ECE 59500 - MEMS I: Microfabrication and Materials for MEMS

Note:

This course is the first 1-credit module in a 3-module series that runs the first five weeks of the semester.

Course Details

Lecture Hours: 3 Credits: 1

Areas of Specialization:

  • Microelectronics and Nanotechnology

Counts as:

  • EE Elective
  • CMPE Selective - Special Content

Normally Offered:

Each Fall

Campus/Online:

On-campus only

Requisites:

ECE 30500 and MA 26100 and MA 26500 and PHYS 27200

Catalog Description:

This course introduces the fundamentals of microfabrication used for wafer-scale manufacturing of Microelectromechanical Systems (MEMS). Borrowing some techniques from the integrated circuit (IC) fabrication and engineering new techniques to solve MEMS-specific challenges, MEMS microfabrication boasts an extensive toolbox employed both in research-level prototyping and in mass production in MEMS industry. The course reviews key methods for deposition, patterning, release, and packaging of MEMS devices. Considerations for benefits and levels of integration of MEMS and ICs are discussed. Micro-fabrication case studies of several MEMS devices are reviewed.

Required Text(s):

  1. No required text. Lecture notes provided.

Recommended Text(s):

None.

Learning Outcomes

A student who successfully fulfills the course requirements will have demonstrated:

  • an ability to develop a viable micro-fabrication process to meet design specifications
  • an ability to back-engineer process flows from known MEMS structures
  • an ability to select materials appropriate for a particular microfabricated structure and process
  • an understanding of metrology methods for MEMS microfabrication

Lecture Outline:

Lecture Topic
1 Intro to MEMS
2 Microfabrication basics: surface vs bulk, wafer scale
3 Deposition methods: PVD, CVD, thermal processes
4 Patterning techniques: contact, stepper, direct write, ebeam, lift-off
5 Etching methods: wet etching processes
6 Etching methods: dry etching - RIE, DRIE, XeF2
7 In-class fabrication exercise
8 Assembly: release & CPD, singulation, packaging, integration with IC
9 Microfabrication metrology
10 Material selection for MEMS

Assessment Method:

Homework and exam