A Novel Thermal Isolation Method with Embedded ‘Glass Bridge’ Structures in Silicon-Based 2.5 D Heterogeneous Integration Systems
A Novel Thermal Isolation Method with Embedded ‘Glass Bridge’ Structures in Silicon-Based 2.5 D Heterogeneous Integration Systems
| Authors: | Z. Chen, Z. Xiong, K. Wang, A.M. Marconnet, and T. Wei
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| Journal: | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Paper URL: | Link to Full Text |
Z. Chen, Z. Xiong, K. Wang, A.M. Marconnet, and T. Wei, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas TX, 27 - 30 May 2025.
DOI: 10.1109/ECTC51687.2025.00157
Thermal crosstalk is a crucial thermal management challenge in modern high-density integration microelectronics systems. This work proposes a novel thermal isolation method using embedded glass as a thermal insulator to reduce in-plane thermal crosstalk within silicon-based systems with 2.5D heterogeneous integration. We designed and fabricated dual-chip thermal test vehicles to characterize the thermal performance of the proposed architecture under natural convection conditions. We measured the temperature distribution under various power densities ranging from 1.2 to 6.2 W/cm2 using a high-resolution infrared microscope. The thermal insulation performance was compared to a baseline sample with a solid silicon interposer. Results showed that the glass bridge architecture achieved approximately 20% higher thermal isolation performance compared to the baseline configuration across operational temperatures ranging from 40oC to 120oC.