MTEC wins awards at InterPACK 2017!
|Event Date:||September 1, 2017|
Professor Amy Marconnet wins the ASME Electronic & Photonic Packaging Division (EPPD) Woman Engineer of the Year Award for 2017 for her outstanding accomplishments and service to the field of electronics and photonics packaging. She is active on the K-16 Heat Transfer in Electronics Equipment committee within EPPD and ASME Heat Transfer Divsion.
David Gonzalez, Amy Marconnet, and Guillermo Panigua's paper on Inverse Metrology wins Outstanding Paper for the conference! The work focuses on using remote temperature measurements to identify hot spots within computer chips and cell phones for real-time thermal management. Details of the paper can be found at https://engineering.purdue.edu/MTEC/ConferencePapers/inverse-conduction-heat-transfer-and-kriging-interpolation-applied-to-temperature-sensor-locations-in-microchips.
— Purdue MechEngineers (@PurdueME) September 1, 2017
In addition, Professor Marconnet presented the lab's progress on thermal management of lithium ion batteries and helped organize a workshop on graduate student career choices.