News
SK hynix breaks ground on $4 billion advanced packaging production facility in Purdue Research Park
August 27, 2026
Purdue secures $19M from NSF to develop AI-driven programmable labs for semiconductors, advanced materials
August 05, 2026
Purdue researchers develop PROTEUS, a 'shape-shifting' chip for versatile edge AI
July 10, 2026
Purdue expands semiconductor professional education portfolio to advance global workforce development
July 08, 2026
Mark Lundstrom named dean of the College of Engineering
June 03, 2026
Raman confirmed as U.S. undersecretary of commerce for standards and technology; Lundstrom appointed dean of engineering
June 01, 2026
Purdue, GCCS partner to scale the future of silicon carbide
May 28, 2026
Mitch Daniels to serve as Purdue interim president
May 25, 2026
Purdue Trustees: President Chiang to depart for Northwestern University presidency
May 18, 2026
"A Chip Odyssey" brings Taiwan's semiconductor story to Purdue University
May 08, 2026
SCALE expands its national impact, becomes Purdue's largest federally funded research effort
May 06, 2026
In Print: 'Birck Builds the Future: Celebrating Twenty Years at Purdue University, 2005-2025'
April 13, 2026