Attendees
- 2430 Group
- AI Infra
- Air Liquide LLC
- Alvarez & Marsal
- A&M
- AMD
- Amkor Technology
- Applied Materials
- American Public University
- Applied Research Institute
- Applied Research Lab for Intelligence and Security, University of Maryland
- ARLIS
- Arm, Inc.
- ASM
- ASML
- Association of American Universities
- Aviation Week
- Avoq
- Babes Bolyai University
- Belgian Embassy
- Bloomberg News
- Boeing
- Bose McKinney & Evans
- Bose Public Affairs Group
- Business Council of Mexico Representation to the United States
- Cadence Design Systems
- Cardinal Crest Solutions
- Carsem Inc., Advanced Semiconductor Packaging
- Center for Strategic International Studies
- CHIPS Program Office
- Cisco
- Clayco
- Collins Aerospace
- Council of Americas
- CSIS
- Cyber Policy Center, Stanford University
- Dassault Systèmes
- Deepcharge
- Delegation of the European Union to the United States
- Digital Twin Consortium
- Direction Générale du Trésor
- DiscoverE
- Dominican Hardware Community
- DuPont
- Efabless Corporation
- Embassy of Brazil to the United States
- Embassy of France to the United States
- Embassy of India to the United States
- Embassy of Japan to the United States
- Embassy of the Netherlands to the United States
- Embassy of Panama to the United States
- Embassy of the Republic of Korea
- Everspin Technologies, Inc.
- Evonik Corporation
- FTI Consulting
- George Washington University
- Georgetown University
- Global Business Development Team
- Global Growth Strategy
- GlobalFoundries
- Guidehouse
- Holland & Knight
- Howard University
- IBM Research
- IEEE-USA
- imec
- Indiana University
- Infinera Corporation
- Innovative Federal Strategies
- Intel
- International Federation of Journalists
- International Trade Administration
- Javelin
- JLW
- Kearney
- Krach Institute for Tech Diplomacy at Purdue
- L3 Harris Technologies
- Lam Research
- Lewis-Burke Associates, LLC
- LIFT Consulting
- Lockheed Martin
- LTSC
- Marvell
- MediaTek
- MEM
- Microchip Technology
- Microsoft
- Missouri University of Science and Technology
- MIT
- Mosaic Microsystems
- mySilicon Compass LLC
- National Cheng Kung University
- National Chung Hsing University
- National Institute of Standards and Technology
- National Science Foundation
- National Taiwan University
- National University of Engineering
- National University of Singapore
- NCG
- NDIA Emerging Technologies Institute
- Nexperia USA
- NineTwelve Solutions
- NIST
- NSWC Crane
- NVIDIA
- Office of Environmental Policy
- Office of the U.S. Trade Representative
- Plug and Play
- Politico
- Pontificia Universidad Católica Madre y Maestra (PUCMM)
- Purdue Applied Research Institute
- Purdue For Life Foundation
- Purdue Research Foundation
- Purdue University
- Qualcomm Technologies, Inc.
- Rationalwave Capital Partners
- Raytheon
- Royal Thai Embassy
- Samsung Electronics America
- Sandia National Labs
- SEI, Inc.
- SEMI
- Semiconductor Industry Association
- Semiconductor Research Corporation
- Siemens
- SiFive
- SK hynix
- SkyWater Technology
- Stanford University
- Synopsys
- Taipei Economic and Cultural Office in Chicago
- TalentCraft
- Technology Policy
- TEL Technology Center, America, LLC
- Teradyne
- Texas Instruments
- The New York Times
- The University of Texas at Austin
- Tokyo Electron
- TSMC
- University of California, San Diego
- Universidad Latina de Costa Rica
- Universidad Nacional de Ingeniería
- Universidad Tecnologica de Panama
- University of Dayton
- University of Maryland
- University of Nebraska-Lincoln
- University of Notre Dame
- University of Pennsylvania
- U.S. Department of Commerce
- U.S. Department of Energy
- U.S. Department of State
- WattsButler LLC
- Western Digital
