Pat Trippel is President and CEO of Inventus Power. He is responsible for strategically leading the global enterprise to ensure Inventus Power is constantly innovating power systems and is at the forefront of thought leadership for their OEM and contract manufacturer customers across the consumer, commercial/industrial, medical, military, and government markets. Mr. Trippel has a distinguished career that spans over 30 years in the electronics manufacturing industry. Most recently, he was with H.B. Fuller Company as Senior Vice President Market Development. In this role, he was responsible for the company's Durable Assembly Business which included the Electronics and Engineering Adhesive businesses. Prior, Mr. Trippel was with Henkel Corporation as Senior Vice President and General Manager of the Global General Industries business and also served as the President and General Manager of Henkel's Global Electronic Materials business. He began his career with Universal Instruments Corporation in sales and was subsequently successful in numerous roles, including sales engineering, regional sales manager and Latin American operations manager. Mr. Trippel then joined Siemens AG where he held multiple leadership positions including Vice President and General Manager of their electronic assembly equipment business and President and CEO of the Siemens Dematic Electronic Assembly Systems. Mr. Trippel earned a BS in Industrial Engineering from Purdue University and has completed executive development programs at Harvard University, Duke University, University of Chicago, IMD in Switzerland and IESE in Spain.