Cooling Technologies Research Center  

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Thermal Materials R&D

PCM: Optimizing Material Properties: Enthalpy and Conductivity
Foil-Based Transient Liquid Phase Bonding Systems
Passive Thermal Management using Phase Change Materials
Development of High Conductivity Printed Circuit Board Materials
High-Performance, Low-Cost Thermoelectric Cooling Materials
Optimized Porous-Media Based Heat Exchanger Surface
Analysis of Transport in Porous Microstructures
Aluminum Nitride MEMS FBAR with Integrated Microfluidic Channel

3D Analysis of Real Porous Media


Carbon Nanotube Electrical Interfaces for Thermoelectrics
Low-Temperature Synthesis and Bonding of CNT Thermal Interfaces  
Phase Change Energy Storage

Transport in Porous Foams


Phase change energy storage
Melt front of Parafin

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