ECE 59500 - Introduction to Electronics Packaging and Heterogeneous Integration

Course Details

Lecture Hours: 3 Credits: 3

Areas of Specialization:

  • Microelectronics and Nanotechnology

Counts as:

Normally Offered:

Each Fall

Campus/Online:

On-campus and online

Catalog Description:

This course leverages both theoretical and laboratory-based instruction methods to introduce concepts needed for an introductory understanding of the design and characterization of modern electronic packages.

Course Objectives:

Upon completion of the course, a student will have an introductory understanding of electronic packaging and be able to apply the acquired knowledge to design and characterize heterogeneously integrated electronic systems.

Required Text(s):

None.

Recommended Text(s):

  1. Circuits Interconnections and Packaging of VLSI , H.B. Bakoglu , Addison-Wessley , 1990 , ISBN No. 9780201060089
  2. Design and Modelling for 3D ICs and Interposers , S. Madhavan and K.J. Han , World Scientific Publishing Company , 2013 , ISBN No. 9789814508599
  3. Fundamentals of Device and Systems Packaging: Technologies and Applications , Second Edition , R. Tummala , McGraw-Hill Publishing Company , 2019 , ISBN No. 9781259861550
  4. Fundamentals of Microsystems Packaging , R. Tummala , McGraw-Hill Publishing Company , 2001 , ISBN No. 9780071371698
  5. High Speed Signaling: Jitter Modelling Analysis and Budgeting , K.S. Oh and X. Yuan , Prentice Hall , 2012 , ISBN No. 9780132826914
  6. Power Integrity Modeling and Design for Semiconductors and Systems , S. Madhavan and E. Engin , Prentice Hall , 2008 , ISBN No. 9780136152064

Learning Outcomes

A student who successfully fulfills the course requirements will have demonstrated an ability to:

  • Introduce and motivate heterogeneous integration
  • Model and characterize electrical, mechanical, and thermal behavior
  • Understand material science and materials selection
  • Understand manufacturing processes relevant to electronic packaging
  • Develop statistical and data models to describe electronic package failure
  • Explain radiation hardening and its impact on electronics packaging

Lecture Outline:

1 Topic
1 Overview of electronics packaging
2 Electrical design and characterization
3 Thermal design and characterization
4 Mechanical design and characterization
5 Material selection and characterization
6 Package fabrication
7 Statistical modeling and data analysis
8 Radiation hardening

Assessment Method:

Quizzes, lab assignments, final exam