Reliability Physics of Advanced IC Packagine
ECE59500/ME59700
Credit Hours:
1Learning Objective:
After successfully completing this course, you should be able to:
- Identify the evolution of advanced packaging techniques and materials, including interposers, TSVs, hybrid bonding, fan-out, and embedded packaging.
- Recognize key electrical reliability challenges in advanced packaging, such as electro-thermal crosstalk, dielectric breakdown, and corrosion.
- Remember mechanical reliability challenges like thermal stress and impact of material selections.
- Synthesize knowledge across packaging materials, processes, reliability physics, and characterization to gain a holistic understanding of advanced packaging reliability.
Description:
This course covers the latest developments and challenges in advanced packaging technologies, such as 2.5D, 3D, fan-out, and embedded packaging. The course will introduce the process, materials, and design aspects of these technologies, as well as the principle of material selection for low temperature and low CTE applications. the course will also address the electrical and mechanical reliability issues in advanced packaging, such as electro-thermal cross-talk, dielectric breakdown, electrochemical corrosion, thermal stress, and interconnection failures. the course will provide students with a comprehensive understanding of the state-of-the-art and future trends in advanced packaging, as well as the skills and knowledge to design, analyze, and optimize packaging solutions for various applications.
Topics Covered:
| Week | Modules to Work On | Assignments/Quizzes |
|---|---|---|
| Week 1 |
Module 1: Introduction to Advanced Packaging Module 2: Manufacturing Advanced Packaging |
|
| Week 2 |
Module 3: Mechanical Reliability Stress and Strain |
|
| Week 3 |
Module 4: Electrical Reliability Challenges Part 1 |
|
| Week 4 |
Module 4: Electrical Reliability Challenges Part 1 Module 5: Electrical Reliability Challenges Part 2 |
|
| Week 5 |
Module 5: Electrical Reliability Challenges: Part 2 |
|
Web Address:
https://purdue.brightspace.com
Homework:
AI Enhanced Journal Discussion (25%) - The AI enhanced journal discussion is designed to do two things. Help you interact with other students in this class and help you explore new developments and theories within the ever-changing realm of advanced IC packaging. You are required to select a peer-reviewed journal article published within the last five years that explores a topic related to chip design, specifically focusing on an area that affects chip reliability (e.g., thermal management, electromigration, moisture ingress, mechanical stress, etc.). Use databases like IEE Xplore, Science Direct, or the university library to locate an appropriate article. You'll use AI to summarize the key points of the article. You'll pinpoint areas that are missing including but not limited to gaps and omissions, technical components, and the connections it has to this class. You'll post your responses (and a copy of the article) in the Brightspace discussion board and are required to respond to at least two of your peers. A rubric and further instructions for this assignment can be found in Brightspace.
Projects:
Simulation (25%) - Your final project is to apply what you've learned by using PdeMaker in MATLAB to simulate temperature distribution, mechanical stress, and more on a 1D or 2D IC package. A rubric and further instructions for this assignment can be found in Brightspace.
Exams:
Quizzes (50%) - Quizzes make up 50% of your grade. Each quiz is tied directly to a lecture(s). You have multiple attempts to answer these quizzes. Your highest attempt will be stored in the gradebook. You are allowed to take these quizzes while you are watching the videos and/or use your notes. You are NOT permitted to use AI to answer these questions. The goal of these quizzes is to test your comprehension of key ideas shared in each video.
Textbooks:
There is no required textbook for this course.
Computer Requirements:
MATLAB Online. This resource is provided free to all students at Purdue University. To get started using this tool, navigate to MATLAB Access for Purdue University. You'll have to sign up for an account, using your Purdue email address (if you have not yet done that). This course will offer a tutorial on how to use PdeModeler (an app within MATLAB).