Gary Cheng Issued Patent for New Laser Shock Peening Methods
Professor of Industrial Engineering, Gary Cheng, and his team have been awarded a patent by the US Patent and Trademark Office.
According to Cheng, the new laser shock peening amethods developed by Cheng and his team are aimed at "enhancing material's surface strength, improving the material's cyclic and thermal stability of microstructures, extending the material's fatigue performance, and increasing the productivity of laser shock peening process significantly."
This new method and apparatuses will have applications in aerospace, navy and the defense industry. For full details regarding this patent visit the link below.
Laser Shock Peening Apparatuses and Methods