Six Purdue ECE alumni are being honored as the 2026 class of Outstanding Electrical and Computer Engineers (OECE), in recognition of their leadership, innovation, and lasting contributions to their fields.

The goal of the project is to create a system that can collect, share and analyze critical information in real time, even when cell towers, internet connections or other infrastructure are damaged or unavailable.

Muhammad Hussain, a professor in the Elmore Family School of Electrical and Computer Engineering, leads a team using AI to design a patent-pending device to improve the timeliness of epinephrine injections to treat anaphylaxis, an allergic reaction that can be sudden and potentially life-threatening.

Researchers from Purdue University's Elmore Family School of Electrical and Computer Engineering (ECE) are part of a national team working to accelerate the design of specialized microchips using artificial intelligence.

The Center for Secure Microelectronics Ecosystem (CSME) recently held its fifth Annual Review Meeting in Lafayette, Indiana, bringing together researchers, university partners, industry sponsors, and government stakeholders.

A compact lab developed at Purdue is giving students and aspiring semiconductor technicians hands-on experience with chipmaking equipment without requiring access to a multimillion-dollar cleanroom.

Boilermaker Circuit, one of the group career fairs that ECE’s Corporate Partners Program organizes specifically for ECE students, was held on September 17 in West Lafayette and September 18 in Indianapolis. The event drew representatives from 23 Corporate Partner companies, who engaged with about 600 students throughout the day about internships, co-op, and full-time positions.

IEEE ITSS is a global professional community dedicated to advancing intelligent technologies that make transportation safer, connected, and more efficient.

Purdue computer engineering is ranked No. 9 nationally, while electrical engineering is ranked No. 10. Both programs held their positions from the previous year.

The initiative between two powerhouse engineering schools will focus on semiconductor manufacturing sectors including semiconductor fabrication plants, equipment and materials; chip design, engineering, verification and testing; and advanced packaging.