Abstract

Understanding the failure mechanisms of materials at extreme condition is essential and at the same time challenging. There have been different approaches proposed over the years to studying materials response at extremely aggressive environment, for example high pressure, ultrahigh temperature. With the advent of high speed imaging systems and computer processing power, one can study the failure mechanisms at such a high events by carefully analyzing the digital images taken during testing. We used a digital image based approach to understand the fundamental deformation and failure mechanism of materials at different loading conditions, at different time and length scale and at range of temperatures. In this talk, our recent work progress will be highlighted and different examples, such as the compaction wave propagation and multiscale failure mechanisms in PBX, shock loading of rigid foams, the effect of strain rate on grain level deformation of polycrystalline metals and graded cellular materials and high temperature deformation of metals, will be presented.

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