Cooling Technologies Research Center  

Research
 

 











 
 

 

SELECTED PUBLICATIONS (March 2014)

Click here for a complete chronological list of Dr. Garimella's publications in pdf format. Links to many of the papers are included below.  If you would like a copy of a paper that is not available online, please contact Dr. Suresh Garimella ( ResearcherID link) for a copy.


Review Articles Refrigeration
Roadmaps Jet Impingement
Microchannel Transport Thermal Contact Resistance
Electromechanical Microfluidic Actuation & Micropumps Heat Transfer Enhancement
Novel Microscale Diagnostics Phase Change Energy Storage and Metal Foams
Thin Film Transport and Heat Pipes  Solidification
Transport in Bubbles Plasmas
Piezoelectric Fans  Solar Thermal Storage
  Issued Patents from CTRC Research

Review Articles (return to top)

S.V. Garimella and T. Harirchian, Microchannel Heat Sinks for Electronics Cooling, Vol. 1 in the Encyclopedia of Thermal Packaging, World Scientific, Singapore, 2013 (248 pp., ISBN 978-981-4313-80-3).



S.V. Garimella, T. Persoons, J. Weibel, L.-T. Yeh, “Technological Drivers in Data Centers and Telecom Systems: Multiscale Thermal, Electrical, and Energy Management,” Applied Energy, Vol. 107, pp. 66-80, 2013.

V. Bahadur and S. V. Garimella, “Electrical Actuation-Induced Droplet Transport on Smooth and Superhydrophobic Surfaces,” International Journal of Micro-Nano Scale Transport, Vol. 1(1), pp. 1-26, 2010.

S. V. Garimella, “Small-Scale Solutions to Grand Challenges in Thermal Management,” Invited Lecture at the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2010), Leuven, Belgium, November 30-December 3, 2010.

T. Harirchian and S. V. Garimella, “Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding,” ASME Journal of Electronic Packaging Vol. 133, 011001, 2011.

S. V. Garimella and D. Liu, "Microscale Thermal Transport and Electromechanical Microfluidic Actuation," Journal of Enhanced Heat Transfer Vol. 16(3), pp. 237-266, 2009.

S. S. Bertsch, E. A. Groll, and S. V. Garimella, "Review and Comparative Analysis of Studies on Saturated Flow Boiling in Small Channels," Nanoscale and Microscale Thermophysical Engineering Vol. 12 (3), pp. 187-227, 2008.

B. D. Iverson and S. V. Garimella, "Recent Advances in Microscale Pumping Technologies: A Review and Evaluation," Microfluidics and Nanofluidics Vol. 5, pp. 145-174, 2008.

S. V. Garimella, V. Singhal and D. Liu, “On-Chip Thermal Management with Microchannel Heat Sinks and Integrated Micropumps,” Proceedings of the IEEE Vol. 94, No. 8, pp. 1534-1548, 2006.

S. V. Garimella, “Advances In Mesoscale Thermal Management Technologies for Microelectronics,” Microelectronics Journal Vol. 37, No. 11, pp. 1165-1185, 2006.

S. V. Garimella, “Transport in Mesoscale Cooling Systems,” Keynote Lecture, Symposium on Fundamental Issues and Perspectives in Fluid Mechanics, FEDSM2005-77325, ASME Fluids Engineering Summer Conference, Houston, TX, June 19-23, 2005.

V. Singhal, S. V. Garimella and A. Raman, “Microscale Pumping Technologies for Microchannel Cooling Systems,” Applied Mechanics Reviews, Vol. 57, No. 3, pp. 191-221, 2004.

S. V. Garimella and C. B. Sobhan, “Transport in Microchannels - A Critical Review,” Annual Review of Heat Transfer, Vol. 13, pp. 1-50, 2003.

P.-S. Lee and S. V. Garimella, “Experimental Investigation of Heat Transfer in Microchannels,” ASME Summer Heat Transfer Conference, HT2003-47293, Las Vegas, Nevada, July 21-23, 2003.

C. B. Sobhan and S. V. Garimella, “A Comparative Analysis of Studies on Heat Transfer and Fluid Flow in Microchannels,” Microscale Thermophysical Engineering, Vol. 5, No. 4, pp. 293-311, 2001.

S. V. Garimella and C. B. Sobhan, “Recent Advances in the Modeling and Applications of Nonconventional Heat Pipes,” Chapter 4, Advances in Heat Transfer, Vol. 35, pp. 249-308, 2001.

S. V. Garimella, “Heat Transfer and Flow Fields in Confined Jet Impingement,” Chapter 7, Annual Review of Heat Transfer, Vol. XI, pp. 413-494, 2000.

S. V. Garimella, “Recent Developments in High-Performance Cooling Techniques for Electronic Systems,” Keynote lecture, Thermal Management of Electronic Systems III,  J.P Bardon et al. (Eds.),  Elsevier, Paris, pp. 3-15, 1997.

S. V. Garimella, Flow Visualization Methods and Their Application in Electronic Systems, Chapter 10, Thermal Measurements in Electronics Cooling (K. Azar, ed.) CRC Press, 1997 .

S. V. Garimella, Enhanced Air Cooling of Electronic Equipment, Chapter 6, Air Cooling Technology for Electronic Equipment (S. J. Kim and S. W. Lee eds.) CRC Press, 1996 .

Roadmaps    (return to top)

S. V. Garimella, T. Persoons and L. T. Yeh, “Thermal Management Challenges in Telecommunications Systems and Data Centers,” IEEE Transactions on Components and Packaging Technologies, Vol. 2, No. 8, pp. 1307-1316, 2012.

S. V. Garimella, A. S. Fleischer, J. Y. Murthy, A. Keshavarzi, R. Prasher, C. Patel, S. Bhavnani, R. Venkatasubramanian, R. Mahajan, Y. Joshi, B. Sammakia, B. A. Myers, L. Chorosinski, M. Baelmans, P. Sathyamurthy, and P. Raad, "Thermal Challenges in Next Generation Electronic Systems," IEEE Transactions on Components and Packaging Technologies Vol. 31(4), pp. 801-815, 2008.

S. Krishnan, S. V. Garimella, G. Chrysler, and R. Mahajan, “Towards a Thermal Moore’s Law,”  IEEE Transactions on Advanced Packaging, Vol. 30 (3), pp. 462-474, 2007.

N. Kumari, S. Krishnan and S. V. Garimella, “Analysis and Performance Comparison of Competing Cooling Technologies for a Desktop Application,” The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK ’07), IPACK2007-33407, Vancouver, Canada, July 8-12, 2007.

L. Cremaschi, E. A. Groll and S. V. Garimella, “Performance Potential and Challenges of Future Refrigeration Systems for Electronics Cooling,” Thermal Challenges in Next-Generation Electronic Systems – THERMES II, Santa Fe, NM, January 7-10, 2007.

Y. K. Joshi and S. V. Garimella, “Thermal Challenges in Next Generation Electronic Systems,” Microelectronics Journal, Vol. 34, No. 3, p. 169, 2003.

S. V. Garimella, Y. K. Joshi, A. Bar-Cohen, R. Mahajan, K. C. Toh, V. P. Carey, M. Baelmans, J. Lohan, B. Sammakia, and F. Andros, “Thermal Challenges in Next Generation Electronic Systems - Summary of Panel Presentations and Discussions,” IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 4, pp. 569-575, 2002.

S. V. Garimella and Y. K. Joshi, “Contributions from Thermal Challenges in Next Generation Electronic Systems (THERMES),” IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 4, pp. 567-568, 2002.

Microchannel Transport   (return to top)

S. N. Ritchey, J. A. Weibel and S. V. Garimella, “Local Measurement of Flow Boiling Heat Transfer in an Array of Non-Uniformly Heated Microchannels,” International Journal of Heat and Mass Transfe, Vol . 71, pp. 206-216, 2014.

S. Sarangi, K. K. Bodla, S. V. Garimella, and J. Y. Murthy, “Manifold Microchannel Heat Sink Design Using Optimization Under Uncertainty,” International Journal of Heat and Mass Transfer, Vol. 69, pp. 92-105, 2014.

J. A. Weibel, S. Sarangi, and S. V. Garimella, “Pool Boiling Heat Transfer from Deformable Particulate Beds,” ASME Journal of Heat Transfer, Vol. 135 080908, 2013.

R.S. Patel and S.V. Garimella, “Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in Microchannel Flows,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2013-73057, Burlingame, CA, July 16-18, 2013.

S.N. Ritchey, J.A. Weibel, S.V. Garimella, “Effects of Non-Uniform Heating on Two-Phase Flow through Microchannels,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2013-73058, Burlingame, CA, July 16-18, 2013.

S.V. Garimella and T. Harirchian, Microchannel Heat Sinks for Electronics Cooling, Vol. 1 in the Encyclopedia of Thermal Packaging, World Scientific, Singapore, 2013 (248 pp., ISBN 978-981-4313-80-3).

S. Paranjape, S. N. Ritchey and S. V. Garimella, “Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows under Adiabatic Conditions,” International Journal of Multiphase Flow Vol. 42, pp. 175-183, 2012.

E. da Riva, D. Del Col, S. V. Garimella and A. Cavallini, “The Importance of Turbulence during Condensation in a Horizontal Circular Minichannel,” International Journal of Heat and Mass Transfer, Vol. 55, pp. 3470-3481, 2012.

T. Harirchian and S. V. Garimella, “Flow Regime-Based Modeling of Heat Transfer and Pressure Drop in Microchannel Flow Boiling,” International Journal of Multiphase Flow, Vol. 55, pp. 1246-1260, 2012.

T. Chen and S. V. Garimella, “A Study of Critical Heat Flux during Flow Boiling in Microchannel Heat Sinks,” ASME Journal of Heat Transfer , Vol. 134, 011504, 2012.

T. Chen and S. V. Garimella, “Local Heat Transfer Distribution and Effect of Instabilities during Flow Boiling in a Silicon Microchannel Heat Sink,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 3179-3190, 2011

T. Harirchian and S. V. Garimella, “Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding,” ASME Journal of Electronic Packaging Vol. 133, 011001, 2011.

S. Paranjape, S.N. Ritchey, and S.V. Garimella, “Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows,” The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK ’11), Portland, Oregon, July 6-8, 2011. 

R. Patel, T. Harirchian and S.V. Garimella, “Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink,”  The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK ’11), Portland, Oregon, July 6-8, 2011. 

E. Da Riva, D. Del Col, A. Cavallini and S. V. Garimella, “Simulation of Condensation in a Circular Minichannel: Application of VOF Method and Turbulence Model,” International Refrigeration and Air Conditioning Conference, West Lafayette, IN, July 12-15, 2010.

J. P. McHale and S. V. Garimella, “Bubble Nucleation Characteristics in Pool Boiling of a Wetting Liquid on Smooth and Roughened Surfaces,” International Journal of Multiphase Flow, Vol. 35, pp. 249-260, 2010.

T. Harirchian and S. V. Garimella, “A Comprehensive Flow Regime Map for Microchannel Flow Boiling with Quantitative Transition Criteria,” International Journal of Heat and Mass Transfer Vol. 53, pp. 2694-2702, 2010.

J. P. McHale and S. V. Garimella, “Heat Transfer in Trapezoidal Microchannels of Various Aspect Ratios,” International Journal of Heat and Mass Transfer Vol. 53, pp. 365-375, 2010.

B. J. Jones and S. V. Garimella, “Surface Roughness Effects on Flow Boiling in Microchannels,” ASME Thermal Science and Engineering Applications, Vol. 1, No 4, 041007.

T. Harirchian and S. V. Garimella, “The Critical Role of Channel Cross-Sectional Area in Microchannel Flow Boiling Heat Transfer,” International Journal of Multiphase Flow Vol. 35, pp. 904-913, 2009.

S. V. Garimella and T. Harirchian, “Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding,” Keynote Lecture at the 15th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Leuven, Belgium, pp. 101-112, October 7-9, 2009.

