ECE Seminar: Dr. Madhavan Swaminathan

Event Date: February 19, 2019
Speaker: Dr. Madhavan Swaminathan
Speaker Affiliation: Georgia Institute of Technology
Time: 1:30 pm
Location: POTR 234
Priority: No
School or Program: Electrical and Computer Engineering
College Calendar: Show

Dr. Madhavan Swaminathan
John Pippin Chair in Microsystems Packaging & Electronics
Director of Packaging Research Center
School of Electrical and Computer Engineering
Georgia Institute of Technology

Abstract
A combination of "Moore" (IC) and "More than Moore" (package) scaling has led to the shrinking of electronic systems over the last several decades. As scaling continues beyond CMOS to include advanced devices, scaling of the package and board needs to keep pace as well to enable further miniaturization. This requires new technologies for integration which when connected to SoC can lead to miniaturized solutions that have superior performance. Georgia Tech has pioneered package scaling using System on Package (SoP) based technologies over the last 25 years.

This presentation will cover the past, present and future in the field of packaging and package scaling based on the speaker’s interactions with industry, govt. labs, sponsoring agencies and academia over a period of two decades. As part of this presentation advanced SoP platforms with a focus on heterogeneity for a variety of applications that include power delivery, high speed signaling, radio integration, bio packaging, flexible IoT, THz communication and others will be discussed, including the role of machine learning in the design of such emerging systems.

Bio
Madhavan Swaminathan (Swami) is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and was recently appointed as Director of the Microsystems Packaging Research Center (PRC), the first NSF Engineering Research Center @ GT. He formerly held the positions of Founding Director, Center for Co-Design of Chip, Package, System (C3PS), Joseph M. Pettit Professor in Electronics (ECE) and Deputy Director of PRC. Prior to joining GT, he was with IBM working on packaging for supercomputers. He is the author of 450+ refereed technical publications, holds 30 patents, primary author and co-editor of 3 books, founder and co-founder of two start-up companies and founder of the IEEE Conference Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the Electronics Packaging Society (EPS). His research has been recognized through several GT and international awards. Forty two PhD and twenty MS students have graduated under his supervision. He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE EMC society. He received his B.E. degree in Electronics & Communication from NITT, India in 1985, MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.

2019-02-19 13:30:00 2019-02-19 14:30:00 America/Indiana/Indianapolis ECE Seminar: Dr. Madhavan Swaminathan POTR 234