The ongoing advancement of high-performance computing and artificial intelligence is pushing the boundaries of heat flux in next-generation electronic devices, challenging the capabilities of conventional thermal management technologies, a challenge often referred to as the thermal “red brick wall.” Increasing heat generation makes it difficult to maintain acceptable operating temperatures, potentially compromising device reliability and service life. Semiconductor reliability typically decreases by approximately 50% for every 10℃ increase in operating temperature. These increasing thermal demands have accelerated the transition from conventional air cooling to liquid-based cooling methods, with single-phase immersion cooling (SPIC) emerging as a promising solution for heat management in high-power electronic systems.

 

 

Thermal interface materials (TIMs) play an essential role in reducing thermal resistance at the interfaces between heat-generating electronic components and heat sinks, thereby facilitating efficient heat transfer. However, exposure to different operating conditions and dielectric coolants can induce chemical, structural, and interfacial degradation, potentially compromising their thermal performance and long-term reliability. This study investigates the degradation of different types of TIMs under varying aging conditions and coolant environments. A comprehensive suite of characterization techniques, including spectroscopic analysis, microscopy, and nondestructive imaging, is employed to quantify material changes, identify degradation mechanisms, and evaluate interfacial integrity. This approach provides insights into the factors governing TIM degradation and contributes to the assessment of their reliability for single-phase immersion cooling applications.