Purdue to host CHIPS summit in Washington DC
In partnership with SEMI, Semiconductor Industry Association, Semiconductor Research Corp. and Global Semiconductor Alliance, Purdue University will this spring once again host a CHIPS summit in Washington, D.C., bringing together global allies as well as industry and academic stakeholders to examine wide-ranging solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
The daylong conference, named CHIPS for America: Execute for Global Success, will focus on U.S. competitiveness in semiconductor R&D and workforce in a global context.
The summit follows multiple academic achievements, global partnerships and industry collaborations announced by Purdue in this transformative era of semiconductors. Purdue continues to forge its international leadership in research, innovation and talent cultivation for the 21st century.
“We live in perhaps the most exciting time ever in terms of semiconductors and microelectronics,” said Vijay Raghunathan, Purdue’s vice president for global partnerships and programs, co-director of the university’s Semiconductor Degrees Program, and professor in the Elmore Family School of Electrical and Computer Engineering. “Despite the astounding, mind-boggling success that we’ve had with this technology for the past six decades or more, I think this is, as Purdue President Mung Chiang likes to call it, ‘our silicon moment.’”
The summit comes just two weeks after South Korea memory chipmaker SK hynix announced plans to construct a $4 billion advanced chip-packaging facility in the Purdue Research Park. The facility, focused on high-bandwidth memory (HBM) technology, would be responsible for advanced chip packaging — the stacking and connecting of multiple chips — to enable dramatically faster data-processing speeds in chips executing artificial intelligence workloads.
The project is expected to create nearly 1,000 new jobs in the West Lafayette area, with operations slated to begin in 2028.
The company said it selected Indiana due to access to Purdue’s semiconductor talent pipeline and research programs.
Kwak Noh-Jung, president and CEO of SK hynix, will give a keynote address at the summit.
Among the other speakers scheduled to speak at the summit:
- U.S. Sen. Todd Young of Indiana
- Arati Prabhakar, director, White House Office of Science and Technology Policy, and assistant to the president for science and technology
- Ambassador Sripriya Raganathan, chargé d’affaires, Embassy of India to the U.S.
- Alexander Tah-Ray Yui, representative to the U.S., Taipei Economic and Cultural Representative Office
- Hideaki Fujisawa, economic minister, Embassy of Japan in the U.S.
- The Honorable Ramin Toloui, assistant secretary for the Bureau of Economic and Business Affairs, U.S. Department of State
- Richard-Duane Chambers, director of policy and integration, CHIPS R&D Office
- Fran Dillard, chief diversity and inclusion officer, Micron
- Raj Jammy, president, U.S. operations, imec
- Ajit Manocha, president and CEO, SEMI
- Susan Margulies, U.S. National Science Foundation, Directorate for Engineering
- John Neuffer, president and CEO, Semiconductor Industry Association
- Huey-Jen Jenny Su, former president, Distinguished Professor of National Cheng Kung University, and chairman of NCKU Research and Development Foundation, Taiwan
- Todd Younkin, president and CEO, Semiconductor Research Corp.