B. J. Jones and S. V. Garimella, “Surface Roughness Effects on Boiling Heat Transfer,” International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Thermal Management, Palo Alto, CA, October 6-8, 2009.

T. Harirchian and S. V. Garimella, "A Systematic Investigation of the Effects of Microchannel Width, Depth, and Aspect Ratio on Convective Boiling Heat Transfer and Flow Regimes in Parallel Microchannels," HT2009-88331, ASME Summer Heat Transfer Conference, San Francisco, California, July 19-23, 2009.

B. T. Holcomb, T. Harirchian, and S. V. Garimella, "An Experimental Investigation of Microchannel Size Effects on Flow Boiling with De-Ionized Water," HT2009-88329, ASME Summer Heat Transfer Conference, San Francisco, California, July 19-23, 2009.

B. J. Jones and S. V. Garimella, "Surface Roughness Effects on Flow Boiling in Microchannels," The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK '09), San Francisco, California, July 19-23, 2009.

Z. Yang and S. V. Garimella, "Rarefied Gas Flow in Microtubes at Different Inlet-Outlet Pressure Ratios," Physics of Fluids Vol. 21, 052005 (15 pp), 2009.

B. J. Jones, J. P. McHale and S. V. Garimella, "The Influence of Surface Roughness on Nucleate Pool Boiling Heat Transfer," ASME Journal of Heat Transfer Vol. 131(12), 121009, 2009.

T. Harirchian and S. V. Garimella, "Effects of Channel Dimension, Heat Flux, and Mass Flux on Flow Boiling Regimes in Microchannels," International Journal of Multiphase Flow Vol. 35, pp. 349-362, 2009.

S. S. Bertsch, E. A. Groll, and S. V. Garimella, "A Composite Heat Transfer Correlation for Saturated Flow Boiling in Small Channels," International Journal of Heat and Mass Transfer Vol. 52, pp. 2110-2118, 2009.

T. Harirchian and S. V. Garimella, "Flow Boiling in Silicon Microchannel Heat Sinks," ST-24, 24th IEEE SemiTHERM Symposium, San Jose, CA, March 16-20, 2008.

T. Harirchian and S. V. Garimella, "An Investigation of Flow Boiling Regimes in Microchannels of Diffferent Dimensions by Means of High-Speed Visualization," Procs. ITHERM08, Orlando, Florida, May 28-31, 2008.

J. McHale, B. J. Jones and S. V. Garimella, "Measurements of Bubble Nucleation Characteristics in Pool Boiling of FC-77 on Smooth and Roughened Surfaces," HT2008-56179, ASME Summer Heat Transfer Conference, Jacksonville, Florida, August 10-14, 2008.

T. Harirchian and S. V. Garimella, "Microchannel Size Effects on Local Flow Boiling Heat Transfer to a Dielectric Fluid," International Journal of Heat and Mass Transfer Vol. 51(15-16), pp. 3724-3735, 2008.

T. Harirchian and S. V. Garimella, "Flow Patterns During Convective Boiling in Microchannels," ASME Journal of Heat Transfer Vol. 130, 080909, 2008.

P.-S. Lee and S. V. Garimella, “Saturated Flow Boiling Heat Transfer and Pressure Drop in Silicon Microchannel Arrays,” International Journal of Heat and Mass Transfer, Vol. 51, pp. 780-806, 2008.

D. Liu and S. V. Garimella, “Flow Boiling Heat Transfer in Microchannels,” ASME Journal of Heat Transfer Vol. 129, pp. 1321-1332, 2007.

T. Harirchian and S. V. Garimella, “Microchannel Size Effects on Two-Phase Local Heat Transfer and Pressure Drop in Silicon Microchannel Heat Sinks with a Dielectric Fluid,” IMECE2007-42458, ASME International Mechanical Engineering Congress and Exposition, Seattle, WA, November 2007.

T. Chen and S. V. Garimella, “Flow Boiling Heat Transfer to a Dielectric Coolant in a Microchannel Heat Sink,” IEEE Transactions on Components and Packaging Technologies Vol. 30, pp. 24-31, 2007.

T. Chen and S. V. Garimella, “Measurements and High-Speed Visualizations of Flow Boiling of a Dielectric Fluid in a Silicon Microchannel Heat Sink,” International Journal of Multiphase Flow Vol. 32, pp. 957-971, 2006.

P. S. Lee and S. V. Garimella, “Thermally Developing Flow and Heat Transfer in Rectangular Microchannels of Different Aspect Ratios,” International Journal of Heat and Mass Transfer Vol. 49, pp. 3060-3067, 2006.

S. V. Garimella, V. Singhal and D. Liu, “On-Chip Thermal Management with Microchannel Heat Sinks and Integrated Micropumps,” Proceedings of the IEEE Vol. 94, No. 8, pp. 1534-1548, 2006.

T. Chen and S. V. Garimella, “Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink,” ASME Journal of Electronic Packaging Vol. 128, No. 4. pp. 398-404, 2006.

M. Iyengar and S. V. Garimella, “Design and Optimization of Microchannel Cooling Systems,” Procs. ITHERM06, San Diego, California, pp. 54-62, May 30 - June 2, 2006.

D. Liu and S. V. Garimella, “Analysis and Optimization of the Thermal Performance of Microchannel Heat Sinks,” International Journal of Numerical Methods for Heat and Fluid Flow, Vol. 15, No. 1, pp. 7-26, 2005.

D. Liu, P. S. Lee, and S. V. Garimella, “Nucleate Boiling in Microchannels,” ASME Journal of Heat Transfer, Vol. 127, p. 803, 2005.

D. Liu, P.S. Lee, and S. V. Garimella, “Prediction of the Onset of Nucleate Boiling in Microchannel Flow,” International Journal of Heat and Mass Transfer, Vol. 48, pp. 5134-5149, 2005.

D. Liu, S. V. Garimella and S. T. Wereley, “Infrared Micro-Particle Image Velocimetry Measurement in Silicon-Based Microdevices,” Experiments in Fluids, Vol. 38, pp. 385-392, 2005.

P.S. Lee, S. V. Garimella and D. Liu, “Investigation of Heat Transfer in Rectangular Microchannels,” International Journal of Heat and Mass Transfer, Vol. 48, No. 9, pp. 1688-1704, 2005.

P. S. Lee and S. V. Garimella, “Hot-Spot Thermal Management with Flow Modulation in a Microchannel Heat Sink,” ASME International Mechanical Engineering Congress and Exposition, IMECE2005-79562, Orlando, FL, November 2005.

S. V. Garimella and V. Singhal, “Single-Phase Flow and Heat Transport and Pumping Considerations in Microchannel Heat Sinks,” Heat Transfer Engineering, Vol. 25, No. 1, pp. 15-25, 2004.

V. Singhal, S. V. Garimella and A. Raman, “Microscale Pumping Technologies for Microchannel Cooling Systems,” Applied Mechanics Reviews, Vol. 57, No. 3, pp. 191-221, 2004.

D. Liu and S. V. Garimella, “Investigation of Liquid Flow in Microchannels,” AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 1, pp. 65-72, 2004.

S. V. Garimella and C. B. Sobhan, “Transport in Microchannels - A Critical Review,” Annual Review of Heat Transfer, Vol. 13, pp. 1-50, 2003.

C. B. Sobhan and S. V. Garimella, “A Comparative Analysis of Studies on Heat Transfer and Fluid Flow in Microchannels,” Microscale Thermophysical Engineering, Vol. 5, No. 4, pp. 293-311, 2001.

Electromechanical Microfluidic Actuation & Micropumps    (return to top)

Z. Pan, S. Dash, J. A. Weibel and S. V Garimella, “Assessment of Water Droplet Evaporation Mechanisms on Hydrophobic and Superhydrophobic Substrates,” Langmuir, Vol. 29, pp. 15831-15841, 2013.

M. Dicuangco, S. Dash, J. A. Weibel and S. V. Garimella, “Evaporative Particle Deposition on Superhydrophobic Surfaces,” ASME International Mechanical Engineering Congress & Exposition, IMECE2013-63928, San Diego, CA, November 15-21, 2013.

M. Dicuangco, S. Dash, and S. V. Garimella, “Evaporative Deposition on Superhydrophobic Surfaces,” ASME Journal of Heat Transfer, Vol. 134, 080904, 2013.

S. Dash and S. V. Garimella, “Droplet Evaporation Dynamics on a Superhydrophobic Surface with Negligible Hysteresis,” Langmuir Vol. 29, pp 10785-10795, 2013.

Z. Pan, S. Dash, J.A. Weibel and S.V. Garimella, “Numerical Study of Water Droplet Evaporation on a Superhydrophobic Surface,” ASME Summer Heat Transfer Conference, HT2013-17697, Minneapolis, MN, July 14-19, 2013.

S. Fleuckiger, F. Volle, S. V. Garimella, and R. K. Mongia, “Thermodynamic and Kinetic Investigation of a Chemical Reaction-Based Miniature Heat Pump,” Energy Conversion and Management, Vol. 64, pp. 222-231, 2012.

C. P. Migliaccio and S. V. Garimella, “Evaporative Heat Transfer from an Electrowetted Liquid Ribbon on a Heated Substrate,” International Journal of Heat and Mass Transfer, vol. 57, pp. 73-81, 2013.

S. Dash, M. T. Alt and S. V. Garimella, “Hybrid Surface Design for Robust Superhydrophobicity,” Langmuir, Vol. 28, pp. 9606-9615, 2012.

C. P. Migliaccio and S. V. Garimella, “Dissipative Forces in the Electrowetted Cassie-Wenzel Transition on Hydrophobic Rough Surfaces,” Nanoscale and Microscale Thermophysical Engineering, Vol. 16, pp. 154-164, 2012.

S. Dash, N. Kumari and S. V. Garimella, “Frequency-dependent Transient Response of an Oscillating Electrically Actuated Droplet,” Journal of Micromechanics and Microengineering, Vol. 22, 075004, 2012.

S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Prediction of Droplet Dynamics on an Incline,” International Journal of Heat and Mass Transfer, Vol. 55, pp. 1466-1474, 2011.

S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Droplet Retention on an Incline,” International Journal of Heat and Mass Transfer, Vol. 55, pp. 1457-1465, 2011.

S. Dash, N. Kumari, and S. V. Garimella, “Characterization of Ultrahydrophobic Hierarchical Surfaces Fabricated Using Single-Step Fabrication Methodology,” Journal of Micromechanics and Microengineering, Vol 21, 105012, 2011.

S. R. Annapragada, S. Dash, S. V. Garimella and J. Y. Murthy, “Dynamics of Droplet Motion under Electrowetting Actuation,” Langmuir, Vol. 27, pp. 8198-8204, 2011.

N. Kumari and S. V. Garimella, “Electrowetting-Induced Dewetting Transitions on Superhydrophobic Surfaces,” Langmuir, Vol. 27, pp. 10342-10346, 2011.

N. Kumari and S. V. Garimella, “Characterization of the Heat Transfer Accompanying Electrowetting or Gravity-Induced Droplet Motion,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 4037-4050, 2011.

S. R. Annapragada, J. Y. Murthy and S. V. Garimella, “Droplet Shapes on Superhydrophobic Surfaces under Electrowetting Actuation,” IMECE2011-65370, Proceedings of ASME 2011 International Mechanical Engineering Congress & Exposition, Denver, Colorado, USA, November 11-17, 2011.

S. Dash, N. Kumari, M. Dicuangco and S. V. Garimella, “Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces with Hierarchical Roughness,” InterPACK2011-52046, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, Portland, Oregon, July 6-8, 2011.

S. R. Annapragada, S. Dash, S. V. Garimella and J. Y. Murthy, “Dynamics of Droplet Motion under Electrowetting Actuation,” InterPACK2011-52061, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic System, Portland, Oregon, July 6-8, 2011

S. R. Annapragada, S. V. Garimella, and J. Y. Murthy, “Experimental Characterization of Droplet Motion on Inclined Hydrophobic Surfaces,” ASME/ISHMT Heat and Mass Transfer Conference, Mumbai, India, January 4-6, 2010.

