Design of a Metrology Tool to Evaluate Degradation of Thermal Greases with Dynamic Warpage
Design of a Metrology Tool to Evaluate Degradation of Thermal Greases with Dynamic Warpage
| Event Date: | May 26, 2026 |
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| Authors: | S. Bimali, R. Kulkarni, and A. Marconnet |
| Journal: | IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
S. Bimali, R. Kulkarni, and A. Marconnet, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, 26 - 29 May 2026.