ECE 59500 - MEMS I: Microfabrication and Materials for MEMS
This course is the first 1-credit module in a 3-module series that runs the first five weeks of the semester.
Lecture Hours: 3 Credits: 1
- EE Elective
- CMPE Special Content Elective
This course introduces the fundamentals of microfabrication used for wafer-scale manufacturing of Microelectromechanical Systems (MEMS). Borrowing some techniques from the integrated circuit (IC) fabrication and engineering new techniques to solve MEMS-specific challenges, MEMS microfabrication boasts an extensive toolbox employed both in research-level prototyping and in mass production in MEMS industry. The course reviews key methods for deposition, patterning, release, and packaging of MEMS devices. Considerations for benefits and levels of integration of MEMS and ICs are discussed. Micro-fabrication case studies of several MEMS devices are reviewed.
- No required text. Lecture notes provided.
- an ability to develop a viable micro-fabrication process to meet design specifications. [1,7]
- an ability to back-engineer process flows from known MEMS structures. [None]
- an ability to select materials appropriate for a particular microfabricated structure and process . 
- an understanding of metrology methods for MEMS microfabrication. 
|1||Intro to MEMS|
|2||Microfabrication basics: surface vs bulk, wafer scale|
|3||Deposition methods: PVD, CVD, thermal processes|
|4||Patterning techniques: contact, stepper, direct write, ebeam, lift-off|
|5||Etching methods: wet etching processes|
|6||Etching methods: dry etching - RIE, DRIE, XeF2|
|7||In-class fabrication exercise|
|8||Assembly: release & CPD, singulation, packaging, integration with IC|
|10||Material selection for MEMS|
Engineering Design Content:
- Establishment of Objectives and Criteria
Homework and exam