In the development of silicon detector with higher granularity for better tracking seeding and vertexing, the resulting higher heat dissipation needs to be efficiently extracted to maintain the readout chip (ROC) at its preferred operation temperature and avoid thermal runaway. The structural materials thermally connect the sensors and ROCs to the mixed phase CO2 cooling pipes. It is crucial to fully characterize the thermal properties in all directions of the structural materials to accurately estimate the heat extraction and thermal risks within the tracking detector. This presentation will introduce research in my group focused on techniques we developed to understand the thermal properties in the unique formfactors required for tracking detector. For materials with highly anisotropic thermal conductivities such as carbon fiber laminates, we are able to characterize both cross-plane and in-plane thermal conductivity using different methods with high precisions. The cross-plane properties are measured using modified reference bar method with high resolution infrared microscope to record the temperature variation across the entire material surface. This method can also be used to study the interface resistance between materials. To understand the in-plane thermal conductivity of materials, our team developed a new technique to quantify thermal transport leveraging concepts from the Angstrom method and updating the technique with modern tools including infrared thermal imaging and physics-informed neural networks for robust data analysis. Overall, new thermal challenges arise in the design of the next generation tracking detector drive the development of new thermally-engineered materials and new metrology techniques to understand performance.