ECE 59500 - Advanced Lithography

Lecture Hours: 3 Credits: 1

This is an experiential learning course.

Counts as:
CMPE Special Content Elective
EE Elective

Experimental Course Offered: Spring 2020

[MA 26200 or MA 26600] and [PHYS 27200 or PHYS 24100] and CHM 11500 and [ECE 59500 Microfabrication Fundamentals or (ECE 59500 MEMS I: Microfabrication and Materials for MEMS)

Requisites by Topic:
Differential equations, introductory physics (mechanics, electricity and magnetism), introductory chemistry.

Catalog Description:
Principles and methods of lithographic techniques used in semiconductor manufacturing as well as prototyping and production of nanometer-scale devices. Fundamental aspects of optical resolution, proximity effect, and resolution enhancement techniques.

Supplementary Information:
This course runs the second five weeks of the semester.

Required Text(s): None.

Recommended Text(s):
  1. Fabrication Engineering at the Micro- and Nanoscale, 4th Edition, Campbell, Stephen A., Oxford University Press, 2012, ISBN No. 9780199861224.
  2. Introduction to Semiconductor Manufacturing Technology, 2nd Edition, Xiao, Hong, SPIE Press, 2012, ISBN No. 9780819490926.

Learning Outcomes:

A student who successfully fulfills the course requirements will have demonstrated an ability to:
  1. describe physical phenomena associated with various advanced lithography processes. [4,7]
  2. quantitatively model basic lithography processes. [1,4,7]

Lecture Outline:

Week Topic
1 Optical resolution. Fourier optics and optical microscopy, spatial filtering and contrast in optical microscopy, optical proximity effect, extreme UV and x-rays. Chemistry of resist, chemical amplification.
2 Pattern generation; Electron-beam lithography, focused-ion lithography, proximal-probe lithography and laser interference lithography. Components of electron-beam lithography systems. Mask making and maskless lithography.
3 Pattern replication (I. optical). Optical systems for lithography: contact and near-field optical lithography, projection optical lithography. Resolution enhancement techniques including multiple-patterning.
4 Pattern replication (II. mechanical). Nanoimprint Lithography: thermal and step-and-flash. Soft-lithography and transfer printing. Registration and overlay techniques in lithography
5 Characterization at nanoscale. Surface profilometry, signals and noises in scanning-electron-beam systems, electron scattering and proximity effect, electron tunneling. Exam

Engineering Design Consideration(s):