Phase Change Materials (PCMs) have emerged as a promising and innovative solution in the field of thermal management, offering a passive and efficient approach for thermal regulation in various applications. Although their thermal properties are often discussed as a major setback, their widespread adoption also requires consideration of integration strategies and a better understanding of device operation profiles.  This work explores the benefits, differences, and challenges of using PCM at the die-level and component-level as a thermal management solution. We find that die-level PCM integration has the benefit of reducing transient temperature fluctuations at short timescales but face major drawbacks inherently seen in PCMs. At the component-level, they function effectively as thermal stabilizers and shock absorbers, but require careful consideration of package geometry and device operation profiles.