Intro to Electronics Packaging and Heterogeneous Integration
This course leverages both theoretical and laboratory-based instruction methods to introduce concepts needed for an introductory understanding of the design and characterization of modern electronic packages. The course is based on a 15-week online module delivery format for both lectures and labs.
ECE59500/ME597000
Credit Hours:
3Learning Objective:
Upon completion of the course, a student will have an introductory understanding of electronic packaging and be able to apply the acquired knowledge to design and characterize heterogeneously integrated electronic systems.A student who successfully fulfills the course requirements will have demonstrated an ability to:
- Introduce and motivate heterogeneous integration
- Model and characterize electrical, mechanical, and thermal behavior
- Understand material science and materials selection
- Understand manufacturing processes relevant to electronic packaging
- Develop statistical and data models to describe electronic package failure
- Explain radiation hardening and its impact on electronics packaging
Description:
This course leverages both theoretical and laboratory-based instruction methods to introduce concepts needed for an introductory understanding of the design and characterization of modern electronic packages. The course is based on a 15-week online module delivery format for both lectures and labs.
Topics Covered:
| Topic | |
|---|---|
| 1 | Overview of electronics packaging |
| 2 | Electrical design and characterization |
| 3 | Thermal Design and characterization |
| 4 | Mechanical design and characterization |
| 5 | Material selection and characterization |
| 6 | Package fabrication |
| 7 | Statistical modeling and data analysis |
| 8 | Radiation hardening |
Homework:
Quizzes and Lab AssignmentsExams:
Final ExamTextbooks:
Recommended texts:
- Circuits Interconnections and Packaging of VLSI, H.B. Bakoglu, Addison-Wessley, 1990, ISBN No. 9780201060089
- Design and Modelling for 3D ICs and Interposers, S. Madhavan and K.J. Han, World Scientific Publishing Company, 2013, ISBN No. 9789814508599
- Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, R. Tummala, McGraw-Hill Publishing Company, 2019, ISBN No. 9781259861550
- Fundamentals of Microsystems Packaging, R. Tummala, McGraw-Hill Publishing Company, 2001, ISBN No. 9780071371698
- High Speed Signaling: Jitter Modelling Analysis and Budgeting, K.S. Oh and X. Yuan, Prentice Hall, 2012, ISBN No. 9780132826914
- Power Integrity Modeling and Design for Semiconductors and Systems, S. Madhavan and E. Engin, Prentice Hall, 2008, ISBN No. 9780136152064