V. Bahadur and S. V. Garimella, “Electrical Actuation-Induced Droplet Transport on Smooth and Superhydrophobic Surfaces,” International Journal of Micro-Nano Scale Transport, Vol. 1(1), pp. 1-26, 2010.

S. R. Annapragada, J. Y. Murthy, and S. V. Garimella, "Forces Acting on Sessile Droplets on Inclined Surfaces," HT2009-88365, ASME Summer Heat Transfer Conference, San Francisco, California, July 19-23, 2009.

B. D. Iverson, L. Cremaschi, and S. V. Garimella, "Effects of Discrete-Electrode Configuration on Traveling-Wave Electrohydrodynamic Pumping," Microfluidics and Nanofluidics Vol. 6, pp. 221-230, 2009.

D. B. Go, T. S. Fisher, and S. V. Garimella, "Direct Simulation of Ionization and Ion Transport for Planar Microscale Ion Generation Devices," Journal of Physics D: Applied Physics Vol. 42, 055203, 2009.

V. Bahadur and S. V. Garimella, "Preventing the Cassie-Wenzel Transition using Surfaces with Noncommunicating Roughness Elements," Langmuir Vol. 25(8), pp. 4815-4820, 2009.

B. D. Iverson and S. V. Garimella, "Experimental Characterization of Induction Electrohydrodynamics for Integrated Microchannel Pumping," Journal of Micromechanics and Microengineering Vol. 19, 055015 (12 pp), 2009.

D. Liu and S. V. Garimella, "Microfluidic Pumping based on Traveling-Wave Dielectrophoresis," Nanoscale and Microscale Thermophysical Engineering Vol. 13, pp. 109-133, 2009.

D. B. Go, T. S. Fisher, and S. V. Garimella, V. Bahadur, "Planar Microscale Ionization Devices in Atmospheric Air with Diamond-Based Electrodes," Plasma Sources Science and Technology Vol. 18, 035004 (10 pp), 2009.

S. V. Garimella and D. Liu, "Microscale Thermal Transport and Electromechanical Microfluidic Actuation," Journal of Enhanced Heat Transfer Vol. 16(3), pp. 237-266, 2009.

D. Liu and S. V. Garimella, "Microfluidic Pumping based on Dielectrophoresis for Thermal Management of Microelectronics," Procs. ITHERM08, Orlando, Florida, May 28-31, 2008.

D. Go, R. A. Maturana, T. S. Fisher, and S. V. Garimella, "Enhancement of External Forced Convection by Ionic Wind," International Journal of Heat and Mass Transfer Vol. 51, pp. 6047-6053, 2008.

V. Bahadur and S. V. Garimella, "Electrowetting-Based Control of Droplet Transition and Morphology on Artificially Microstructured Surfaces," Langmuir Vol. 24, pp. 8338-8345, 2008.

N. Kumari, V. Bahadur, and S. V. Garimella, "Electrical Actuation of Electrically Conducting and Insulating Droplets using AC and DC Voltages," Journal of Micromechanics and Microengineering Vol. 18, 105015, 2008.

N. Kumari, V. Bahadur, and S. V. Garimella, "Electrical Actuation of Dielectric Droplets," Journal of Micromechanics and Microengineering Vol. 18, 085018, 2008.

B. D. Iverson and S. V. Garimella, "Recent Advances in Microscale Pumping Technologies: A Review and Evaluation," Microfluidics and Nanofluidics Vol. 5, pp. 145-174, 2008.

V. Bahadur and S. V. Garimella, "Energy Minimization-Based Analysis of Electrowetting for Microelectronics Cooling Applications," Microelectronics Journal Vol. 39(7), pp. 957-965, 2008.

B. D. Iverson and S. V. Garimella, “Performance Characterization of a Traveling-Wave Electrohydrodynamic Micropump,” IMECE2008-67790, ASME International Mechanical Engineering Congress and Exposition, Boston, Massachusetts, October 31-November 6, 2008.

D. B. Go, R. A. Maturana, R. K. Mongia, S. V. Garimella and T. S. Fisher, “Ionic Winds for Enhanced Cooling in Portable Platforms,” 10th Electronics Packaging Technology Conference, December 9-12, 2008, Singapore.

F. Wang, H. Wang, J. Wang, H.-Y. Wang, P. L. Rummel, S. V. Garimella, and C. Lu, “Microfluidic Delivery of Small Molecules into Mammalian Cells Based on Hydrodynamic Focusing,” Biotechnology and Bioengineering Vol. 100(1), pp 150-158, 2008.

D. Go, S. V. Garimella, T. S. Fisher, and R. K. Mongia “Ionic Winds for Locally Enhanced Cooling,” Journal of Applied Physics Vol. 102, 053302, 2007; also published in October 1, 2007 issue of Virtual Journal of Nanoscale Science & Technology.

V. Bahadur and S. V. Garimella, “Electrowetting-Based Control of Static Droplet States on Rough Surfaces,” Langmuir Vol. 23(9), pp. 4918-4924, 2007.

V. Singhal and S. V. Garimella, “Induction Electrohydrodynamics Micropump for High Heat Flux Cooling,” Sensors and Actuators A Vol. 134, pp. 650-659, 2007.

S. V. Garimella and V. Bahadur, “Electrically Actuated Microscale Flows for Microelectronics Cooling,” Keynote Lecture, The Eighteenth International Symposium on Transport Phenomena, Daejeon, Korea, August 27-30, 2007.

D. B. Go, T. S. Fisher and S. V. Garimella, “External Forced Convection using the Ionic Wind of a Corona Discharge,” ASME-JSME Thermal Engineering Summer Heat Transfer Conference, HT2007-32379, Vancouver, Canada, July 8-12, 2007.

V. Bahadur and S. V. Garimella, “Energy-Based Model for Electrowetting-Induced Droplet Actuation,” Journal of Micromechanics and Microengineering Vol. 16, pp. 1494-1503, 2006.

L. Cremaschi, B. D. Iverson and S. V. Garimella, “Enhanced Electrohydrodynamic Pumping at the Microscale,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-13264, Chicago, IL, November 2006.

D. Go, T. S. Fisher and S. V. Garimella, “Direct Simulation Monte Carlo Analysis of Microscale Field Emission and Ionization of Atmospheric Air,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-14476, Chicago, IL, November 2006.

D. B. Go, S. V. Garimella and T. S. Fisher, “Numerical Simulation of Microscale Ionic Wind for Local Cooling Enhancement,” Procs. ITHERM06, San Diego, California, pp. 45-53, May 30 - June 2, 2006.

M. S. Peterson, W. Zhang, T. S. Fisher, and S. V. Garimella, “Low-Voltage Ionization of Air with Carbon-Based Materials,” Plasma Sources Science and Technology , Vol. 14, pp. 654-660, 2005.

V. Singhal and S. V. Garimella, “A Novel Valveless Micropump with Electrohydrodynamic Enhancement for High Heat Flux Cooling,” IEEE Transactions on Advanced Packaging, Vol. 28, No. 2, pp. 216-230, 2005.

V. Singhal and S. V. Garimella, “Influence of Bulk Fluid Velocity on the Efficiency of Electrohydrodynamic Pumping,” ASME Journal of Fluids Engineering, Vol. 127, pp. 484-494, 2005.

V. Singhal, S. V. Garimella and J. Y. Murthy, “Low Reynolds Number Flow Through Nozzle-Diffuser Elements in Valveless Micropumps,” Sensors and Actuators A, Vol. 113, pp. 226-235, 2004.

W. Zhang, T. S. Fisher and S. V. Garimella, “Simulation of Ion Generation and Breakdown in Atmospheric Air,” Journal of Applied Physics, Vol 96, No. 11, pp. 6066-6072, 2004.

D. J. Schlitz, S. V. Garimella and T. S. Fisher, “Microscale Ion-Driven Air Flow over a Flat Plate,” Procs. HT-FED04, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference, HT-FED04-56470, Charlotte, North Carolina, July 11-15, 2004.

D. J. Schlitz, S. V. Garimella and T. S. Fisher, “Numerical Simulation of Microscale Ion Driven Air Flow,” ASME International Mechanical Engineering Congress and Exposition, IMECE2003-41316, Washington, D.C., November 2003.

V. Singhal, D. Liu and S. V. Garimella, “Analysis of Micropumping Requirements for Microchannel Cooling Systems,” Procs. IPACK03, International Electronic Packaging Technical Conference and Exhibition, IPACK2003-35237, Maui, Hawaii, July 6-11, 2003.

Novel Microscale Diagnostics   (return to top)

A. Ebrahimi, P. Dak, E. Salm, S Dash, S. V. Garimella, R. Bashir, and M. A. Alam, “Nanotextured Superhydrophobic Electrodes Enable Detection of Attomolar-Scale DNA Concentration within a Droplet by Non-Faradaic Impedance Spectroscopy,” Lab on a Chip, Vol. 13, pp. 4248-4256, 2013.

R. S. Patel and S. V. Garimella, “Development of a Particle Tracking-Based Measurement Technique to Map Three-Dimensional Interfaces Between Transparent, Immiscible Fluids,” Procs. ITHERM12, San Diego, California, May 30-June 1, 2012.

P.Chamarthy, S. T. Wereley and S. V. Garimella, “Measurement of the Temperature Non-uniformity in a Microchannel Heat Sink Using Microscale Laser-Induced Fluorescence,” International Journal of Heat and Mass Transfer Vol. 53, pp. 3275-3283, 2010.

B. D. Iverson, J. E. Blendell, and S. V. Garimella, “Thermal Analog to AFM Force-Displacement Measurements for Nanoscale Interfacial Contact Resistance,” Review of Scientific Instruments Vol. 81, 036111, 2010.

P. Chamarthy, S. T. Wereley, and S. V. Garimella, "Non-Intrusive Temperature Measurements Using Microscale Visualization Techniques," Experiments in Fluids Vol. 47, pp. 159-170, 2009.

B. J. Jones, P. S. Lee, and S. V. Garimella, “Infrared Micro-Particle Image Velocimetry Measurements and Predictions of Flow Distribution in a Microchannel Heat Sink,” International Journal of Heat and Mass Transfer, Vol. 51, pp. 1877-1887, 2008.

P. Chamarthy, S. Wereley and S. V. Garimella, “Microscale Laser Induced Fluorescence Method for Non-Intrusive Temperature Measurement,” IMECE2007-41935, ASME International Mechanical Engineering Congress and Exposition, Seattle, WA, November 2007.

D. Liu, S. V. Garimella and S. T. Wereley, “Infrared Micro-Particle Image Velocimetry Measurement in Silicon-Based Microdevices,” Experiments in Fluids, Vol. 38, pp. 385-392, 2005.

P. Chamarthy, S. Wereley and S. V. Garimella, “Simultaneous Measurement of Velocity and Temperature using µPIV,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-14079, Chicago, IL, November 2006.

P. Chamarthy, S. T. Wereley and S. V. Garimella, “Assessment of Alternate Approaches for Temperature Measurement using Brownian Motion,” 6th International Symposium on Particle Image Velocimetry, Pasadena, California, September 21-23, 2005.

 

Thin Film Transport and Heat Pipes    (return to top)

J. A. Weibel and S. V. Garimella, “Recent Advances in Vapor Chamber Transport Characterization for High Heat Flux Applications,” Advances in Heat Transfer, Vol. 45, pp. 209-301, 2013.

K.K. Bodla and S.V. Garimella, “Microstructural Evolution and Transport Properties of Sintered Porous Media,” ASME Summer Heat Transfer Conference, HT2013-17241, Minneapolis, MN, July 14-19, 2013.

