NEWS & EVENTS

5.5.22
Purdue and Ivy Tech are partnering to meet the workforce needs in microelectronics
4.19.22
Purdue engineer focuses on the future of microelectronics now
4.7.22
SRC Selected by NIST’s Advanced Manufacturing Office to Define the Future of Microelectronics and Advanced Packaging Technology (MAPT)
4.7.22
Ganesh Subbarayan gives Distinguished Lecture at Georgia Tech's 3D Systems Packaging Center
3.23.22
Chip makers feel labor market squeeze
3.9.22
Holcomb takes part in manufacturing panel at White House
3.9.22
Remarks by President Biden in Roundtable With CEOs and Governors in Support of the Bipartisan Innovation Act
2.1.22
Purdue Aims to Support Microchip Manufacturing Workforce
1.11.22
Purdue-SRC partner in pursuit of advanced microelectronics, semiconductor workforce
12.2.21
Dean Chiang's Testimony to the U.S. House of Representatives: "Ensuring American Leadership in Microelectronics"
11.12.21
Microelectronics and Advanced Packaging Workforce Development Workshop
11.9.21
Center for Secure Microelectronics Ecosystem launched at Purdue with TSMC, Synopsys
11.8.21
Purdue to host Microelectronics and Advanced Packaging Workforce Development workshop
10.22.21
Our Silicon Moment
9.30.21
US innovation and manufacturing is vital for national and economic security
9.17.21
Purdue technology for downscaling transistors could advance semiconductor design
10.20.20
Purdue to lead national workforce development project on trusted microelectronics
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