ECE 59500 - Advanced Lithography
This course runs the second five weeks of the semester.
Lecture Hours: 3 Credits: 1
This is an experiential learning course.
- CMPE Special Content Elective
- EE Elective
Spring - even years
[MA 26200 or MA 26600] and [PHYS 27200 or PHYS 24100] and CHM 11500 and [ECE 59500 Microfabrication Fundamentals or (ECE 59500 MEMS I: Microfabrication and Materials for MEMS)
Requisites by Topic:
Differential equations, introductory physics (mechanics, electricity and magnetism), introductory chemistry.
Principles and methods of lithographic techniques used in semiconductor manufacturing as well as prototyping and production of nanometer-scale devices. Fundamental aspects of optical resolution, proximity effect, and resolution enhancement techniques.
- Fabrication Engineering at the Micro- and Nanoscale , 4th Edition , Campbell, Stephen A. , Oxford University Press , 2012 , ISBN No. 9780199861224
- Introduction to Semiconductor Manufacturing Technology , 2nd Edition , Xiao, Hong , SPIE Press , 2012 , ISBN No. 9780819490926
- describe physical phenomena associated with various advanced lithography processes. [4,7]
- quantitatively model basic lithography processes. [1,4,7]
|1||Optical resolution. Fourier optics and optical microscopy, spatial filtering and contrast in optical microscopy, optical proximity effect, extreme UV and x-rays. Chemistry of resist, chemical amplification.|
|2||Pattern generation; Electron-beam lithography, focused-ion lithography, proximal-probe lithography and laser interference lithography. Components of electron-beam lithography systems. Mask making and maskless lithography.|
|3||Pattern replication (I. optical). Optical systems for lithography: contact and near-field optical lithography, projection optical lithography. Resolution enhancement techniques including multiple-patterning.|
|4||Pattern replication (II. mechanical). Nanoimprint Lithography: thermal and step-and-flash. Soft-lithography and transfer printing. Registration and overlay techniques in lithography|
|5||Characterization at nanoscale. Surface profilometry, signals and noises in scanning-electron-beam systems, electron scattering and proximity effect, electron tunneling. Exam|
Engineering Design Consideration(s):
This course will be graded on homework, reports and exams.