K. K. Bodla, J. A. Weibel and S. V. Garimella, “Advances in Fluid and Thermal Transport Property Analysis and Design of Sintered Porous Wick Microstructures,” ASME Journal of Heat Transfer, Vol. 135, 061202, June 2013.

K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Evaporation Analysis of Sintered Wick Microstructures,” International Journal of Heat and Mass Transfer, Vol. 61, pp. 729-741, 2013.

A. S. Kousalya, J. A. Weibel, S. V. Garimella and T. S. Fisher, “Metal Functionalization of Carbon Nanotubes for Enhanced Sintered Powder Wicks,” International Journal of Heat and Mass Transfer, Vol. 59, pp. 372-383, 2013.

K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Optimization Under Uncertainty Applied to Heat Sink Design,” ASME Journal of Heat Transfer, Vol. 135, 011012 (13 pp), 2013.

J. A. Weibel, S. S. Kim, T. S. Fisher, and S. V. Garimella, “Experimental Characterization of Capillary-Fed Carbon Nanotube Vapor Chamber Wicks,” ASME Journal of Heat Transfer, Vol. 135, 021501 (7 pp), 2013.

R. Ranjan, J. Y. Murthy, S. V. Garimella, D. H. Altman, and M. T. North, “Modeling and Design Optimization of Ultra-Thin Vapor Chambers for High Heat Flux Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol 2(9), pp. 1465-1479, 2012.

K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Analysis of Thin-Film Evaporation through Sintered Wick Microstructures”, HT2012-58598, Procs. Summer Heat Transfer Conference, Rio Grande, Puerto Rico, July 8-12, 2012.

D.H. Altman, J.A. Weibel, S.V. Garimella, T.S. Fisher, J.H. Nadler and M. North, “Thermal Ground Plane, Vapor Chamber Heat Spreaders for High Power Packaging Density Electronic Systems,” Electronics Cooling, pp. 20-27, March 2012.

J. A. Weibel and S. V. Garimella, “Visualization of Vapor Formation Regimes during Capillary-Fed Boiling,” International Journal of Heat and Mass Transfer, Vol. 55, pp. 3498-3510, 2012.

J. A. Weibel, A. S. Kousalya, T. S. Fisher and S. V. Garimella, “Characterization and Nanostructured Enhancement of Boiling Incipience in Capillary-Fed, Ultra-Thin Sintered Powder Wicks,” Procs. ITHERM12, San Diego, California, May 30-June 1, 2012.

R. Ranjan, S. V. Garimella, J. Y. Murthy and K. Yazawa, “Assessment of Nanostructured Capillary Wicks for Passive, Two-Phase Heat Transport,” Nanoscale and Microscale Thermophysical Engineering,.Vol. 15, pp. 179-194, 2011.

K. K. Bodla, J. Y. Murthy, and S. V. Garimella, “Direct Simulation of Thermal Transport through Sintered Wick Microstructures,” ASME Journal of Heat Transfer, Vol 134, 012602, 2012.

R. Ranjan and S. V. Garimella, “Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders,” International Journal of Heat and Mass Transfer, Vol. 55, pp. 586-596, 2012.

H. K. Dhavaleswarapu, J. Y. Murthy and S. V. Garimella, “Numerical Investigation of an Evaporating Meniscus in a Channel,” International Journal of Heat and Mass Transfe, Vol. 55, pp. 915-924, 2012.

R. Ranjan, S. V. Garimella and J. Y. Murthy, “Transport in Passive, High Thermal Conductivity Heat Spreaders,” ASME Journal of Heat Transfer, Vol. 133, 080911, 2011.

J. A. Weibel, S. V. Garimella, J. Y. Murthy and D. H. Altman, “Design of Integrated Nanostructured Wicks for High-Performance Vapor Chambers,” IEEE Transactions on Components and Packaging Technologies, Vol. 1, No. 6, pp. 859-867, 2011

C. Migliaccio and S. V. Garimella, “Evaporative Heat and Mass Transfer from the Free Surface of a Liquid Wicked into a Bed of Spheres,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 3440-3447, 2011.

H. Wang, Z. Pan and S. V. Garimella, “Numerical Investigation of Heat and Mass Transfer from an Evaporating Meniscus in a Heated Open Groove,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 3015-3023, 2011.

C. P. Migliaccio, H. K. Dhavaleswarapu and S. V. Garimella, “Temperature Measurements near the Contact Line of an Evaporating Meniscus in a V-Groove,” International Journal of Heat and Mass Transfer, Vol. 54, pp. 1520-1526, 2011.

R. Ranjan, J. Y. Murthy, S. V. Garimella and U. Vadakkan, “A Numerical Model for Transport in Flat Heat Pipes Considering Wick Microstructure Effects,” International Journal of Heat and Mass Transfer Vol. 54, pp. 143-168, 2011.

R. Ranjan, J. Y. Murthy, and S. V. Garimella, “A Microscale Model for Thin-Film Evaporation in Capillary Wick Structures,” International Journal of Heat and Mass Transfer Vol. 54, pp. 169-179, 2011.

R. Ranjan, J.Y. Murthy, S.V. Garimella, and D.H. Altman, “An Experimentally Validated Model for Transport in Thin, High Thermal Conductivity, Low CTE Heat Spreaders,”  The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK ’11), Portland, Oregon, July 6-8, 2011. 

R. Ranjan, A. Patel, S.V. Garimella, J.Y. Murthy, “Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders,”  The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK ’11), Portland, Oregon, July 6-8, 2011. 

J. A. Weibel, S. V. Garimella and M. T. North, “Characterization of Evaporation and Boiling from Sintered-Powder Wicks Fed by Capillary Action,” International Journal of Heat and Mass Transfer, Vol. 53, pp. 4204-4215, 2010.

X. Nie, X. Hu, S. V. Garimella and D. Tang, “Heat and Mass Transfer in the Corner Flow Region of Vertical Microgrooves,” Proceedings of ASME 2010 3rd Joint US-European Fluids Engineering Summer Meeting and 8th International Conference on Nanochannels, Microchannels, and Minichannels FEDSM2010, Montreal, Canada , August 2-4, 2010.

A. Dalal, R. Ranjan, J. Y. Murthy and S. V. Garimella,Heat Transfer during Evaporation of Binary Liquids from Wick Microstructures,” ASME/ISHMT Heat and Mass Transfer Conference, Mumbai, India, January 4-6, 2010.

H. K. Dhavaleswarapu, C. P. Migliaccio, S. V. Garimella  and J. Y. Murthy, “Experimental Investigation of Evaporation from Low-Contact-Angle Sessile Droplets,” Langmuir Vol. 26(2), pp. 880-888, 2010.

R. Ranjan, J. Y. Murthy and S. V. Garimella, “Marangoni Convection and Thin-film Evaporation in Microstructured Wicks for Heat Pipes,” ASME Journal of Heat Transfer, Vol 132, No. 8, 080902, 2010.

M. Hashimoto, H. Kasai, K. Usami, H. Ryoson, K. Yazawa, J. A. Weibel and S. V. Garimella, “Nano-Structured Two-Phase Heat Spreader for Cooling Ultra- High Heat Flux Sources,” 14th International Heat Transfer Conference, Washington, D.C., August 8-13, 2010.

S. Kim, J. A. Weibel, T. S. Fisher and S. V. Garimella, “Thermal Performance of Carbon Nanotube Enhanced Vapor Chamber Wicks,” 14th International Heat Transfer Conference, Washington, D.C., August 8-13, 2010.

J. A. Weibel, S. V. Garimella, J. Y. Murthy and D. H. Altman, “Optimization of Mass Transport in Integrated Nanostructured Wicking Surfaces for the Reduction of Evaporative Thermal Resistance,” Procs. ITHERM10, Reno, Nevada, June 2-5, 2010.

M. Hashimoto, H. Kasai, Y. Ishida, H. Ryoson, K. Yazawa, J. A. Weibel and S. V. Garimella, “A Two-Phase Heat Spreader for Cooling High Heat Flux Sources,” Procs. ITHERM10, Reno, Nevada, June 2-5, 2010.

R. Ranjan, J. Y. Murthy, S. V. Garimella and U. Vadakkan, “A Numerical Model for Transport in Heat Pipes with Different Wick Microstructures,” Procs. ITHERM10, Reno, Nevada, June 2-5, 2010.

R. Ranjan, J. Y. Murthy and S. V. Garimella, “Numerical Study of Evaporation Heat Transfer from the Liquid-Vapor Interface in Wick Microstructures,” IMECE2009-11326, ASME International Mechanical Engineering Congress and Exposition, Lake Buena Vista, Florida, November 13-19, 2009.

H. K. Dhavaleswarapu, C. P. Migliaccio, S. V. Garimella and J. Y. Murthy, "Thin-Film Evaporation in an Evaporating Droplet," ASME Journal of Heat Transfer Vol. 131, Vol. 131, 080906, 2009.

R. Ranjan, J. Y. Murthy, and S. V. Garimella, "Analysis of the Wicking and Thin-film Evaporation Characteristics of Microstructures," ASME Journal of Heat Transfer Vol. 131, 101001, 2009.

H. K. Dhavalewsarapu, S. V. Garimella, and J. Y. Murthy, "Microscale Temperature Measurements near the Triple Line of an Evaporating Thin Liquid Film," ASME Journal of Heat Transfer Vol. 131, 061501, 2009.

R. Ranjan, J. Y. Murthy and S. V. Garimella, "Characterization of Microstructures for Heat Transfer Performance in Passive Cooling Devices," ASME Summer Heat Transfer Conference, Jacksonville, Florida, August 10-14, 2008.

H. Wang, S. V. Garimella and J. Y. Murthy, "Analysis of the Total Heat Transfer in an Evaporating Thin Film," ASME Micro/Nanoscale Heat Transfer International Conference (MNHT08), MNHT2008-52386, Tainan, Taiwan, January 6-9, 2008.

H. Wang, S. V. Garimella and J. Y. Murthy, "An Analytical Solution for the Total Heat Transfer in the Thin-Film Region of an Evaporating Meniscus," International Journal of Heat and Mass Transfer Vol. 51, pp. 6317-6322, 2008.

K. H. Do, S. J. Kim and S. V. Garimella, "A Mathematical Model for Analyzing the Thermal Characteristics of a Flat Micro Heat Pipe with a Grooved Wick," International Journal of Heat and Mass Transfer Vol. 51, pp. 4637-4650, 2008.

H. Wang, J. Y. Murthy and S. V. Garimella, "Transport from a Volatile Meniscus Inside an Open Microtube," International Journal of Heat and Mass Transfer Vol. 51, pp. 3007-3017, 2008.

P. Chamarthy, H. Dhavaleswarapu, S. V. Garimella, J. Y. Murthy, and S. T. Wereley, "Visualization of Convection Patterns Near an Evaporating Meniscus using micro-PIV," Experiments in Fluids Vol. 44, pp. 431-438, 2008.

T. W. Davis and S. V. Garimella, “Thermal Resistance Measurement across a Wick Structure using a Novel Thermosyphon Test Chamber,” Experimental Heat Transfer Vol. 21(2), pp. 143-154, 2008.

H. K. Dhavaleswarapu, P. Chamarthy, S. V. Garimella, and J. Y. Murthy, “Experimental Investigation of Steady Buoyant-Thermocapillary Convection Near an Evaporating Meniscus,” Physics of Fluids Vol. 19, 082103, 2007.

H. K. Dhavaleswarapu, P. Chamarthy, S. V. Garimella, J. Y. Murthy, and S. T. Wereley, “Thermocapillary Convection Near an Evaporating Meniscus,” ASME Journal of Heat Transfer Vol. 129, p. 938, 2007.

B. D. Iverson, T. W. Davis, S. V. Garimella, M. T. North, and S. Kang, “Heat and Mass Transport in Heat Pipe Wick Structures,” AIAA Journal of Thermophysics and Heat Transfer Vol. 21, No. 2, pp. 392-404, 2007.

