ECE 59500 - Advanced Lithography


This course runs the second five weeks of the semester.

Course Details

Lecture Hours: 3 Credits: 1

This is an experiential learning course.

Counts as:

  • CMPE Special Content Elective
  • EE Elective

Normally Offered:

Spring - even years


[MA 26200 or MA 26600] and [PHYS 27200 or PHYS 24100] and CHM 11500 and [ECE 59500 Microfabrication Fundamentals or (ECE 59500 MEMS I: Microfabrication and Materials for MEMS)

Requisites by Topic:

Differential equations, introductory physics (mechanics, electricity and magnetism), introductory chemistry.

Catalog Description:

Principles and methods of lithographic techniques used in semiconductor manufacturing as well as prototyping and production of nanometer-scale devices. Fundamental aspects of optical resolution, proximity effect, and resolution enhancement techniques.

Required Text(s):


Recommended Text(s):

  1. Fabrication Engineering at the Micro- and Nanoscale , 4th Edition , Campbell, Stephen A. , Oxford University Press , 2012 , ISBN No. 9780199861224
  2. Introduction to Semiconductor Manufacturing Technology , 2nd Edition , Xiao, Hong , SPIE Press , 2012 , ISBN No. 9780819490926

Learning Outcomes:

A student who successfully fulfills the course requirements will have demonstrated an ability to:
  1. describe physical phenomena associated with various advanced lithography processes. [4,7]
  2. quantitatively model basic lithography processes. [1,4,7]

Lecture Outline:

Week Topic
1 Optical resolution. Fourier optics and optical microscopy, spatial filtering and contrast in optical microscopy, optical proximity effect, extreme UV and x-rays. Chemistry of resist, chemical amplification.
2 Pattern generation; Electron-beam lithography, focused-ion lithography, proximal-probe lithography and laser interference lithography. Components of electron-beam lithography systems. Mask making and maskless lithography.
3 Pattern replication (I. optical). Optical systems for lithography: contact and near-field optical lithography, projection optical lithography. Resolution enhancement techniques including multiple-patterning.
4 Pattern replication (II. mechanical). Nanoimprint Lithography: thermal and step-and-flash. Soft-lithography and transfer printing. Registration and overlay techniques in lithography
5 Characterization at nanoscale. Surface profilometry, signals and noises in scanning-electron-beam systems, electron scattering and proximity effect, electron tunneling. Exam

Engineering Design Consideration(s):

  • Economic
  • Environmental
  • Societal
  • Global

Assessment Method:

This course will be graded on homework, reports and exams.