Institute for Advanced System Integration and Packaging

The ASIP institute will address the challenges to research, "lab-to-fab" translation and workforce necessary to build the future microelectronic systems. The challenges include system architectural and physical design enabled by multiphysics modeling tools, high-density interposers and substrates, process development for interconnect pitch scaling, and thermal solution design, all while meeting the reliability and manufacturing yield goals. The ASIP institute will bring together integrated device manufacturers, fabless companies, EDA companies, equipment vendors, materials suppliers, OSATs, and university academics to develop advanced system integration and packaging solutions.


Center for Heterogeneous Integration Research on Packaging

The Center for Heterogeneous Integration Research on Packaging (CHIRP) is co-directed by Ganesh Subbarayan of Purdue and Bahgat Sammakia of SUNY Binghamton. CHIRP’s mission is to enable the building of future Systems-in-Package through Heterogeneous Integration. The areas of CHIRP research focus include design enablement, global interconnects, power delivery, thermal management, modeling, metrology, and reliability that together optimally address the power, performance, area and cost metrics of systems. CHIRP also works to educate engineers who can design and build heterogeneously integrated systems. The center was established in 2019 with support from ARM, Intel, IBM, Mediatek, NXP, Samsung, and Texas Instruments, and has since funded over $6M in projects. CHIRP engages nearly 20 investigators from Purdue and SUNY Binghamton. The details on impact and industry engagement of CHIRP are at

New Limits

New Materials for Logic, Memory and Interconnects

The NEW Materials for LogIc, Memory and InTerconnectS (NEW LIMITS) center is directed by Zhihong Chen. The NEW LIMITS center’s vertically integrated mission is to develop synthesis, integration, and evaluation schemes for new materials that will be used in unique logic, memory, and interconnect applications to enable novel computing and storage paradigms beyond the capabilities of conventional CMOS. The key idea is to utilize the properties of two dimensional (2D) material systems that are NON-EXISTENT in traditional 3D materials to achieve the performance or realize the novel functionalities that existing technologies are not able to offer.  The NEW LIMITS center covers the following research vectors: novel computing paradigms, device, interconnect, and materials research, advanced manufacturing and nanofabrication, innovative metrology and characterization, and computational models.


Center for Secure Microelectronics Ecosystems

The Center for a Secure Microelectronics Ecosystem (CSME) was launched with support from founding companies TSMC and Synopsys in conjunction with support through a U.S. Department of Defense (DOD)-funded workforce development program. CSME is co-directed by Joerg Appenzeller and Anand Raghunathan. CSME is a first-of-its-kind global partnership of academia, industry, and government to advance research and workforce development in designing secure microelectronics. Its aim is to enable the creation of secure semiconductor chips and related products, from the foundry to the packaged system, based on a zero-trust model. CSME will provide advanced training opportunities to SCALE participants, while SCALE will support CSME through graduate traineeships, addressing the urgent need for engineering graduates with secure microelectronics skills.


Cooling Technologies Research Center

The Cooling Technologies Research Center (CTRC) is a graduated National Science Foundation Industry/University Cooperative Research Center and addresses pre-competitive, longer-term research and development issues in the area of high-performance heat removal from compact spaces.


Scalable, Asymmetric Life-Cycle Engagement

SCALE will provide unique courses, mentoring, internship matching and targeted research projects for college students interested in three microelectronics specialty areas: radiation-hardening, heterogeneous integration/advanced packaging, and system on a chip.


Center for Brain-Inspired Computing

The Center for Brain-inspired Computing (C-BRIC) is funded by SRC and DARPA under the JUMP center program. Led by Kaushik Roy (Director) and Anand Raghunathan (Associate Director), C-BRIC has a mission to deliver key advances in cognitive computing that will enable a new generation of autonomous intelligent systems such as self-flying drones and interactive personal robots. C-BRIC is led by Purdue and includes researchers from 11 universities working on neuro-inspired algorithms and theory, neuromorphic computing fabrics and distributed intelligence. C-BRIC brings together experts from machine learning, computational neuroscience, theoretical computer science, integrated circuits and systems, distributed computing, robotics and autonomous systems to pursue improvements in cognitive systems that are difficult for these communities to achieve independently.


Institute for Cognitive Computing

Advances in AI have been enabled in large part by improvements in computing systems. The next generation of AI will require unprecedented computation efficiency, robustness, adaptability to diverse applications and environments. We believe that cognitive computing platforms embodying the key principles of biological intelligence will be instrumental in enabling the next wave of pervasive AI. The institute aims to advance the field of cognitive computing through cross-layer innovation spanning brain-inspired computing models, algorithms, architecture, and hardware fabrics. The institute brings together faculty with diverse backgrounds to pursue these goals by facilitating collaborative research and training the next generation workforce in this critical domain.

nanoHUB is the premier place for computational nanotechnology research, education, and collaboration. Our site hosts a rapidly growing collection of Simulation Programs for nanoscale phenomena that run in the cloud and are accessible through a web browser. nanoHUB also provides a vast array of resources that help users learn about our simulation programs and about nanotechnology in general. We offer a venue to explore, collaborate, and publish new content.


Purdue Quantum Science and Engineering Institute

The Purdue Quantum Science and Engineering Institute was established at Purdue University to develop practical and impactful aspects of quantum science. Led by Yong Chen, the Institute focuses on discovering and studying new materials and basic physical quantum systems that will be best suited for integration into tomorrow's technology. PQSEI encourages interdisciplinary collaboration leading to the design and realization of industry-friendly quantum devices with enhanced functionality and performance close to the fundamental limits in order to produce systems based on these devices that will impact a vast community of users. The Institute works to train the next generation of quantum scientists and engineers in order to meet the growing quantum workforce demands.

Krach Institute

The Krach Institute for Tech Diplomacy at Purdue leverages the expertise of Purdue University and diplomatic leaders to bridge the knowledge and experience gaps between innovators and policymakers. The Institute’s objective is to ensure that leaders of the United States and like-minded nations are able to understand critical emerging technologies and make informed laws and policy decisions.


Institute for Physical Artificial Intelligence

Purdue University is building a world-leading program in artificial intelligence (AI). Leveraging Purdue's signature strengths in materials science, engineering, microelectronics, computer science and life sciences, the Institute for Physical AI (IPAI) is committed to solving the world's toughest challenges.