H. Wang, S. V. Garimella, and J. Y. Murthy, “Characteristics of an Evaporating Thin Film in a Microchannel,” International Journal of Heat and Mass Transfer Vol. 50, pp. 3933-3942, 2007.

H. Wang, J. Y. Murthy and S. V. Garimella, “Transport from a Volatile Meniscus in a Microtube,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-13898, Chicago, IL, November 2006.

U. Vadakkan, S. V. Garimella and J. Y. Murthy, “Transport in Flat Heat Pipes at High Heat Fluxes from Multiple Discrete Sources,” ASME Journal of Heat Transfer Vol. 126, pp. 347-354, 2004.

U. Vadakkan, J. Y. Murthy and S. V. Garimella, “Transient Analysis of Flat Heat Pipes,” ASME Summer Heat Transfer Conference, HT2003-47349, Las Vegas, Nevada, July 21-23, 2003.

S. V. Garimella and C. B. Sobhan, “Recent Advances in the Modeling and Applications of Nonconventional Heat Pipes,” Chapter 4, Advances in Heat Transfer, Vol. 35, pp. 249-308, 2001.

Transport in Bubbles    (return to top)

H. Wang, X. F. Peng, S. V. Garimella, and D. Christopher, “Microbubble Return Phenomena During Subcooled Boiling on Small Wires,” International Journal of Heat and Mass Transfer Vol. 50, Nos. 1-2, pp. 163-172, 2007.

T. Chen, J. F. Klausner, S. V. Garimella and J. N. Chung, “Subcooled Boiling Incipience on a Highly Smooth Microheater,” International Journal of Heat and Mass Transfer Vol. 49, Nos. 23-24, pp. 4399-4406, 2006.

H. Wang, X. F. Peng, D. M. Christopher, and S. V. Garimella, “Jet Flows around Microbubbles in Subcooled Boiling,” ASME Journal of Heat Transfer, Vol. 127, p. 802, 2005.

L. Chen, S. V. Garimella, J. A. Reizes, and E. Leonardi, “The Development of a Bubble Rising in a Viscous Liquid,” Journal of Fluid Mechanics, Vol. 387, pp. 61‑96, 1999.

L. Chen, S. V. Garimella, J. A. Reizes, and E. Leonardi, “Motion of Interacting Gas Bubbles in a Viscous Liquid Including Wall-Effects and Evaporation,” Numerical Heat Transfer, Part A: Applications, Vol. 31, No.6, pp. 629-654, 1997.

Piezoelectric Fans    (return to top)

M. L. Kimber, R. Lonergan and S. V. Garimella, “Experimental Study of Aerodynamic Damping in Arrays of Vibrating Cantilevers,” Journal of Fluids and Structures Vol. 25(8), pp. 1334-1337, 2009.

M. L. Kimber and S. V. Garimella, "Measurement and Prediction of the Cooling Characteristics of a Generalized Vibrating Piezoelectric Fan," International Journal of Heat and Mass Transfer Vol. 52, pp. 4470-4478, 2009.

M. L. Kimber, K. Suzuki, N. Kitsunai, K. Seki and S. V. Garimella, "Pressure and Flow Rate Performance of Piezoelectric Fans," IEEE Transactions on Components and Packaging Technologies, Vol. 32(4), pp. 766-775, 2009.

M. L. Kimber and S. V. Garimella, "Cooling Performance of Arrays of Vibrating Cantilevers," ASME Journal of Heat Transfer Vol. 131, 111401, 2009.

R. A. Bidkar, M. L. Kimber, A. Raman, A. K. Bajaj, and S. V. Garimella, "Nonlinear Aerodynamic Damping of Sharp-Edged Beams at Low Keulegan-Carpenter Numbers," Journal of Fluid Mechanics Vol. 634, pp. 269-289, 2009.

T. Açıkalın and S. V. Garimella, "Analysis and Prediction of the Thermal Performance of Piezoelectrically Actuated Fans,"

R. Lonergan, M. L. Kimber, and S. V. Garimella, "Vibration Coupling in Arrays of Oscillating Piezoelectric Fans," Second International Conference on Thermal Issues in Emerging Technologies Theory and Applications (TheTA) Conference, Cairo, Egypt, December 17-20, 2008.

R. A. Bidkar, M. Kimber, A. Raman, A. K. Bajaj and S. V. Garimella, “Nonlinear Aerodynamic Damping of Beams at High Oscillatory Reynolds Numbers,” 9th International Conference on Flow-Induced Vibrations – FIV2008, Prague, Czech Republic, June 30-July 2, 2008.

M. Kimber, K. Suzuki, N. Kitsunai, K. Seki, and S. V. Garimella, "Quantification of Piezoelectric Fan Flow Rate Performance and Experimental Identification of Installation Effects," Procs. ITHERM08, Orlando, Florida, May 28-31, 2008.

M. Kimber and S. V. Garimella, “Local Heat Transfer Coefficients Under Flows Induced by Vibrating Cantilevers,” ASME Journal of Heat Transfer Vol. 129, p. 933, 2007.

M. Kimber, S. V. Garimella and A. Raman, “Local Heat Transfer Coefficients Induced by Piezoelectrically Actuated Vibrating Cantilevers,” ASME Journal of Heat Transfer Vol. 129, pp. 1168-1176, 2007.

S. M. Wait, S. Basak, S. V. Garimella and A. Raman, “Piezoelectric Fans using Higher Flexural Modes for Electronics Cooling Applications,” IEEE Transactions on Components and Packaging Technologies Vol. 30(1), pp. 119-128, 2007.

T. Acikalin, S. V. Garimella, A. Raman and J. Petroski, “Characterization and Optimization of the Thermal Performance of Miniature Piezoelectric Fans,” International Journal of Heat and Fluid Flow Vol. 28(4), pp. 806-820, 2007.

S. Basak, A. Raman and S. V. Garimella, “Hydrodynamic Loading of Microcantilevers Vibrating in Viscous Fluids,” Journal of Applied Physics Vol. 99, 114906, 2006.

M. Kimber, S. V. Garimella, and A. Raman, “An Experimental Study of Fluidic Coupling Between Multiple Piezoelectric Fans,” Procs. ITHERM06, San Diego, California, pp. 333-340, May 30 - June 2, 2006.

M. Kimber, S. V. Garimella and A. Raman, “Experimental Mapping of Local Heat Transfer Coefficients under Multiple Piezoelectric Fans,” ASME International Mechanical Engineering Congress and Exposition, IMECE2006-13922, Chicago, IL, November 2006.

S. Basak, A. Raman and S. V. Garimella, “Dynamic Response Optimization of Piezoelectrically Excited Thin Resonant Beams,” ASME Journal of Vibration and Acoustics, Vol. 127, pp. 18-27, 2005.

T. Acikalin, I. Sauciuc and S. V. Garimella, “Piezoelectric Actuators for Low-Form-Factor Electronics Cooling,” The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK ’05), IPACK2005-73288, San Francisco, July 17-22, 2005.

T. Acikalin, S. M. Wait, S. V. Garimella and A. Raman, “Experimental Investigation of the Thermal Performance of Piezoelectric Fans,” Heat Transfer Engineering, Vol. 25, No. 1, pp. 4-14, 2004.

T. Acikalin, S. V. Garimella, J. Petroski and A. Raman, “Optimal Design of Miniature Piezoelectric Fans for Cooling Light Emitting Diodes,” Procs. ITHERM04, pp. 663-671, Las Vegas, Nevada, June 2004

S. M. Wait, T. Açikalin, S. V. Garimella and A. Raman, “Piezoelectric Fans for the Thermal Management of Electronics,” Procs. Sixth ISHMT/ASME Heat and Mass Transfer Conference, Kalpakkam, India, Paper No. HMT-2004-C76, pp. 447-452, January 5-7, 2004.

P. Buermann, A. Raman and S. V. Garimella, “Dynamics and Topology Optimization of Piezoelectric Fans,” IEEE Transactions on Components and Packaging Technologies Vol. 25, No. 4, pp. 592-600, 2003.

T. Acikalin, A. Raman and S. V. Garimella, “Two-dimensional Streaming Flows Induced by Resonating Thin Beams,” Journal of the Acoustical Society of America, Vol. 114, No. 4 Pt. 1, pp. 1785-1795, 2003.

Refrigeration    (return to top)

C. R. Bradshaw, E. A. Groll, and S. V. Garimella, “Linear Compressors for Electronics Cooling: Energy Recovery and the Useful Benefits,” International Journal of Refrigeration, Vol. 36, pp. 2007-2013, 2013.

C. R. Bradshaw, E. A. Groll and S. V. Garimella, “Sensitivity Analysis of a Comprehensive Model for a Miniature-Scale Linear Compressor for Electronics Cooling,” International Journal of Refrigeration, Vol. 36, pp. 1998-2006, 2013.

C. R. Bradshaw, E. A. Groll, and S. V. Garimella, “A Miniature-Scale Linear Compressor for Electronics Cooling. In: Proceedings of the Deutscher Klte- und Klimatechnischer Verein (DKV), Aachen, Germany, November 17, No. AA11.2.03, 2011.

C. Bradshaw, E. A. Groll, and S. V. Garimella, “A Comprehensive Model of a Miniature-Scale Linear Compressor for Electronics Cooling,” International Journal of Refrigeration, Vol. 34, pp. 63-73, 2010.

A. A. Sathe, E. A. Groll and S. V. Garimella, “Dynamic Analysis of an Electrostatically Actuated Pumping Device,” International Journal of Refrigeration, Vol. 33, pp. 889-896, 2010.

A. A. Sathe, E. A. Groll, and S. V. Garimella, "Optimization of Electrostatically Actuated Miniature Compressors for Electronics Cooling," International Journal of Refrigeration Vol. 32, pp. 1517-1525, 2009.

S. S. Bertsch, E. A. Groll, and S. V. Garimella, "Effects of Heat Flux, Mass Flux, Vapor Quality, and Saturation Temperature on Flow Boiling Heat Transfer in Microchannels," International Journal of Multiphase Flow Vol. 35, pp, 142-154, 2009.

A. A. Sathe, E. A. Groll, and S. V. Garimella, "Analysis of Diaphragm Compressors for Electronics Cooling," International Compressor Engineering Conference, West Lafayette, IN, July 2008.

S. S. Bertsch, E. A. Groll and S. V. Garimella, "Flow Boiling Heat Transfer in Microchannel Cold Plate Evaporators for Electronics Cooling," International Refrigeration and Air Conditioning Conference, West Lafayette, IN, July 2008.

A. A. Sathe, E. A. Groll, and S. V. Garimella, "Experimental Evaluation of a Miniature Rotary Compressor for Application in Electronics Cooling," International Compressor Engineering Conference, West Lafayette, IN, July 2008.

S. S. Bertsch, E. A. Groll, and S. V. Garimella, "Review and Comparative Analysis of Studies on Saturated Flow Boiling in Small Channels," Nanoscale and Microscale Thermophysical Engineering Vol. 12 (3), pp. 187-227, 2008.

S. S. Bertsch, E. A. Groll and S. V. Garimella, "Refrigerant Flow Boiling Heat Transfer in Parallel Microchannels as a Function of Local Vapor Quality," International Journal of Heat and Mass Transfer Vol. 51, pp. 4775-4787, 2008.

  A. A. Sathe, E. A. Groll, and S. V. Garimella, “Analytical model for an electrostatically actuated miniature diaphragm compressor,” Journal of Micromechanics and Microengineering Vol. 18, 035010, 2008.

L. Cremaschi, E. A. Groll and S. V. Garimella, “Performance Potential and Challenges of Future Refrigeration Systems for Electronics Cooling,” Thermal Challenges in Next-Generation Electronic Systems – THERMES II, Santa Fe, NM, January 7-10, 2007.

S. Bertsch, E. A. Groll and S. V. Garimella, “Experimental Investigation of Local Heat Transfer Coefficient for Refrigerant Flow Boiling in Microchannel Cold Plate Evaporators,” 22nd International Congress on Refrigeration, Beijing, August 21-26, 2007.

