ASIP Consortium Kickoff Workshop - October 6-7, 2026

Registration

Purdue's Atalla Institute for Advanced System Integration and Packaging (ASIP) is building a new consortium that is bringing together globally preeminent memory and processor design and fabrication companies, fabless system integrators, equipment vendors, inspection tool developers, materials suppliers, electronic design automation (EDA) tool companies, Outsourced Semiconductor Assembly and Test (OSAT) providers, and university researchers to develop advanced system integration and packaging solutions for future computing and communication systems. More than 35 Purdue faculty researchers address the advanced packaging challenges at ASIP – one of the largest and most diverse groups of faculty researchers in advanced packaging in the US!