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Sectioning

Preparing specimens for mounting and mechanical polishing often requires cutting material into smaller pieces. Diamond and grinding cutoff saws are used to section materials while still retaining a reasonably smooth cut surface, necessary for proper grinding and polishing. Band saws are used for rough cutting. Grinding saws do not actually "cut" materials, they grind through them. Grinding blades are brittle and excessive force should be avoided when using grinding saws.

Saw blades are provided by the department for lab users as part of the key fee for Teaching Lab use. Lab staff works hard to ensure that the labs are fully stocked at all times; however, if you notice the lab is running low on a consumable, notify a lab administrator.

Equipment

Band Saw

Grinding Saw

Diamond Saw