Experimental Characterization of Thermal Transport in Cu–Diamond Microbumps
Experimental Characterization of Thermal Transport in Cu–Diamond Microbumps
| Event Date: | May 26, 2026 |
|---|---|
| Authors: | K. Wang et al. |
| Journal: | IEEE 76th Electronic Components and Technology Conference (ECTC) 2026. |
K. Wang et al., IEEE 76th Electronic Components and Technology Conference (ECTC) 2026.