S. Trutassanawin, E. A. Groll, S. V. Garimella and L. Cremaschi, “Experimental Investigation of a Miniature-Scale Refrigeration Systems for Electronics Cooling,” IEEE Transactions on Components and Packaging Technologies Vol. 29, pp. 678-687, 2006.

S. Trutassanawin, L. Cremaschi, E. A. Groll and S. V. Garimella, “Performance Analysis of a Miniature-Scale Vapor Compression System For Electronics Cooling: Bread Board Setup,” Paper No. R167, International Refrigeration and Air Conditioning Conference, West Lafayette, IN, July 17-20, 2006.

Jet Impingement    (return to top)

M. J. Rau and S. V. Garimella, “Local Two-Phase Heat Transfer from Arrays of Submerged and Confined Impinging Jets,” International Journal of Heat and Mass Transfer, Vol. 67, pp. 487-498, 2013.

S.N. Joshi, M.J. Rau, E.M. Dede, S.V. Garimella, “An Experimental Study of a Multi-Device Jet Impingement Cooler with Phase Change Using HFE-7100,” ASME Summer Heat Transfer Conference, HT2013-17241, Minneapolis, MN, July 14-19, 2013.

N. Kumari, V. Bahadur, M. Hodes, T. Salamon, P. Kolodner, A. Lyons and S. V. Garimella, “Analysis of Evaporating Mist Flow for Enhanced Convective Heat Transfer,” International Journal of Heat and Mass Transfer Vol. 53, pp. 3346-3356, 2010.

C.-Y. Li and S. V. Garimella, “Prandtl-Number Effects and Generalized Correlations for Confined and Submerged Jet Impingement,” International Journal of Heat and Mass Transfer, Vol. 44, No. 18, pp. 3471-3480, 2001.

S. V. Garimella and V. P. Schroeder, “Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement,” ASME Journal of Electronic Packaging, Vol. 123, No. 3, pp. 165-172, 2001.

S. V. Garimella, “Considerations in the Design of Impingement-Cooled Systems,” Proceedings of the SMTA International 2001, Chicago, Illinois, pp. 144-150, September 30 – October 4, 2001.

H. A. El-Sheikh and S. V. Garimella, “Enhancement of Air Jet Impingement Heat Transfer using Pin-Fin Heat Sinks,” IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 2, pp. 300-308, 2000.

H. A. El-Sheikh and S. V. Garimella, “Heat Transfer from Pin-Fin Heat Sinks under Multiple Impinging Jets,” IEEE Transactions on Advanced Packaging, Vol. 23, No. 1, pp. 113-121, 2000.

L. A. Brignoni and S. V. Garimella, “Effects of Nozzle-Inlet Chamfering on Pressure Drop and Heat Transfer in Confined Air Jet Impingement,” International Journal of Heat and Mass Transfer, Vol. 43, No. 7, pp. 1133-1139, 2000.

L. A. Brignoni and S. V. Garimella, “Heat Transfer from a Finned Surface in Ducted Air Jet Suction and Impingement,” ASME Journal of Electronic Packaging, Vol. 122, No. 3, pp. 282-285, 2000.

S. V. Garimella, “Heat Transfer and Flow Fields in Confined Jet Impingement,” Chapter 7, Annual Review of Heat Transfer, Vol. XI, pp. 413-494, 2000.

G. K. Morris, S. V. Garimella, and J. A. Fitzgerald, “Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model,” ASME Journal of Electronic Packaging, Vol. 121, No. 4, pp. 255-262, 1999.

L. A. Brignoni and S. V. Garimella, “Experimental Optimization of Confined Air Jet Impingement on a Pin Fin Heat Sink,” IEEE Transactions on Components and Packaging Technologies, Vol. 22, No. 3, pp. 399-404, 1999.

L. A. Brignoni and S. V. Garimella, “Performance Characteristics of Confined Impinging Air Jets with Surface Enhancement,” Advances in Electronic Packaging, EEP-Vol 26-2, pp. 2009-2014, 1999.

G. K. Morris and S. V. Garimella, “Orifice and Impingement Flow Fields in Confined Jet Impingement,” ASME Journal of Electronic Packaging, Vol. 120, No. 1, pp. 68-72, 1998.

V. P. Schroeder and S. V. Garimella, “Heat Transfer from a Discrete Heat Source in Confined Air Jet Impingement,” Heat Transfer 1998 (Procs. International Heat Transfer Conference), Vol. 5, pp. 451-456, 1998.

J. A. Fitzgerald and S. V. Garimella, “A Study of the Flow Field of a Confined and Submerged Impinging Jet,” International Journal of Heat and Mass Transfer, Vol. 41, Nos. 8‑9, pp. 1025‑1034, 1998.

G. K. Morris and S. V. Garimella, “Composite Correlations for Convective Heat Transfer from Arrays of Three-Dimensional Obstacles,” International Journal of Heat and Mass Transfer, Vol. 40, No. 2, pp. 493-498, 1997.

J. A. Fitzgerald and S. V. Garimella, “Flow Field Effects on Heat Transfer in Confined Jet Impingement,” ASME Journal of Heat Transfer, Vol. 119, No. 3, pp. 630-632, 1997.

G. K. Morris and S. V. Garimella, “Thermal Wake Downstream of a Three-Dimensional Obstacle,” Experimental Thermal and Fluid Science, Vol. 12, No. 1, pp. 65-74, 1996.

G. K. Morris, S. V. Garimella and R. S. Amano, “Prediction of Jet Impingement Heat Transfer using a Hybrid Wall Treatment with Different Turbulent Prandtl Number Functions,” ASME Journal of Heat Transfer, Vol. 118, No. 3, pp. 562-569, 1996.

S. V. Garimella and B. Nenaydykh, “Nozzle-Geometry Effects in Liquid Jet Impingement Heat Transfer,” International Journal of Heat and Mass Transfer, Vol. 39, No. 14, pp. 2915‑2923, 1996.

G. K. Morris, S. V. Garimella and R. S. Amano, “Prediction of Jet Impingement Heat Transfer using a Hybrid Wall Treatment with Different Turbulent Prandtl Number Functions,” Heat Transfer in Turbulent Flows, ASME HTD-Vol. 318, pp. 1-10, 1995.

G. K. Morris, S. V. Garimella, and D. L. Hlavac, “Wakes From Heated Obstacles in Forced Convection,” Heat Transfer in High Heat-Flux Systems, ASME HTD-Vol. 304-2,   pp. 121-130, 1995.

S. V. Garimella and B. Nenaydykh, “Influence of Nozzle Geometry on Heat Transfer in Submerged and Confined Liquid Jet Impingement,” Cooling and Thermal Design of Electronic Systems, ASME HTD-Vol. 319 (also EEP-Vol. 15), pp. 49-57, 1995.

S. V. Garimella and R. A. Rice, “Confined and Submerged Liquid Jet Impingement Heat Transfer,” ASME Journal of Heat Transfer, Vol. 117, No. 4, pp. 871-877, 1995.

Thermal Contact Resistance    (return to top)

S.H. Taylor and S.V. Garimella, “A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions,” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2013-73283, Burlingame, CA, July 16-18, 2013.

S. Chavalie, Y. Singh, G. Subbarayan, S. Garimella, “Mechanical and Thermal Response of Compliant Thermal Interface Materials under Cyclic Loading,” Procs. ITHERM12, San Diego, California, May 30-June 1, 2012.

S. R. Annapragada, T. Salamon, P. Kolodner, M. Hodes and S. V. Garimella, “Determination of Electrical Contact Resistivity in Thermoelectric Modules (TEMS) from Module-Level Measurements,” IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 2(4), pp. 668-676, 2012.

N. Bajaj, G. Subbarayan and S.V. Garimella, “Topological Design of Channels for Squeeze Flow Optimization of Thermal Interface Materials,” International Journal of Heat and Mass Transfer, Vol. 55, pp. 3560-3575, 2012.

N. Bajaj, G. Subbarayan and S. V. Garimella, “Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface Materials,” International Mechanical Engineering Congress and Exposition, ASME, November 12-18, 2010, Vancouver, British Columbia, Canada.

C. T. Merrill and S. V. Garimella, “Measurements and Prediction of Thermal Contact Resistance across Coated Joints,” Experimental Heat Transfer, Vol. 24, pp. 179-200, 2011.

B. D. Iverson, J. E. Blendell, and S. V. Garimella, “Thermal Analog to AFM Force-Displacement Measurements for Nanoscale Interfacial Contact Resistance,” Review of Scientific Instruments Vol. 81, 036111, 2010.

S. R. Annapragada, T. Salamon, P. Kolodner, M. Hodes and S. V. Garimella, “Prediction of Electrical Contact Resistivity in Thermoelectric Modules (TEMS) from Module-Level Measurements,” Procs. ITHERM10, Reno, Nevada, June 2-5, 2010.

N. Bajaj, G. Subbarayan and S. V. Garimella, “Squeeze Flow Characterization of Particle-Filled Polymeric Materials through Image Correlation,” Procs. ITHERM10, Reno, Nevada, June 2-5, 2010.

S. R. Annapragada, T. Salamon, P. Kolodner, M. Hodes and S. V. Garimella, “Prediction of Electrical Contact Resistivity in Thermoelectric Modules (TEMS) from Module-Level Measurements,” Procs. ITHERM10, Reno, Nevada, June 2-5, 2010.

S. V. Aradhya, S. V. Garimella, and T. S. Fisher, "Electrothermal Bonding of Carbon Nanotubes to Glass," Journal of the Electrochemical Society Vol. 155 (9), K161-K165, 2008.

S. Aradhya, S. V. Garimella and T. S. Fisher, "Electrothermally Bonded of Carbon Nanotubes," Procs. ITHERM08, Orlando, Florida, May 28-31, 2008.

A.F. Black and S. V. Garimella, “Characterization of Rough Engineering Surfaces for Use in Thermal Contact Conductance Modeling,” AIAA Journal of Thermophysics and Heat Transfer Vol. 20, No. 4, pp. 817-824, 2006.

C. T. Merrill and S. V. Garimella, “Analysis and Prediction of Constriction Resistance between Coated Surfaces,” AIAA Journal of Thermophysics and Heat Transfer Vol. 20, pp. 346-348, 2006.

V. Singhal, P. J. Litke, A. F. Black and S. V. Garimella, “An Experimentally Validated Thermo-mechanical Model for the Prediction of Thermal Contact Conductance,” International Journal of Heat and Mass Transfer, Vol. 48, pp. 5446-5459, 2005.

A.F. Black, V. Singhal and S. V. Garimella, “Analysis and Prediction of Constriction Resistance for Contact Between Rough Engineering Surfaces,” AIAA Journal of Thermophysics and Heat Transfer, Vol. 18, No. 1, pp. 30-36, 2004.

V. Singhal, T. Siegmund and S. V. Garimella, “Optimization of Thermal Interface Materials for Electronics Cooling Applications,” IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 2, pp. 244-252, 2004.

C. V. Madhusudana and S. V. Garimella, “Measurement of Thermal Contact Conductance – Steady-State or Transient?” Paper Number TED-AJ03-179, Procs. 6th ASME-JSME Thermal Engineering Joint Conference, Kohala Coast, Hawaii, March 16-20, 2003.

E. L. Olsen, S. V. Garimella and C. V. Madhusudana, “Modeling of Constriction Resistance in Coated Joints,” AIAA Journal of Thermophysics and Heat Transfer, Vol. 16, No. 2, pp. 207-216, 2002.

V. Singhal, S. V. Garimella and T. Siegmund, “Determination of Optimal Filler Volume Fraction for Thermal Interface Materials in Electronics Cooling Applications,” Heat Transfer 2002 (Procs. International Heat Transfer Conference, Grenoble, France), Vol. 3, pp. 9-14, 2002.

