The continuous scaling of transistor density, as predicted by Moore’s Law, has led to high-density computing and artificial intelligence applications approaching elevated heat-flux levels. This increase poses a significant threat to device lifespan, as semiconductor reliability typically decreases by approximately 50% for every 10 0C increase in operating temperature. To handle these thermal challenges, the industry is rapidly transitioning from conventional air cooling to liquid-cooling strategies, with a particular emphasis on single-phase immersion cooling (SPIC).

 

Despite these advancements, thermal interface materials (TIMs), which are important for connecting heat-generating components to heat sinks, remain a primary source of incompatibility in submerged systems. The performance of conventional TIMs, such as flowable greases, phase-change materials, and metallic alloys, is constrained by inherent thermomechanical weaknesses, including pump-out, dry-out, and interface void formation. In addition, extended exposure to dielectric fluids introduces largely unquantified chemical degradation risks, as solvent-induced matrix dissolution and filler agglomeration can break down the thermal percolation network. This study focuses on the essential performance measures of TIMs, the main degradation mechanisms among different material categories, and the challenges posed by chemical instability in SPIC environments. Furthermore, it addresses the critical research gap in immersion reliability by applying a comprehensive metrological framework that leverages spectroscopic analysis and non-destructive imaging to assess interfacial degradation and support the development of chemically stable, low-resistance thermal architectures.