Abstract

Nanolithography enables today’s intelligent society and extreme-ultraviolet (EUV) lithography is the latest enabling lithographic technology. ASML’s EUV exposure systems are being used in the high-volume production of leading-edge semiconductor logic and memory chips. In the words of Prof. Jesús del Alamo of MIT, “It’s an absolutely revolutionary product, a breakthrough that is going to give a new lease of life to the industry for years.” For this presentation, I will start with a history of the development of EUV lithography and then present the technology’s present status, including its use in the manufacture of logic integrated circuits. Finally, I will give a progress report on our next-generation EUV exposure systems and an outlook of EUV lithography for the remainder of this decade.

Biography

Anthony Yen is Vice President and Head of Technology Development Center at ASML, responsible for providing the company with mid- and long-term technology directions and developing enabling technologies in collaboration with customers, peers, universities, and IMEC. Prior to joining ASML, he headed Nanopatterning Technology Infrastructure Division at TSMC and played a key role in bringing EUV lithography, including its mask technology, to high-volume production. He received his undergraduate degree from Purdue and his mater’s, engineer’s, doctoral, and MBA degrees from MIT. He is a fellow of the IEEE and SPIE, and a recipient of Outstanding Electrical and Computer Engineer Award from Purdue’s School of Electrical and Computer Engineering. He serves on Purdue’s Semiconductor Degrees Leadership Board.

For questions please contact
Billie Johnson
bjbowles@purdue.edu
Project Manager for EVPSI