Integrated Circuit/MEMS Fabrication Lab
Pre-requisite: Knowledge of semiconductor devices
ECE59500
Credit Hours:
3Description:
This course is an updated version of ECE 55700 and will provide students state-of-the-art knowledge in the area of Micro and Nanofabrication Technology. Course topics include substrate, oxidation, lithography, etching (dry and wet), thin film deposition (physical vapor deposition, chemical vapor deposition, atomic layer deposition, epitaxy), diffusion and ion implantation, chemical mechanical polishing, metallization, packaging and integration. The course will include both lectures and hands-on training.
Topics Covered:
| Week | Topic |
|---|---|
| 1 | Intro to MEMS and non-MOS devices |
| 2 | MOS devices |
| 3 | Substrate engineering |
| 4 | Oxidation |
| 5 | Diffusion and ion implantation |
| 6 | Lithography |
| 7 | Etching |
| 8 | Lab on safety training |
| 9 | Lab on oxidation, TEOS and poly deposition (MOSCAP and MEMS cantilever) |
| 10 | Thin film deposition |
| 11 | Lab on MOSCAP and MEMS cantilever fabrication (Lithography), RIE, VHF or BOE based etching of released cantilevers) |
| 12 | Back end technology |
| 13 | Integration strategy |
| 14 | Lab on MOSCAP and MEMS cantilever fabrication (RIE for both, VHF or BOE based etching of released cantilevers) |
| 15 | Lab on MOSCAP characterization |
Web Address:
https://purdue.brightspace.com
Textbooks:
Required:
- Silicon VLSI Technology: Fundamentals, Practice, and Modeling, Plummer, James D.; Michael; Griffin, Peter, B., Pearson, July 2000, ISBN No. 978-0130850379