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Thermal Interfaces
Liquid Metal Thermal Interface Materials with Acceptable Manufacturability and Reliability
Optimization of Thermal Interface Material’s Particle Featuresand Dispense Mechanism for Enhanced Heat Dissipation
Preventing Delamination Failure from Thermal Cycling of Model Thermal Interface Materials
Demonstration of a Compliant Micro-Spring Array as a Thermal Interface Material for Pluggable Applications
Fabrication of A Compliant Metallized Microstructure for Dry Contact Thermal Conductance Enhancement
TIM Design for Optimized Mechanical and Thermal Properties
Effects of Nanoparticle Size and Aggregation on Metal Nanoparticle-Polymer Thermal Interface Materials
Impedance-Based Visualization of Voids in Thermal Interface Materials
Thermal Design of Multilayer/Stacked Structures
Thermal Interface Materials Based on Graphene Networks
Flexible Foam New Thermal Interface Material
Compliant Thermal Interface Materials Using Graphene
Long-Term Reliability of Thermal Interface Materials
Graphene-based Thermal Interface Materials
Performance and Reliability Impact of Adhesive TIMs
High Performance, Low-Cost Thermoelectric Cooling Materials
Performance Improvement in Polymeric TIMs
Thermal Analog to AFM Force-Displacement
Carbon Nanotube Electrical Interfaces for Thermoelectrics
Characterization of Composite Heat Spreaders
Low-Temperature Synthesis and Bonding of CNT Thermal Interfaces
Thermomechanical Modeling of Thermal Contact Conductance
Particulate Thermal Interface Materials
Experimental Investigation of Thermal Contact Conductance