The ASIP institute will address the challenges to research, "lab-to-fab" translation and workforce necessary to build the future microelectronic systems. The challenges include system architectural and physical design enabled by multiphysics modeling tools, high-density interposers and substrates, process development for interconnect pitch scaling, and thermal solution design, all while meeting the reliability and manufacturing yield goals. The ASIP institute will bring together integrated device manufacturers, fabless companies, EDA companies, equipment vendors, materials suppliers, OSATs, and university academics to develop advanced system integration and packaging solutions.

The Center for Heterogeneous Integration Research on Packaging (CHIRP) is co-directed by Ganesh Subbarayan of Purdue and Bahgat Sammakia of SUNY Binghamton. CHIRP’s mission is to enable the building of future Systems-in-Package through Heterogeneous Integration. The areas of CHIRP research focus include design enablement, global interconnects, power delivery, thermal management, modeling, metrology, and reliability that together optimally address the power, performance, area and cost metrics of systems. CHIRP also works to educate engineers who can design and build heterogeneously integrated systems. The center was established in 2019 with support from ARM, Intel, IBM, Mediatek, NXP, Samsung, and Texas Instruments, and has since funded over $6M in projects. CHIRP engages nearly 20 investigators from Purdue and SUNY Binghamton. The details on impact and industry engagement of CHIRP are at https://www.src.org/program/grc/chirp/.

The Center for Secure Microelectronics Ecosystem (CSME) at Purdue University is at the forefront of securing America’s microelectronics supply chain—an essential foundation for national security, economic prosperity, and technological innovation. CSME brings together a powerful coalition of academia, industry leaders, and government agencies to tackle security risks across the entire lifecycle of semiconductor devices, from initial design to fabrication, packaging, assembly, and system deployment.

By fostering trusted partnerships and pioneering new methods for secure design and manufacturing, CSME strengthens the resilience and trustworthiness of critical electronic components that power everything from consumer electronics to defense systems. The Center's work spans not only advanced research but also infrastructure development, supporting fabrication and testing in trusted environments.

The Cooling Technologies Research Center (CTRC) is a graduated National Science Foundation Industry/University Cooperative Research Center and addresses pre-competitive, longer-term research and development issues in the area of high-performance heat removal from compact spaces.

SCALE will provide unique courses, mentoring, internship matching and targeted research projects for college students interested in three microelectronics specialty areas: radiation-hardening, heterogeneous integration/advanced packaging, and system on a chip.

The Center for Brain-inspired Computing (C-BRIC) is funded by SRC and DARPA under the JUMP center program. Led by Kaushik Roy (Director) and Anand Raghunathan (Associate Director), C-BRIC has a mission to deliver key advances in cognitive computing that will enable a new generation of autonomous intelligent systems such as self-flying drones and interactive personal robots. C-BRIC is led by Purdue and includes researchers from 11 universities working on neuro-inspired algorithms and theory, neuromorphic computing fabrics and distributed intelligence. C-BRIC brings together experts from machine learning, computational neuroscience, theoretical computer science, integrated circuits and systems, distributed computing, robotics and autonomous systems to pursue improvements in cognitive systems that are difficult for these communities to achieve independently.

nanoHUB.org is the premier place for computational nanotechnology research, education, and collaboration. Our site hosts a rapidly growing collection of Simulation Programs for nanoscale phenomena that run in the cloud and are accessible through a web browser. nanoHUB also provides a vast array of resources that help users learn about our simulation programs and about nanotechnology in general. We offer a venue to explore, collaborate, and publish new content.

The Purdue Quantum Science and Engineering Institute was established at Purdue University to develop practical and impactful aspects of quantum science. Led by Yong Chen, the Institute focuses on discovering and studying new materials and basic physical quantum systems that will be best suited for integration into tomorrow's technology. PQSEI encourages interdisciplinary collaboration leading to the design and realization of industry-friendly quantum devices with enhanced functionality and performance close to the fundamental limits in order to produce systems based on these devices that will impact a vast community of users. The Institute works to train the next generation of quantum scientists and engineers in order to meet the growing quantum workforce demands.

The Krach Institute for Tech Diplomacy at Purdue leverages the expertise of Purdue University and diplomatic leaders to bridge the knowledge and experience gaps between innovators and policymakers. The Institute’s objective is to ensure that leaders of the United States and like-minded nations are able to understand critical emerging technologies and make informed laws and policy decisions.

Purdue University is building a world-leading program in artificial intelligence (AI). Leveraging Purdue's signature strengths in materials science, engineering, microelectronics, computer science and life sciences, the Institute for Physical AI (IPAI) is committed to solving the world's toughest challenges.

In a significant step forward for Semiconductors@Purdue, the U.S. National Science Foundation (NSF) selected the Purdue-led Chipshub powered by Purdue’s groundbreaking nanoHUB to support chip design teaching and research in a wide range of educational institutions across the U.S. This newly designated NSF Chip Design Hub will install, deploy for access, and support electronic design automation (EDA) tools for the semiconductor community and reduce barriers for entry. The hub’s academic team will also develop curricula for students at a variety of different kinds of universities. Prominent EDA vendors, such as Cadence, Synopsys, Siemens, Keysight, Ansys and Luceda will supply free licenses to enable any U.S. higher education institution to perform chip design on Chipshub. The five-year goal is to expand academic classroom use to 100 universities, with the NSF Chip Design Hub open to all U.S. institutions of higher learning. Contact Professor Gerhard Klimeck (gekco@purdue.edu) for more information.