V. Singhal and S. V. Garimella, “Prediction of Thermal Contact Conductance by Surface Deformation Analysis,” Procs. International Mechanical Engineering Congress and Exposition, New York, HTD-Vol. 369-7, IMECE2001/HTD-24376, pp. 43-50, 2001.

Heat Transfer Enhancement    (return to top)

B. J. Woodland, A. Krishna, E. A. Groll, J. E. Braun, W. T. Horton, and S. V. Garimella, “Thermodynamic Comparison of Organic Rankine Cycles Employing Liquid-Flooded Expansion or a Solution Circuit,” Applied Thermal Engineering, Vol. 61, pp. 859-865, 2013.

J. P. McHale and S. V. Garimella, “Nucleate Boiling from Smooth and Rough Surfaces--Part 1: Fabrication and Characterization of an Optically Transparent Heater-Sensor Substrate with Controlled Surface Roughness,” Experimental Thermal and Fluid Science, Vol. 44, pp. 456-467, 2013.

J. P. McHale and S. V. Garimella, “Nucleate Boiling from Smooth and Rough Surfaces--Part 2: Analysis of Surface Roughness Effects on Nucleate Boiling,” Experimental Thermal and Fluid Science, Vol. 44, pp. 439-455, 2013.

S. Sarangi, K.K. Bodla, S.V. Garimella, J.Y. Murthy, “Optimization Under Uncertainty of Manifold Microchannel Heat Sinks,” ASME International Mechanical Engineering Congress and Exposition, Houston, Texas, November 9-15, IMECE2012-89261, 2012.

K. K. Bodla, J. Y. Murthy and S. V. Garimella, “Optimization Under Uncertainty for Electronics Cooling Design Applications,” Procs. ITHERM12, San Diego, California, May 30-June 1, 2012.

A. Krishna, E. A. Groll and S. V. Garimella, “Organic Rankine Cycle with Solution Circuit for Ultra Low-Grade Waste Heat Recovery,” International Sorption Heat Pump Conference, Padua, Italy, April 6-8, 2011.

J. P. McHale, S. V. Garimella, T. S. Fisher and G. A. Powell, “Pool Boiling Performance Comparison of Smooth and Sintered Copper Surfaces with and without Carbon Nanotubes,” Nanoscale and Microscale Thermophysical Engineering , Vol. 15, pp. 133-150, 2011.

N. Kumari, V. Bahadur, M. Hodes, T. Salamon, P. Kolodner, A. Lyons and S. V. Garimella, “Analysis of Evaporating Mist Flow for Enhanced Convective Heat Transfer,” International Journal of Heat and Mass Transfer Vol. 53, pp. 3346-3356, 2010.

V. Bahadur, M. Hodes, A. Lyons, S. Krishnan and S. V. Garimella, “Enhanced Cooling in a Sealed Cabinet using an Evaporating-Condensing Dielectric Mist,” Procs. ITHERM08, Orlando, Florida, May 28-31, 2008.

S. V. Garimella and D. J. Schlitz, “Heat Transfer Enhancement in Narrow Channels using Two and Three-Dimensional Mixing Devices,” ASME Journal of Heat Transfer, Vol. 117, No. 3, pp. 590-596, 1995.

S. V. Garimella and D. J. Schlitz, “Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection,” ASME Journal of Electronic Packaging, Vol. 115, No. 4, pp. 410-415, 1993.

S. V. Garimella, K. A. Shollenberger, P. A. Eibeck, and S. White, “Flow and Heat Transfer in Simulated Re-Entry Vehicle Tile Gaps,” AIAA Journal of Thermophysics and Heat Transfer, Vol. 7, No. 4, pp. 644-650, 1993.

S. V. Garimella and D. J. Schlitz, “Influence of Fin Aspect Ratio on Heat Transfer Enhancement,” SAE Transactions, Journal of Materials and Manufacturing, Vol. 101 (5), pp. 467-472, 1992.

S. V. Garimella and P. A. Eibeck, “Onset of Transition in the Flow over a Three-Dimensional Array of Rectangular Obstacles,” ASME Journal of Electronic Packaging, Vol. 114, No. 2, pp. 251-255, 1992.

S. V. Garimella and D. J. Schlitz, “Internal Cooling of Turbine Blades Using Large Roughness Elements,” Fundamental and Applied Heat Transfer Research for Gas Turbine Engines, ASME HTD-Vol. 226, pp. 9-15, 1992.

S. V. Garimella and P. A. Eibeck, “Fluid Dynamic Characteristics of the Flow over an Array of Large Roughness Elements,” Procs. InterSociety Conference on Thermal Phenomena in Electronic Systems, Austin, Texas, pp. 102-109, 1992.

S. V. Garimella, K. A. Shollenberger, P. A. Eibeck, and S. White, “Flow and Heat Transfer in Space Shuttle Tile Gaps,” AIAA Paper No. 92-4061, ASME National Heat Transfer Conference, San Diego, California, August 9-12, 1992.

S. V. Garimella and D. J. Schlitz, “Effect of Fin Aspect Ratio on Heat Transfer Enhancement,” SAE Paper No. 920547, SAE International Congress and Exposition, Detroit, Michigan, 1992.

S. V. Garimella and D. J. Schlitz, “Local Heat Transfer Enhancement Using Vortex Generators in Duct Flows with Obstacle Arrays,” Topics in Heat Transfer - Volume 2, ASME HTD-Vol. 206-2, pp. 95-101, 1992.

S. V. Garimella, “Physical Mechanisms for the Local Heat Transfer Enhancement Caused by Fin‑Like Obstacles in Heat Exchanger Flow Passages,” SAE Paper No. 910196, SAE International Congress and Exposition, Detroit, Michigan, 1991

S. V. Garimella and P. A. Eibeck, “Effect of Spanwise Spacing on the Heat Transfer from an Array of Protruding Elements in Forced Convection,” International Journal of Heat and Mass Transfer, Vol. 34, No. 9, pp. 2431-2433, 1991.

S. V. Garimella and P. A. Eibeck, “Enhancement of Single Phase Convective Heat Transfer from Protruding Elements using Vortex Generators,” International Journal of Heat and Mass Transfer, Vol. 34, No. 9, pp. 2427-2430, 1991.

S. V. Garimella and P. A. Eibeck, “Fluid Dynamic Characteristics of the Flow over an Array of Large Roughness Elements,” ASME Journal of Electronic Packaging, Vol. 113, No. 4, pp. 367-373, 1991.

S. V. Garimella, “Physical Mechanisms for the Local Heat Transfer Enhancement Caused by Fin‑Like Obstacles in Heat Exchanger Flow Passages,” SAE Transactions, Journal of Materials and Manufacturing, Vol. 100 (5), pp. 208-217, 1991.

S. V. Garimella and P. A. Eibeck, “Heat Transfer Characteristics of an Array of Protruding Elements in Single Phase Forced Convection,” International Journal of Heat and Mass Transfer, Vol. 33, No. 12, pp. 2659-2669, 1990.

S. V. Garimella and R. N. Christensen, “Transient Condensation in the Presence of Noncondensables at a Flat, Vertical Wall,” Nuclear Technology, Vol. 89, pp. 388‑398, 1990.

.S. V. Garimella and P. A. Eibeck, “Onset of Transition in the Flow over a Three‑Dimensional Array of Rectangular Obstacles,” Thermal Modeling and Design of Electronic Systems and Devices, ASME HTD - Vol. 153, pp. 1‑6, 1990.

Phase Change Energy Storage and Metal Foams    (return to top)

R. Ranjan, J. Y. Murthy and S. V. Garimella, “Bubble Dynamics during Capillary-Fed Nucleate Boiling in Porous Media,” Procs. ITHERM12, San Diego, California, May 30-June 1, 2012.

J. A. Weibel, S. S. Kim, T. S. Fisher, and S. V. Garimella, “Carbon Nanotube Coatings for Enhanced Capillary-Fed Boiling from Porous Microstructures,” Nanoscale and Microscale Thermophysical Engineering Vol. 16 (1) pp. 1-17, 2012.

K. K. Bodla, J. Y. Murthy, and S. V. Garimella, “Microtomography-Based Simulation of Transport through Open-Cell Metal Foams,” Numerical Heat Transfer Vol. 58, pp. 527-554, 2010.

K. K. Bodla, J. Y. Murthy, and S. V. Garimella, “Resistance Network-Based Thermal Conductivity Model for Metal Foams,” Computational Materials Science Vol. 50, pp. 622-632, 2010.

F. Volle, S. V. Garimella and M. A. Juds, "Thermal Management of a Soft Starter: Transient Thermal Impedance Model and Performance Enhancements using Phase Change Materials," IEEE Transactions on Power Electronics, Vol. 25(6), pp. 1395-1405, 2010.

F. Volle, S. V. Garimella and M. A. Juds, “A Thermal Quadrupole-Based Model for Heat Diffusion in a Multilayered System: Application to Determination of Transient Performance of a Medium-Voltage Soft Starter,” IMECE2008-67470, ASME International Mechanical Engineering Congress and Exposition, Boston, Massachusetts, October 31-November 6, 2008.

K. K. Bodla, J. Y. Murthy and S. V. Garimella “XMT-Based Direct Simulation of Flow and Heat Transfer through Open-cell Aluminum Foams,” Procs. ITHERM10, Reno, Nevada, June 2-5, 2010.

S. R. Annapragada, J. Y. Murthy, S. V. Garimella, "Permeability and Thermal Transport in Compressed Open-Celled Foams," HT2008-56375, ASME Summer Heat Transfer Conference, Jacksonville, Florida, August 10-14, 2008.

S. R. Annapragada, S. V. Garimella, and J. Y. Murthy, "Permeability and Thermal Transport in Compressed Open-Celled Foams," Numerical Heat Transfer, Part B: Fundamentals Vol. 54, pp, 1-22, 2008.

S. Krishnan, S. V. Garimella, and J. Y. Murthy, “Simulation of Thermal Transport in Open-Cell Metal Foams: Effect of Periodic Unit Cell Structure,” ASME Journal of Heat Transfer Vol. 130, 024503: 1-5, 2008.

S. Krishnan, J. Y. Murthy, and S. V. Garimella, “Analysis of Solid-Liquid Phase Change under Pulsed Heating,” ASME Journal of Heat Transfer Vol. 129, pp. 395-400, 2007.

S. Krishnan, J. Y. Murthy, and S. V. Garimella, “Direct Simulation of Transport in Open-Cell Metal Foams,” ASME Journal of Heat Transer Vol. 128, pp. 793-799, 2006.

S. Krishnan, J. Y. Murthy and S. V. Garimella, “A Two-Temperature Model for Solid/Liquid Phase Change in Metal Foams,” ASME Journal of Heat Transfer, Vol. 127, pp. 995-1004, 2005.

S. Krishnan, S. V. Garimella, and S. S. Kang, “A Novel Hybrid Heat Sink using Phase Change Materials for Transient Thermal Management of Electronics,” IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 2, pp. 281-289, 2005.

S. Krishnan and S. V. Garimella, “Analysis of a Phase Change Energy Storage System for Pulsed Power Dissipation,” IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 1, pp 191-199, 2004.

S. Krishnan and S. V. Garimella, “Thermal Management of Transient Power Spikes in Electronics - Phase Change Energy Storage or Copper Heat Sinks?” ASME Journal of Electronic Packaging, Vol. 126, pp. 308-316, 2004.

S. Krishnan, J. Y. Murthy and S. V. Garimella, “A Two-Temperature Model for the Analysis of Passive Thermal Control Systems,” ASME Journal of Heat Transfer, Vol. 126, pp. 628-637, 2004.

S. Krishnan, S. V. Garimella and J. Y. Murthy, “Metal Foams for Passive Control of Thermal Systems,” in Emerging Topics in Heat and Mass Transfer in Porous Media - from Bioengineering and Microelectronics to Nanotechnology, P. Vadasz (Ed.), Springer.

