Design of a Metrology Tool to Evaluate Degradation of Thermal Greases with Dynamic Warpage

Design of a Metrology Tool to Evaluate Degradation of Thermal Greases with Dynamic Warpage

Event Date:
May 26, 2026
Authors:
S. Bimali, R. Kulkarni, and A. Marconnet
Journal:
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
S. Bimali, R. Kulkarni, and A. Marconnet, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, 26 - 29 May 2026.