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Thermal Materials R&D
Embedded Phase Change Material (PCM) Cooling
Radiative Cooling Paint
Foil-Based Transient Liquid Phase Bonding Systems
PCM: Optimizing Material Properties: Enthalpy and Conductivity
Passive Thermal Management using Phase Change Materials
Development of High Conductivity Printed Circuit Board Materials
High-Performance, Low-Cost Thermoelectric Cooling Materials
Optimized Porous-Media Based Heat Exchanger Surface
Analysis of Transport in Porous Microstructures
Aluminum Nitride MEMS FBAR with Integrated Microfluidic Channel
3D Analysis of Real Porous Media
Carbon Nanotube Electrical Interfaces for Thermoelectrics
Low-Temperature Synthesis and Bonding of CNT Thermal Interfaces
Phase Change Energy Storage
Transport in Porous Foams
Melt front of Parafin