Purdue University - Cadence University Program
CadenceTM University Program Member
Cadence use at Purdue University
Currently, the Custom IC bundle, the Custom IC bundle, the Verification Bundle, and the SPB (PCB) bundle are all actively used in the School of Electrical and Computer Engineering at Purdue University. For more information on our use of Cadence tools, the groups and courses using the tools, and for value added items, please see the following links.
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Adaptive Radio Electronics and Sensors – Prof. Dimitrios Peroulis – Custom IC bundle.
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Brain-Computer Interface Laboratory - Prof. Pedro Irazoqui - Custom IC bundle
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CAD for VLSI – Prof. Cheng-Kok Koh – Custom IC bundle
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High Energy Physics (Mu2e project) – Prof. Matthew Jones – Custom IC bundle, SPB (PCB) bundle.
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HybridMEMS lab – Dr. Dana Weinstein – Custom IC bundle.
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Nanoelectronics Research Laboratory – Prof. Kaushik Roy – Custom IC bundle, Digital IC bundle.
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Integrated Circuits and Devices Laboratory – Prof. Sumeet Gupta – Custom IC bundle, Digital IC bundle.
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Neuromorphic Fabrics – Prof. Eugenio Culurciello, Prof. Suresh Jagannathan, Prof. Anand Raghunathan, Prof. Kaushik Roy – Custom IC bundle, Digital IC bundle, Verification bundle.
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Radio Frequency Integrated Circuits – Prof. Saeed Mohammadi – Custom IC bundle.
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Sensing, Processing, Analytics & Radio Communication (SPARC) Lab – Prof. Shreyas Sen – Custom IC bundle
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System-on-chip Extension Technologies – Dr. Matthew Swabey, Dr. Mark C. Johnson - Custom IC bundle, Digital IC bundle, Verification bundle.
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VLSI Systems-on-Chip – Prof. Anand Raghunathan – Digital IC bundle, Verification bundle.
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Wireless Sensing Circuits and Systems - Prof. Byunghoo Jung – Custom IC bundle.
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ECE337 ASIC Design Lab – Custom IC bundle, Digital IC bundle.
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ECE559 CMOS VLSI Design – Custom IC bundle
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ECE455 Integrated Circuit Engineering – Custom IC bundle
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ECE456 Digital Integrated Circuit Analysis and Design – Custom IC bundle
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ECE595 CMOS Analog IC Design – Custom IC bundle
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ECE595 RF MEMS for Intelligent Communications Systems – Custom IC bundle
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ECE695 Radio Frequency Integrated Circuits – Custom IC bundle.
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ECE695 System-on-Chip Design Custom IC bundle.
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EPICS (Engineering Projects in Community Service) - SPB (PCB) bundle
Value Added Items for Deep Sub-Micron and Custom IC
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Schematic tutorial (based on NCSU Design Kit)
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Inverter layout tutorial (based on NCSU Design Kit)
We have also developed a variety of other lab exercises and tutorials, but links are not included because those materials include substantial information about products not produced by Cadence Design Systems, Inc. Contact Mark C. Johnson (mcjohnso@purdue.edu) for more information. Topics include analog simulation, VHDL simulation, and an ASIC design flow from VHDL to layout and timing verification.
Disclaimer
“Information is provided „as is‟ without warranty of any kind. No statement is made and no attempt has been made to examine the information, either with respect to operability, origin, authorship, or otherwise. Please use this information at your own risk. We recommend using it on a copy of your data to be sure you understand what it does under your conditions. Keep your master intact until you are satisfied with the use of this information within your environment.”
Cadence is a registered trademark of Cadence Design Systems, Inc., 2655 Seely Avenue, San Jose, CA 95134.
Contact Information:
Mark C. Johnson (mcjohnso@purdue.edu)
Last modified: June 4, 2021