S. Krishnan, S. V. Garimella and J. Y. Murthy, “Thermal Characterization of Open-Celled Metal Foams by Direct Simulation,” in Cellular and Porous Materials: Thermal Properties Simulation and Prediction, Ochsner, Murch and de Lemos (Eds), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Solidification    (return to top)

D. Sun, S. R. Annapragada and S. V. Garimella, "Experimental and Numerical Study of Melting of Particle-Laden Materials in a Cylinder," International Journal of Heat and Mass Transfer Vol. 52, pp. 2966-2978, 2009.

D. Sun and S. V. Garimella, “Numerical and Experimental Investigation of Solidification Shrinkage,” Numerical Heat Transfer Vol. 52, pp. 145-162, 2007.

S. R. Annapragada, D. Sun, and S. V. Garimella, “Analysis and Suppression of Base Separation in the Casting of a Cylindrical Ingot,” Heat Transfer Engineering Vol. 29(4), pp. 385-394, 2008.

D. Sun, S.R. Annapragada, S.V. Garimella, and S.K. Singh, “Analysis of Gap Formation in the Casting of Energetic Materials,” Numerical Heat Transfer, Part A Vol. 51, pp. 415-444, 2007.

S. R. Annapragada, D. Sun and S. V. Garimella, “Prediction of Effective Thermo-Mechanical Properties of Particulate Composites,” Computational Materials Science Vol. 40(2), pp. 255-256, 2007.

B. Jones, D. Sun, S. Krishnan, and S. V. Garimella, “Experimental and Numerical Investigation of Melting in a Cylinder,” International Journal of Heat and Mass Transfer Vol. 49, pp. 2724-2738, 2006.

D. Sun, S. V. Garimella, and A. Mukhopadhyay, “Analysis of Shrinkage in the Solidification of Particle-Laden Melts,” TMS Letters, Vol. 2, No. 4, pp. 111-112, 2005.

D. Sun, S. V. Garimella, S. Singh, and N. Naik, “Numerical and Experimental Investigation of the Melt Casting of Explosives,” Propellants, Explosives and Pyrotechnics, Vol. 30, No. 5, pp. 369-380, 2005.

D. Sun, R. S. Annapragada, S. V. Garimella and S. Singh, “Solidification Heat Transfer and Base Separation Analysis in the Casting of an Energetic Material in a Projectile,” ASME International Mechanical Engineering Congress and Exposition, IMECE2005-80432, Orlando, FL, November 2005.

C. Y. Li, S. V. Garimella and J.E. Simpson, “A Fixed-Grid Front-Tracking Algorithm for Solidification Problems. Part I - Method and Validation,” Numerical Heat Transfer - Part B, Vol. 43, pp. 117-141, 2003.

C. Y. Li, S. V. Garimella and J.E. Simpson, “A Fixed-Grid Front-Tracking Algorithm for Solidification Problems. Part II - Directional Solidification with Melt Convection,” Numerical Heat Transfer - Part B, Vol. 43, pp. 143-166, 2003.

B. Moussa, J. E. Simpson and S. V. Garimella, “Concentration Fields in the Solidification Processing of Metal Matrix Composites,” International Journal of Heat and Mass Transfer, Vol. 45, No. 21, pp. 4251-4266, 2002.

J. E. Simpson, S. V. Garimella and H. C. de Groh III, “An Experimental and Numerical Investigation of the Bridgman Growth of a Transparent Material,” AIAA Journal of Thermophysics and Heat Transfer, Vol. 16, No. 3, pp. 324-335, 2002.

J. E. Simpson, S. V. Garimella, H. C. de Groh III and R. Abbaschian, “Bridgman Crystal Growth of an Alloy with Thermosolutal Convection under Microgravity Conditions,” ASME Journal of Heat Transfer Vol. 123, No. 5, pp. 990-998, 2001.

S. V. Garimella and J. E. Simpson, “Effect of Thermosolutal Convection on Directional Solidification,” Sadhana (Academy Proceedings in Engineering Sciences), Indian Academy of Sciences, Vol. 26, pp. 121-138, 2001.

J. E. Simpson and S. V. Garimella, “The Influence of Gravity Levels on the Horizontal Bridgman Crystal Growth of an Alloy,” International Journal of Heat and Mass Transfer, Vol. 43, No. 11, pp. 1905-1923, 2000.

J. E. Simpson, S. V. Garimella, and H. C. de Groh III, “An Experimental and Computational Study of the Bridgman Growth of an Alloy,” Modelling of Casting, Welding and Advanced Solidification Processes IX, Sahm, Hansen and Conley (Eds.), Shaker-Verlag, Aachen, pp. 672-679, August 2000.

M. M. Guslick, J. E. Simpson, and S. V. Garimella, “Fiber-Spacing Effects in the Solidification Processing of Metal Matrix Composites,” Numerical Heat Transfer A, Vol. 35, No. 6, pp. 587-607, 1999.

S. V. Garimella and J. E. Simpson, “Numerical Treatment of Moving Interfaces in Phase-Change Processes,” in Fluid Dynamics at Interfaces, W. Shyy and R. Narayanan (eds.), Cambridge University Press, pp. 278-293, 1999.

G. Labonia, V. Timchenko, J. E. Simpson, S. V. Garimella, E. Leonardi, and G. de Vahl Davis, “Reconstruction and Advection of a Moving Interface in Three Dimensions on a Fixed Grid,” Numerical Heat Transfer, Vol. 34, No. 2, pp. 121-138, 1998.

S. V. Garimella and J. E. Simpson, “Interface Propagation in the Processing of Metal Matrix Composites,” Microscale Thermophysical Engineering, Vol. 2, No. 3, pp. 173-188, 1998.

J. E. Simpson and S. V. Garimella, “An Investigation of the Solutal, Thermal and Flow Fields in Unidirectional Alloy Solidification,” International Journal of Heat and Mass Transfer, Vol. 41, No. 16, pp. 2485-2502, 1998.

S. V. Garimella, J. P. McNulty, and L. Z. Schlitz, “Formation and Suppression of Channels During Upward Solidification of a Binary Mixture,” Metallurgical and Materials Transactions A, Vol. 26A, pp. 971-981, 1995.

L. Z. Schlitz and S. V. Garimella, “Nonlinear Interface Stability Analysis of Alloy Solidification Including Effects of Surface Energy,” Journal of Applied Physics, Vol. 76, No. 8, pp. 4863-4871, 1994.

L. Zhang and S. V. Garimella, “A Modified Mullins-Sekerka Stability Analysis Including Surface Energy Effects,” Journal of Applied Physics, Vol. 74, No. 4, pp. 2494-2500, 1993.

Plasmas    (return to top)

L. Z. Schlitz, S. V. Garimella, and S. H. Chan, “Gas Dynamics and Electromagnetic Processes in High-Current Arc Plasmas - Part I: Model Formulation and Steady-State Solutions,” Journal of Applied Physics, Vol. 85, No. 5, pp. 2540-2546, 1999.

L. Z. Schlitz, S. V. Garimella, and S. H. Chan, “Gas Dynamics and Electromagnetic Processes in High-Current Arc Plasmas - Part II: Effects of External Magnetic Fields and Gassing Materials,” Journal of Applied Physics, Vol. 85, No. 5, pp. 2547-2555, 1999.

Solar Thermal Energy Storage    (return to top)

S. M. Flueckiger and S. V. Garimella, “Latent-Heat Augmentation of Thermocline Energy Storage for Concentrating Solar Power – A System-Level Assessment,” Applied Energy, Vol. 116, pp. 278-287, 2014.

S. M. Flueckiger, B. D. Iverson, and S. V. Garimella, “Economic Optimization of a Concentrating Solar Power Plant with Molten-salt Thermocline Storage,” ASME Journal of Solar Energy Engineering, Vol. 136, 011016, 2014.

S. Flueckiger, B.D. Iverson, S.V. Garimella and J. Pacheco, “System-Level Simulation of a Solar Power Tower Plant with Thermocline Thermal Energy Storage,” Applied Energy, Vol. 113, pp. 86-96, 2014.

S.M. Flueckiger, B.D. Iverson and S.V. Garimella, “Simulation of a Concentrating Solar Power Plant with Molten-Salt Thermocline Storage for Optimized Annual Performance,” ASME International Conference on Energy Sustainability, ES2013-19297, Minneapolis, MN, July 14-19, 2013.

S. M. Flueckiger, Z. Yang, and S. V. Garimella, “Design of Molten-Salt Thermocline Tanks for Solar Thermal Energy Storage,” Heat Transfer Engineering, Vol. 34, No. 10, pp. 787-800, 2013.

Z. Yang and S. V. Garimella, “Cyclic Operation of Molten-Salt Thermal Energy Storage in Thermoclines for Solar Power Plants,” Applied Energy, Vol. 103, pp. 256-265, 2013.

B. J. Woodland, A. Krishna, E. A. Groll, J. E. Braun, W. T. Horton and S. V. Garimella, “Thermodynamic Comparison of Organic Rankine Cycle with Liquid Flooded Expansion and with Solution Circuit,” Heat Powered Cycles Conference 2012, Elkmaar, Netherlands, Sept 10-12, 2012.

S. Flueckiger, Z. Yang and S. V. Garimella, “Thermomechanical Simulation of the Solar One Thermocline Storage Tank,” ASME Journal of Solar Energy Engineering, Vol. 134, 041014, 2012.

S. M. Flueckiger, S. V. Garimella and E. A. Groll, “Numerical Study of Supercritical CO2 Convective Heat Transfer in Advanced Brayton Cycles for Concentrated Solar Power,” ES2012-91396, Procs. 6th International Conference on Energy Sustainability, ASME, San Diego, CA, July 23-26, 2012.

B. Gebreslassie, E. A. Groll and S. V. Garimella, “Multi-objective Optimization of Sustainable Single-Effect Water/Lithium Bromide Absorption Cycle,” Renewable Energy, Vol. 46, pp. 100-110, 2012.

S. Flueckiger and S. V. Garimella, “Second-Law Analysis of Molten-Salt Thermal Energy Storage in Thermoclines,” Solar Energy, Vol. 86, No. 5, pp. 1621-1631, 2012.

R. A. Leffler, C. R. Bradshaw, E. A. Groll and S. V. Garimella, “Alternative Heat Rejection Methods for Power Plants,” Applied Energy, Vol. 92, pp. 17-25, 2012.

B. H. Gebreslassie, E. A. Groll, and S. V. Garimella, “Optimization of Solar-Assisted Single-Effect Water/Lithium Bromide Absorption Chiller,” ASME International Mechanical Engineering Congress and Exposition, Denver, Colorado, November 11-17, 2011.

S. Flueckiger, Z. Yang and S.V. Garimella, “Thermocline Energy Storage in the Solar One Power Plant: An Experimentally Validated Thermomechanical Investigation,” ES2011-54578, Proceedings of the ASME 2011 5th International Conference on Energy Sustainability, Washington D.C., August 7-10, 2011.

Solar Thermocline Storage Systems: Preliminary Design Study. Electric Power Research Institute, Palo Alto, CA: 2010. 1019581.

S. Flueckiger, Z. Yang and S. V. Garimella, “An Integrated Thermal and Mechanical Investigation of Molten-Salt Thermocline Energy Storage,” Applied Energy Vol. 88, pp. 2098-2105, 2011.

Z. Yang and S. V. Garimella, “Molten-Salt Thermal Energy Storage in Thermoclines under Different Environmental Boundary Conditions,” Applied Energy Vol. 87, pp. 3322-3329, 2010.

Z. Yang and S. V. Garimella, “Thermal Analysis of Solar Thermal Energy Storage in a Molten-Salt Thermocline,” Solar Energy Vol. 84, pp. 974-985, 2010.

Z. Yang and S. V. Garimella, “Melting of Phase Change Materials with Volume Change in Metal Foams,” ASME Journal of Heat Transfer Vol. 132, 062301(1-11), 2010.

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