Fall 2020 Conference Presentations
|Event Date:||October 1, 2020|
Prof. Marconnet has been invited as the track plenary speaker for the Heat Transfer and Thermal Engineering track for IMECE 2020. Check out her presentaion on “Engineering Materials for Thermal Challenges” on 11/17/2020 from 12:15PM - 1:00 PM. If you missed the talk, you can check it out here: https://youtu.be/svXl5ymBQt4
Prof. Marconnet will also be on two panels at InterPACK 2020. Check out her talks on the "Mobile, IoT and Compute Device Applications: Thermal and Mechanical Challenges" (Tuesday 10/27 at 1:50 pm eastern) and "Advances in Wearable/Wireless Flexible Electronics: Thermal and Mechanical Challenges and Opportunities" (Wednesday 10/28 at 12:10 pm eastern) panels.
Albraa Alsaati will present his work virtually at "Toward Embedded Immersion Cooling for Thermal Management in Heterogeneous Packaging" at InterPACK 2020.
Rajath Kantaraj will present his work on "Combined Experimental and Numerical Investigation of Microstructure of Squeezed Thermal Interface Materials (TIMs)" at Semi-THERM TTW