue University April 26-28 with a focus on strengthening the collaboration between Purdue and NYCU in semiconductor initiatives at both institutions.

Lin presents a gift to Arvind Raman, the John A. Edwardson Dean of the College of Engineering.

Also visiting were representatives from MediaTek USA, Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest semiconductor manufacturer, and administrators with the Taipei Economic and Cultural Office in Chicago. Purdue launched the Center for Secured Microelectronics Ecosystem (CSME) on the West Lafayette campus in April 2021 with support from TSMC.

During the visit, the delegation toured Discovery Park District and the Birck Nanotechnology Center. Jack Sun, dean of NYCU’s Industry Academia Innovation School, gave the Distinguished Lecture at the Birck NanoV Conference on April 26. Later that evening, NYCU President Chi-Hung Lin hosted a dinner with NYCU alumni.

On the morning of April 27, the visitors participated in the NYCU and Purdue Joint Advanced Nanoelectronics and Energy Materials Research Workshop where researchers from both universities and representatives from MediaTek and TSMC presented their recent research and identified potential collaboration opportunities. That afternoon, the delegation met Purdue President Mung Chiang to mark the signing of the Student Exchange Agreement between the two universities.

On the final day, the delegation met with John A. Edwardson Dean of the College of Engineering Arvind Raman, Purdue Chief Semiconductor Officer Mark Lundstrom and Michael and Katherine Birck Head of Electrical and Computer Engineering and Reilly Professor of Electrical and Computer Engineering Dimitri Peroulis, who was recently named as senior vice president for Purdue University Online, to discuss collaborations in developing semiconductor contents online, a joint research center and dual-degree programs. Both universities signed another memorandum of understanding to collaborate in online content and dual-degree programs.

The trip came on the heels of a visit to Taiwan by Purdue Engineering officials and Indiana Governor Eric Holcomb in which a memorandum of understanding was signed with NYCU to promote industrial upgrades and talent cultivation in both countries. 

Lin (center, left), Raman (center, right) and George Chiu, assistant dean for Global Engineering programs, shared information with the NYCU group and industry representatives from leading semiconductor companies TSMC Arizona and MediaTek USA.