Preliminary Seminar: Debargha Paul

Event Date: September 29, 2023
Time: 2:30pm
Location: ARMS 1109 or via WebEx
Priority: No
School or Program: Materials Engineering
College Calendar: Show

“Thermo Compression Bonding and Mechanical Behavior of Nanotwinned Cu”

Debargha Paul, MSE PhD Candidate 

Advisor: Professor Xinghang Zhang

WebEx Link


The exploration of smaller interconnect materials with minimum delays for applications in advanced packaging and integration has been one of the primary focuses of research in the packaging and integration aspects of the semiconductor industry. Thermocompression bonding of Cu has occupied a significant position in this regard. Nanotwinned Cu exhibits superior properties of high strength and ductility simultaneously with better electrical conduction. This report discusses the various aspects of research on thermocompression bonding of nanotwinned Cu and its mechanism along with its constraints and ways to overcome them. It also provides an overview of the mechanical behavior of nanotwinned Cu and its microstructures.

2023-09-29 14:30:00 2023-09-29 15:30:00 America/Indiana/Indianapolis Preliminary Seminar: Debargha Paul ARMS 1109 or via WebEx