Thermal Interfaces Cooling Technologies Research Center  

Research
 

 











 

Thermal Interfaces

 
Thermal Interface Materials Based on Graphene Networks  
 
Transient Liquid Phase Sintering for Power Electronics
 
Flexible Foam New Thermal Interface Material
 
Compliant Thermal Interface Materials Using Graphene
 
Long-Term Reliability of Thermal Interface Materials
 
Graphene-based Thermal Interface Materials
 
Impedance-Based Visualization of Voids in Thermal Interface Materials
 
Performance and Reliability Impact of Adhesive TIMs  
 
High Performance, Low-Cost Thermoelectric Cooling Materials   Performance Improvement in Polymeric TIMs
 
Thermal Analog to AFM Force-Displacement
 
Carbon Nanotube Electrical Interfaces for Thermoelectrics
 
Characterization of Composite Heat Spreaders
 
Low-Temperature Synthesis and Bonding of CNT Thermal Interfaces  
 
Thermomechanical Modeling of Thermal Contact Conductance

Particulate Thermal Interface Materials

 
Experimental Investigation of Thermal Contact Conductance    
Cooling Technologies Research Center

CTRC Home | Purdue University | ME Home | Facebook | Linkedin
Electronics Cooling Lab | Solidification Heat Transfer Lab | Renewable and Sustainable Energy Technology and Policy

Copyright 2013, Purdue University, all rights reserved.
An equal access/equal opportunity university.
If you have trouble accessing this page because of a disability, please contact the consortium administrator at dkemeny@purdue.edu.